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XING Jun Liu  劉 興軍

ORCIDConnect your ORCID iD *help
Researcher Number 00323072
Affiliation (based on the past Project Information) *help 2001 – 2002: 東北大学, 大学院・工学研究科, 助教授
Review Section/Research Field
Principal Investigator
Structural/Functional materials
Keywords
Principal Investigator
Phase equilibria / Kinetic simulation / Electronic Packaging / Pb-free solders / Diffusion couple / Phase diagram / Microstructure morphology / Interfacial reaction / 半導体パッケッジ / 相平衡 … More / 速度論の解析 / 半導体パッケージ / Pbフリーはんだ / 拡散対法 / 状態図 / 組織形態 / 界面反応 Less
  • Research Projects

    (1 results)
  • Co-Researchers

    (3 People)
  •  Interfacial Reaction and Morphological Control between Cu Substrate and Pb-free Solders in Electronic PackagingPrincipal Investigator

    • Principal Investigator
      XING Jun Liu
    • Project Period (FY)
      2001 – 2002
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Structural/Functional materials
    • Research Institution
      Tohoku University
  • 1.  OHNUMA Ikuo (20250714)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 2.  KAINUMA Ryosuke (20202004)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 3.  ISHIDA Kiyohito (20151368)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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