MAEDA Masakatsu 前田将克

… Alternative Names

前田将克マエダマサカツ

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Researcher Number	00263327
Other IDs
Affiliation (Current)	2025: 日本大学, 生産工学部, 教授
Affiliation (based on the past Project Information) *help	2025: 日本大学, 生産工学部, 教授 2020 – 2022: 日本大学, 生産工学部, 教授 2014 – 2019: 日本大学, 生産工学部, 准教授 2013: 大阪大学, 接合科学研究所, 講師 2011 – 2013: 大阪大学, 接合科学研究所, 助教 … More 2007 – 2010: Osaka University, Center for Advanced Science and Innovation, Research Associate 2008: 大阪大学, 先端科学イノベーション, 助教 2006: 大阪大学, 先端化学イノベーションセンター, 助手 2004 – 2006: Osaka University, Joining and Welding Research Institute, Assistant Professor, 先端科学イノベーションセンター, 助手 2001 – 2003: 大阪大学, 接合科学研究所, 助手 1997 – 1998: 大阪大学, 接合科学研究所, 助手 1995: 大阪大学, 溶接工学研究所, 助手 Less
Review Section/Research Field	Principal Investigator Material processing/treatments / Composite materials/Surface and interface engineering / Basic Section 26050:Material processing and microstructure control-related / Material processing/treatments Except Principal Investigator Material processing/treatments / Material processing/treatments / Science and Engineering
Keywords	Principal Investigator コンタクト通電特性 / 窒化ガリウム / ショットキー障壁 / 界面反応制御 / 反応制御 / オーム性電極 / 単結晶炭化珪素 / 肉盛材 / 開先形状 / 肉盛摩擦攪拌接合 … More / ステーショナリーショルダ型摩擦攪拌接合ツール / マルチパス摩擦攪拌接合 / ステーショナリーショルダ型ツール / 肉盛 / ステーショナリーショルダー型ツール / マルチパス接合 / 汎用工作機械 / 厚板接合 / 多層多パス接合 / 送給肉盛 / アルミニウム合金 / 摩擦攪拌接合 / ｐ型窒化ガリウム / 過渡現象 / 脆弱層形成の抑制 / n型炭化ケイ素 / ニッケル電極 / パラジウム電極 / 水素透過能 / 有効正孔濃度 / p型窒化ガリウム / 通電熱処理 / 電極材料 / パワーエレクトロニクス / 炭化ケイ素 / 界面構造制御 / 成膜残留歪 / 歪 / オーミック電極 / 界面電気伝導特性 / 電極／基板界面 / ひずみ / 多段ステップ昇温熱処理 / 単結晶窒化ガリウム / ガラス遷移温度 / 等速昇温変態曲線 / 結晶化メカニズム / 熱的安定性評価 / 超音波接合 / 金属ガラス / 炭化珪素 / 広禁制帯幅化合物半導体 / 異材界面構造 / 界面機能 / 破面解析 / 化学ポテンシャル図 / 界面反応組織 / ニオブ / チタン / 窒化珪素 / 接合面方位 / 界面組織制御 / 固相拡散接合 … More Except Principal Investigator 摩擦攪拌接合 / FSW / 結晶粒微細化 / 異常粒成長 / EBSP解析 / 5083アルミニウム合金 / Bobin Tool / Heat Input / Rotation Speed / Shoulder / Probe / Adjustable Tool / Friction Stir Welding / ボビンツール / 入熱 / 回転速度 / ショルダ / プローブ / 複動式 / grain boundary migration / interfacial reaction / grain growth / Monte Carlo simulation / solid state diffusion bonding / friction stir welding / microstructure / EBSP method / 結晶粒方位分布 / Al-Mg合金 / 三重点 / 結晶粒界 / 固相拡散接合界面組織 / ナノ結晶粒組織 / Ni-Cr合金 / 第2相粒 / 結晶粒成長 / 温度勾配場 / TiAl拡散接合界面 / Sic / 超塑性 / スパッタ膜 / 7454Al合金 / 熱サイクル / 界面・粒内核生成 / 析出 / モンテカルロシミュレーション / 残留ひずみ / 硬さ / 超塑性変形 / 粒界移動 / 界面反応 / 粒成長 / モンテカルロ計算 / 固相拡散接合 / 結晶粒組織 / EBSP法 / Supercooling / Microgravity / High Temperature Melt / Viscosity / Surface Tension / Density / 浮遊液滴法 / 高融点 / 液体 / 金属 / 密度 / 表面張力 / 微小重力 / 反応拡散 / 配線接合 / 窒化ガリウム / 炭化珪素 / 化合物半導体 / インターコネクション / 電子実装 / インターコネクション超音波接合 / 接合 / 界面 / ナノ / パワーデバイス / 環境調和 / 継手強度 / 真空熱処理 / 金属ガラス / 非晶質 / 破面形態解析 / 熱的安定性 / 重ね溶接継手 / 半導体レーザ溶接 / 電子ビーム溶接 / ファイバーレーザ溶接 / Ni基金属ガラス箔 / 空間的方位分布 / 集合組織 / EBSP / 6061合金異材接合 / 5083 / 7075Al合金 / 界面移動 / モンテカルロシュミレーション / 950Mpa級鋼溶接金属 Less

送給型肉盛摩擦攪拌接合技術の開発とそのアルミニウム合金厚板接合への応用Principal Investigator
- Principal Investigator
  
  前田将克
- Project Period (FY)
  2025 – 2027
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Nihon University
Multipass friction stir welding of the same or dissimilar thick aluminum alloy platesPrincipal Investigator
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2017 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Nihon University
Control of interfacial nanostructure between wide-gap semiconductors and their electrodesPrincipal Investigator
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Nihon University
Control of Interfacial Strain between Wide-Bandgap Semiconductor and Electrode to Improve Interfacial Electrical ConductancePrincipal Investigator
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2012 – 2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Improvement of Interfacial Functions in Eco-devices Based on Control of Interfacial NanostructurePrincipal Investigator
- Principal Investigator
  
  MAEDA Masakatsu
- Project Period (FY)
  2009 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Ni基金属ガラス箔の溶接接合特性評価と異材接合への展開
- Principal Investigator
  
  津村卓也
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  Osaka University
Analysis of interface-bond formation mechanism of environmentally friendly electronic device wiring and optimization of the bonding process
- Principal Investigator
  
  AKAHASHI Yasuo
- Project Period (FY)
  2006 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
単結晶炭化珪素/金属界面反応組織の解析と制御Principal Investigator
- Principal Investigator
  
  前田将克
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Development of Selfoontrolling Friction Stir Welding for High Temperature Materials and Analysis of Micmsfructure Evolution during Friction Stir Welding
- Principal Investigator
  
  FUJII Hidetoshi
- Project Period (FY)
  2005 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
金属多結晶材料における遺伝的局所組織情報の抽出と結晶粒組織転写技術の開発
- Principal Investigator
  
  SHIBAYANAGI Toshiya
- Project Period (FY)
  2003 – 2004
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Role of Local Microstructure Parameters in the Evolution Process of Interfacial Microstructures of Joints
- Principal Investigator
  
  SHIBAYANAGI Toshiya
- Project Period (FY)
  2001 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Precise measurement of physical properties of high melting point melts using microgravity environment
- Principal Investigator
  
  NOGI Kiyoshi
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
固相拡散接合における窒化珪素/金属界面構造の接合面方位による制御Principal Investigator
- Principal Investigator
  
  前田将克
- Project Period (FY)
  1995
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University

[Book] 材料開発のための顕微鏡法と応用写真集,p. 198「SiC/TiAl固相拡散接合界面組織」2006
- Author(s)
  前田将克, 天山和幸, 柴柳敏哉(分担執筆)
- Total Pages
  1
- Publisher
  日本金属学会
- Data Source
  KAKENHI-PROJECT-17760580
[Journal Article] p型GaN中の水素除去促進のための通電熱処理と電気特性改善効果2016
- Author(s)
  土田啓介，アイマン・ビン・モハマド・ハリル，高橋康夫，前田将克
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 193-198
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 超塑性材料の固相接合における微小空洞消失機構解析2016
- Author(s)
  梨木悠介，衡中皓，前田将克，高橋康夫
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 177-182
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 超音波Alリボンボンディングにおける凝着界面形成および接合部信頼性2016
- Author(s)
  三澤浩太，高岡勇介，前田将克，高橋康夫
- Journal Title
  
  第22回エレクトロニクスにおけるマイクロ接合および実装技術に関するシンポジウム（Mate2016）
  
  Volume: 22 Pages: 73-78
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 4.p型GaN中の水素除去促進のための通電熱処理と電気特性改善効果2016
- Author(s)
  土田啓介，アイマンビンモハマドハリル，高橋康夫，前田将克
- Journal Title
  
  Mateシンポジウム論文集
  
  Volume: 22 Pages: 193-198
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 5.Microstructures Observation of N-type GaN Contacts and the Electrical Properties2015
- Author(s)
  Halil Aiman bin Mohd, Kimura Kota, Maeda Masakatsu, Takahashi Yasuo
- Journal Title
  
  Trans. JWRI
  
  Volume: 44 Pages: 19-22
- Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] 6.Improvement of Electrical Properties of p-type GaN and Au Contact Interface2015
- Author(s)
  Aiman bin Mohd Halil, Keisuke Tsuchida, Masakatsu Maeda, Yasuo Takahashi
- Journal Title
  
  Quart. J. Jpn. Weld. Soc.
  
  Volume: 33
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Ni nano level thin film formation on p-GaN and improvement of electrical properties by hydrogen release enhancement2015
- Author(s)
  Aiman b. M. H., K. Tsuchida, M. Maeda and Y. Takahashi
- Journal Title
  
  J. Smart Process. Soc.
  
  Volume: 4 Pages: 109-114
- NAID
  130005119121
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Nickel-titanium-based contact for n-type silicon carbide to combine high ohmic conductivity and mechanical properties2014
- Author(s)
  M. Maeda, M. Sano and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012031-012031
- DOI
  10.1088/1757-899x/61/1/012031
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of Ti3SiC2 formation on p-type GaN by vacuum annealing on the contact properties2014
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012034-012034
- DOI
  10.1088/1757-899x/61/1/012034
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of crystal orientation on ohmic contact formation for n-type gallium nitride2014
- Author(s)
  K. Kimura, Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012033-012033
- DOI
  10.1088/1757-899x/61/1/012033
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Nucleation and growth of Ti3SiC2 on SiC by interfacial reaction2014
- Author(s)
  K. Ideguchi, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. Mater. Sci. Eng.
  
  Volume: 61 Pages: 012032-012032
- DOI
  10.1088/1757-899x/61/1/012032
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26420702
[Journal Article] Effect of Argon Ion Irradiation on Ohmic Contact Formation on n-type Gallium Nitride2013
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 54 Issue: 6 Pages: 895-898
- DOI
  10.2320/matertrans.MD201217
- NAID
  10031176404
- ISSN
  1345-9678, 1347-5320
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Interfacial nanostructure and electrical properties of Ti3SiC2 contact on p-type gallium nitride2013
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  Mater. Trans
  
  Volume: Vol. 54 Pages: 890-894
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of interfacial properties in power electronic devices2013
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  International Journal of Nanotechnology
  
  Volume: 10 Pages: 89-99
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of argon ion irradiation on ohmic contact formation on n-type gallium nitride2013
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  Mater. Trans
  
  Volume: Vol. 54 Pages: 895-898
- NAID
  10031176404
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Interfacial Nanostructure and Electrical Properties of Ti<sub>3</sub>SiC<sub>2</sub> Contact on p-Type Gallium Nitride2013
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 54 Issue: 6 Pages: 890-894
- DOI
  10.2320/matertrans.MD201206
- NAID
  10031176403
- ISSN
  1345-9678, 1347-5320
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of interfacial properties in power electronic devices2013
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Int. J. Nanotechnol
  
  Volume: Vol. 10 Pages: 89-99
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] 金属ガラスの接合2011
- Author(s)
  前田将克, 高橋康夫
- Journal Title
  
  まてりあ
  
  Volume: Vol.50 Pages: 439-445
- NAID
  10029693285
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Effect of interfacial reaction on electrical conduction across the interface between n-type gallium nitride and contact materials2011
- Author(s)
  M.Maeda, T.Yamasaki, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 1 Pages: 111-112
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] 金属ガラスの接合2011
- Author(s)
  前田将克,高橋康夫
- Journal Title
  
  まてりあ
  
  Volume: 50 Pages: 439-445
- NAID
  10029693285
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] n型窒化ガリウムとチタンの界面反応制御によるオーミックコンタクト層形成2011
- Author(s)
  前田将克, 松本倫幸, 高橋康夫
- Journal Title
  
  エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム講演論文集(Mate 2011)
  
  Volume: Vol.17 Pages: 201-204
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Change in electrical properties by the evolution of interfacial structure between p-type 4H-SiC and Ti/Al bilayer2011
- Author(s)
  M.Higuchi, K.Nonomura, M.Maeda, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 2 Pages: 149-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Change in electrical properties by the evolution of interfacial structure between p-type 4H-SiC and Ti/ Al bilayer2011
- Author(s)
  M. Higuchi, K. Nonomura, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. Int. Symp. Materials Science and Innovation for Sustainable Society(ECO-MATES 2011)
  
  Volume: Vol.2 Pages: 149-150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties and structure of contact interface between Ti3SiC2 and p-type GaN2011
- Author(s)
  Aiman b.M.H., M.Maeda, Y.Takahashi
- Journal Title
  
  Proc.International Symposium on Materials Science and Innovation for Sustainable Society
  
  Volume: 1 Pages: 113-114
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Formation of Ohmic Contact Layer on n-type Gallium Nitride by Controlling Interfacial Reaction with Titanium2010
- Author(s)
  M.Maeda, N.Matsumoto, Y.Takahashi
- Journal Title
  
  Proc.Mater.Sci.Technol.(MS & T)2010
  
  Pages: 2732-2742
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Thermal stability of Zr_<55>Cu_<30>Ni_<5>Al_<10> metallic glass in contact with aluminum2010
- Author(s)
  M.Maeda, Y.Takahashi, A.Inoue
- Journal Title
  
  Ceramic Transactions
  
  Volume: 219 Pages: 67-72
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Thermal stability of Zr_<55> Cu_<30> Ni_5Al_<10> metallic glass in contact with aluminum2010
- Author(s)
  M. Maeda, Y. Takahashi and A. Inoue
- Journal Title
  
  Ceram. Trans.
  
  Volume: Vol.219 Pages: 67-72
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Formation of ohmic contact layer on n-type gallium nitride by controlling interfacial reaction with titanium2010
- Author(s)
  M. Maeda, N. Matsumoto and Y. Takahashi
- Journal Title
  
  Proc. Materials Science and Technology
  
  Pages: 2732-2742
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] 銅と電解錫めっき銅基板の無加熱超音波接合2009
- Author(s)
  井上直人,佐藤貴昭,前田将克,高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol. 15
  
  Pages: 367-370
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial microstructure and thermal stability of Zr_<55> Cu_<30> Ni_5Al_<10> metallic glass joints formed by ultrasonic bonding2009
- Author(s)
  M. Maeda, T. Yamasaki, Y. Takahashi and A. Inoue
- Journal Title
  
  Mater. Trans.
  
  Volume: Vol.50 Pages: 1263-1268
- NAID
  10024815498
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Early stage of Solid State Interfacial Reaction between Copper and Tin2009
- Author(s)
  M. Maeda, N. Inoue, T. Sato, and Y. Takahashi
- Journal Title
  
  Defect and Diffusion Forum Vols. 283-286
  
  Pages: 323-328
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructure and Thermal Stability of Zr_<55>Cu_<30>Ni_5Al_<10> Metallic Glass Joints Formed by Ultrasonic Bonding2009
- Author(s)
  M.Maeda, T.Yamasaki, Y.Takahashi, A.Inoue
- Journal Title
  
  Materials Transactions 50
  
  Pages: 1263-1268
- NAID
  10024815498
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Heatless Ultrasonic Bonding of Copper-foil with Tin Electroplated Copper Substrate2009
- Author(s)
  N. Inoue, T. Sato, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) 15
  
  Pages: 367-370
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Copper Foils Using Deposition Films of Tin2009
- Author(s)
  T. Sato, N. Inoue, M. Maeda, Y. Takahashi
- Journal Title
  
  Proc. 15th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) 15
  
  Pages: 375-378
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 錫蒸着膜を介した銅の常温超音波接合2009
- Author(s)
  佐藤貴昭,井上直人,前田将克, 高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol. 15
  
  Pages: 375-378
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Early Stage of Solid State Interfacial Reaction between Copper and Tin2009
- Author(s)
  M. Maeda, N. Inoue, T. Sato, Y. Takahashi
- Journal Title
  
  Defect and Diffusion Forum 283-286
  
  Pages: 323-328
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Deformation Behavior of Wiring Metals during Ultrasonic Bonding2008
- Author(s)
  Y. Yoneshima, H. Kitamura, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 347-350
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Formation of Ti3SiC2 Contact Layer Preventing Interfacial Reaction with SiC Substrate2008
- Author(s)
  K. Takahashi, M. Maeda, N. Matsumoto, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 339-342
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Zr55Cu30Ni 5Al10 Metallic Glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M Fukuhara, X. Wang, and A. Inoue
- Journal Title
  
  Materials Sc. Eng. B Vol. 141-14
  
  Pages: 0-0
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic Bonding of Copper and Tin2008
- Author(s)
  N. Inoue, T. Sato, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 339-342
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic bonding of Zr_<55>Cu_<30>Ni_5Al_<10> metallic glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M. Fukuhara, X. Wang, A. Inoue
- Journal Title
  
  Materials Science and Engineering B 148
  
  Pages: 141-144
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 窒化ガリウムと金属蒸着膜との界面組織2008
- Author(s)
  前田将克, 高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol.14
  
  Pages: 351-354
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructures of Zr_<55>Cu_<30>Ni_5Al_<10> Metallic Glass Joints Formed by Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Akagi, Y. Takahashi
- Journal Title
  
  Smart Processing Technology 2
  
  Pages: 239-242
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] 超音波接合における配線材変形挙動2008
- Author(s)
  米島康弘,北村英樹,前田将克,高橋康夫
- Journal Title
  
  Mate論文集, 溶接学会 Vol.14
  
  Pages: 347-349
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Microstructure between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Proc. of 14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 351-354
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Ultrasonic bonding of Zr55Cu30Ni5Al10 metallic glass2008
- Author(s)
  M. Maeda, Y. Takahashi, M. Fukuhara, X. Wang, A. Inoue
- Journal Title
  
  Materials Science and Engineering B Vol 141
  
  Pages: 141-144
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Reaction during Solid State Diffusion Bonding of Copper and Tin2008
- Author(s)
  N. Inoue, T. Sato, M. Maeda, and Y. Takahashi
- Journal Title
  
  Proc. of-14th Symposium on Microjoining and Assembly Technology in Electronics (Mate2008) Vol 14
  
  Pages: 335-338
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Room Temperatuer Micro-bonding of Fine Wires to Foils2007
- Author(s)
  Y Takahashi, M Maeda, T Doki, S Matsusaka
- Journal Title
  
  Solid State Phenomena Vol.127
  
  Pages: 277-282
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Interfacial Reaction between SiC Single crystal and Ti/Al Multilayered Contact Films2007
- Author(s)
  M. Maeda, K. Nonomura, Y. Takahashi and K. Tenyama
- Journal Title
  
  Proc. 8th International Conference On Brazing High Temperature Brazing and Diffusion welding
  
  Pages: 84-87
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Solid State Adhersion of Fine Metal Wires2006
- Author(s)
  Y Takahashi, M Maeda, T Tomimura, T Doki, S Matsusaka
- Journal Title
  
  2006 Korea-Japan Joint Symposium on Microjoining Technology, Korean Welding Society
  
  Pages: 1-6
- Data Source
  KAKENHI-PROJECT-18206076
[Journal Article] Temperature measurement in a friction stir welded 7075Al alloy joint2004
- Author(s)
  M.Maeda
- Journal Title
  
  Proceedings of "IIW Pre-Assembly Meeting on FSW" CD
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Temperature measurement in a friction stir welded 7075Al alloy joint2004
- Author(s)
  M.Maeda
- Journal Title
  
  Proceedings of "IIW Pre-Assembly Meeting on FSW" CD
- Data Source
  KAKENHI-PROJECT-15656185
[Journal Article] Interfacial Microstructure of Silicon Carbide and Titanium Aluminide Joint Produced by Solid-State Diffusion Bonding2004
- Author(s)
  M.Maeda
- Journal Title
  
  Materials Transactions 45
  
  Pages: 2734-2739
- NAID
  10013474761
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Temperature Measurement in a Friction Stir Welded 7075Al Alloy Joints2004
- Author(s)
  M.Maeda
- Journal Title
  
  Proceedings of "IIW Pre-Assembly Meeting on FSW" (CD-ROM)
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid-State Diffusion Bonding of Silicon Nitride Using Titanium Foils2003
- Author(s)
  M.Maeda
- Journal Title
  
  Metallurgical and Materials Transactions A 34
  
  Pages: 1647-1656
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid-State Diffusion Bonding of Silicon Nitride Using Titanium Foils2003
- Author(s)
  M.Maeda
- Journal Title
  
  Metallurgical and Materials Transactions A Vol.34A, No.8
  
  Pages: 1647-1656
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid State Diffusion Bonding of Silicon Nitride using Vanadium Foils2003
- Author(s)
  M.Maeda
- Journal Title
  
  Materials Transactions 44 No.12
  
  Pages: 2701-2710
- NAID
  10011818223
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid-State Diffusion Bonding of Silicon Nitride using Vanadium Foils2003
- Author(s)
  M.Maeda
- Journal Title
  
  Materials Transactions 44
  
  Pages: 2701-2710
- NAID
  10011818223
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid State Diffusion Bonding of SiC to Nb2002
- Author(s)
  M.Maeda
- Journal Title
  
  Proceedings of "Designing of Interfacial Structures in Advanced Materials and Their Joints" 26-28 Nov.2002, Osaka, Japan
  
  Pages: 557-561
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Solid State Diffusion Bonding of Si_3N_4 to Nb
- Author(s)
  M.Maeda
- Journal Title
  
  Proceedings of "Designing of the Interfacial Structures in Advanced Materials and Their Joints" 26-28 Nov.2002, Osaka, Japan
  
  Pages: 557-561
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-13450295
[Journal Article] Nickeltitaniu based contact for n-type silicon carbide to combine high ohmic conductivity and mechanical properties
- Author(s)
  M. Maeda, M. Sano and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Control of Interfacial Properties in Power Electronic Devices
- Author(s)
  M. Maeda and Y. Takahashi
- Journal Title
  
  Int. J. Nanotechnol.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties and structure of contact interface between Ti_3SiC_2 and p-type GaN
- Author(s)
  Aiman b. M. H., M. Maeda, Y. Takahashi
- Journal Title
  
  J. Phys.: Conf. Ser.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Electrical properties of the interface between p-GaN and contact materials
- Author(s)
  Aiman b. M. H., M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of interfacial reaction on electrical conduction across the interface between n-type gallium nitride and contact materials
- Author(s)
  M. Maeda, T. Yamasaki and Y. Takahashi
- Journal Title
  
  J. Phys.: Conf. Ser.
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560746
[Journal Article] Nucleation and growth of Ti3SiC2 on SiC by interfacial reaction
- Author(s)
  K. Ideguchi, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Journal Article] Effect of crystal orientation on ohmic contact formation for n-type gallium nitride
- Author(s)
  K. Kimura, M. Maeda and Y. Takahashi
- Journal Title
  
  IOP Conf. Ser. : Mater. Sci. Eng
  
  Volume: (in press)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24656444
[Patent] オーミック電極およびその製造方法2009
- Inventor(s)
  関章憲,杉本雅裕,川橋憲,高橋康夫,前田将克
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車
- Industrial Property Number
  2009-182541
- Filing Date
  2009-08-05
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] オートミック電極およびその形成方法2009
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Industrial Property Number
  2009-020850
- Filing Date
  2009-01-30
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 半導体装置、及び、半導体装置の製造方法2009
- Inventor(s)
  杉本雅裕,関章憲,川橋憲,高橋康夫,前田将克
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車
- Industrial Property Number
  2009-229381
- Filing Date
  2009-10-01
- Data Source
  KAKENHI-PROJECT-21560746
[Patent] p型4H-SiC基板上のオートミック電極の形成方法2008
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Filing Date
  2008-03-13
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 超音波接合方法及び超音波接合体2008
- Inventor(s)
  高橋康夫,前田将克他4名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Industrial Property Number
  2008-200955
- Filing Date
  2008-08-04
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] Semiconductor Devices and Manufacturing Method Thereof2007
- Inventor(s)
  高橋康夫,前田将克他3名
- Industrial Property Rights Holder
  大阪大学,トヨタ自動車(株)
- Filing Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 半導体装置とその製造方法2006
- Inventor(s)
  前田将克他4名
- Industrial Property Rights Holder
  大阪大学
- Industrial Property Number
  2006-256706
- Filing Date
  2006-09-22
- Data Source
  KAKENHI-PROJECT-18206076
[Patent] 半導体装置とその製造方法2006
- Inventor(s)
  前田将克ほか4名
- Industrial Property Number
  2006-256705
- Filing Date
  2006-09-22
- Data Source
  KAKENHI-PROJECT-17760580
[Patent] 接合体と接合方法2006
- Inventor(s)
  前田将克, 高橋正行
- Industrial Property Number
  2006-305236
- Filing Date
  2006-11-10
- Data Source
  KAKENHI-PROJECT-17760580
[Presentation] 6061アルミニウム合金肉盛摩擦攪拌接合継手における外部供給肉盛材幅の影響2023
- Author(s)
  濵名晃平, 前田将克
- Organizer
  千葉県加工技術研究会第25回大学等委員による研究事例発表会
- Data Source
  KAKENHI-PROJECT-17K06824
[Presentation] 外部供給バルク材を用いた6061アルミニウム合金摩擦攪拌接合継手の開先充填状態と継手特性2022
- Author(s)
  濵名晃平, 前田将克
- Organizer
  溶接学会 2022年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-17K06824
[Presentation] 外部供給バルク材を用いたA6061アルミニウム合金肉盛摩擦攪拌接合継手における撹拌量の影響2022
- Author(s)
  濵名晃平, 前田将克
- Organizer
  軽金属学会第143回秋期大会
- Data Source
  KAKENHI-PROJECT-17K06824
[Presentation] n型窒化ガリウムへのオーミックコンタクト形成とそのメカニズム2012
- Author(s)
  前田将克, 高橋康夫
- Organizer
  溶接学会界面接合研究委員会
- Place of Presentation
  東京工業大学
- Year and Date
  2012-05-18
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] Control of Interfacial Properties in Power Electronic Devices2011
- Author(s)
  M.Maeda, Y.Takahashi
- Organizer
  The 4th International Symposium on Functional Materials
- Place of Presentation
  Sendai, Japan(招待講演)
- Year and Date
  2011-08-03
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] 炭化ケイ素半導体のオーミックコンタクト形成機構と特性評価2010
- Author(s)
  樋口真之, 前田将克, 高橋康夫, 森本純司
- Organizer
  溶接学会
- Place of Presentation
  日本大学
- Year and Date
  2010-09-08
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] ジルコニウム基金属ガラスとアルミニウムの異材界面の構造と安定性2010
- Author(s)
  児玉拓己, 前田将克, 高橋康夫
- Organizer
  溶接学会
- Place of Presentation
  日本大学
- Year and Date
  2010-09-08
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] p型4H-SiC半導体へのオーミックコンタクト形成と特性評価2009
- Author(s)
  木村義孝, 前田将克, 高橋康夫
- Organizer
  溶接学会
- Place of Presentation
  徳島大学
- Year and Date
  2009-09-11
- Data Source
  KAKENHI-PROJECT-21560746
[Presentation] Reaction between GaN and Metallic Deposition Film2008
- Author(s)
  N. Matsumoto, H. Hatagawa, M. Maeda, Y. Takahasi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Low Temperature Solid State Bonding of Cu and Sn for Electronic Packaging2008
- Author(s)
  T. Sato, N. Inoue, M. Maeda, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] In-situ Observation of Ultrasonic Aluminum Wire Bonding2008
- Author(s)
  Kitamura, Y, Yoneshima, M. Maeda, and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Relation between Vibration of Wedge-Tool and Adhesion of Wire to Substrate during Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Yamane, S. Matsusaka, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Low Temperature Solid State Bonding of Cu and Sn for Electronic Packaging2008
- Author(s)
  T. Sato, N. Inoue, M. Maeda and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Interfacial Structure between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda, H. Hatakawa, Y. Takahashi
- Organizer
  6th International Materials Technology Conference & Exhibition
- Place of Presentation
  Kuala Lumpur, Malaysia
- Year and Date
  2008-08-27
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Relation between Vibration of Wedgetool and Adhsion of Wire to Substrate during Ultrasonic Bonding2008
- Author(s)
  M. Maeda, K. Yamane, S. Matsusaka and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 窒化ガリウム単結晶と金属薄膜の界面組織2008
- Author(s)
  前田将克,畑川裕生,高橋康夫
- Organizer
  化ガリウム単結晶と金20年度溶接学会秋季全国大会
- Place of Presentation
  小倉
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Interfacial Structur between Gallium Nitride and Metallic Deposition Films2008
- Author(s)
  M. Maeda, H. Hatakawa and Y. Takahashi
- Organizer
  Proceeding of 6th International Materials Technology Conference and Exhibition (IMTCE 2008)
- Place of Presentation
  Kuala Lumpur (Malaysia)
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] In-situ Observation of Ultrasonic Aluminum Wire Bonding2008
- Author(s)
  H. Kitamura, Y. Yoneshima, M. Maeda, Y. Takahashi
- Organizer
  8th Welding Symposium
- Place of Presentation
  京都国際会館
- Year and Date
  2008-11-17
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] Formation of Ti_3SiC_2 on SiC by Control of Interfacial Reaction between SiC and Ti / Al Multilayer2008
- Author(s)
  M. Maeda, Y. Takahashi
- Organizer
  4th JWS-KWJS Young Researcher Symposium
- Place of Presentation
  大阪市
- Year and Date
  2008-04-09
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] "Reaction between Gan and Metallic Deposition Film2008
- Author(s)
  N. Matsumoto, H. Hatagawa, M. Maeda, and Y. Takahashi
- Organizer
  8WS (The 8th International Welding Symposium), JWS
- Place of Presentation
  Kyoto
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 窒化ガリウム単結晶と金属膜の界面組織2008
- Author(s)
  前田将克, 高橋康夫, 畑川裕生
- Organizer
  溶接学会秋季全国大会講演会
- Place of Presentation
  北九州国際会議場
- Year and Date
  2008-09-12
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 太径ワイヤによる超音波配線接合プロセスのその場観察2007
- Author(s)
  米島康弘, 前田将克, 高橋康夫
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-21
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] CuとSnの固相接合における界面反応プロセス2007
- Author(s)
  井上直人, 佐藤貴昭, 前田将克, 高橋康夫
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-20
- Data Source
  KAKENHI-PROJECT-18206076
[Presentation] 炭化珪素単結晶とTi/Al多層コンタクト膜の界面反応制御2007
- Author(s)
  前田将克, 高橋康夫, 野々村和政
- Organizer
  溶接学会秋季全国大会
- Place of Presentation
  信州大学工学部
- Year and Date
  2007-09-20
- Data Source
  KAKENHI-PROJECT-18206076

1. AKAHASHI Yasuo (80144434)

# of Collaborated Projects: 4 results

# of Collaborated Products: 75 results
2. SHIBAYANAGI Toshiya (10187411)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. NAKATA Kazuhiro (80112069)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
4. NOGI Kiyoshi (40029335)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
5. FUJII Hidetoshi (00247230)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
6. MATSUSAKA Souta (30334171)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
7. MATSUMOTO Taihei (30294135)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. UEGURI Shigeo (50370218)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. 津村卓也 (00283812)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. 高橋誠 (10294133)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 岩本知広 (60311635)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

MAEDA Masakatsu 前田 将克

前田 将克 マエダ マサカツ

Research Projects

Research Products

Co-Researchers

送給型肉盛摩擦攪拌接合技術の開発とそのアルミニウム合金厚板接合への応用Principal Investigator

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Multipass friction stir welding of the same or dissimilar thick aluminum alloy platesPrincipal Investigator

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Control of interfacial nanostructure between wide-gap semiconductors and their electrodesPrincipal Investigator

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Control of Interfacial Strain between Wide-Bandgap Semiconductor and Electrode to Improve Interfacial Electrical ConductancePrincipal Investigator

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Improvement of Interfacial Functions in Eco-devices Based on Control of Interfacial NanostructurePrincipal Investigator

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Ni基金属ガラス箔の溶接接合特性評価と異材接合への展開

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Analysis of interface-bond formation mechanism of environmentally friendly electronic device wiring and optimization of the bonding process

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単結晶炭化珪素/金属界面反応組織の解析と制御Principal Investigator

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Development of Selfoontrolling Friction Stir Welding for High Temperature Materials and Analysis of Micmsfructure Evolution during Friction Stir Welding

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金属多結晶材料における遺伝的局所組織情報の抽出と結晶粒組織転写技術の開発

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Role of Local Microstructure Parameters in the Evolution Process of Interfacial Microstructures of Joints

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Precise measurement of physical properties of high melting point melts using microgravity environment

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固相拡散接合における窒化珪素/金属界面構造の接合面方位による制御Principal Investigator

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MAEDA Masakatsu 前田将克

前田将克マエダマサカツ