KOHAMA Kazuyuki 小濱和之

Researcher Number	00710287
Other IDs
Affiliation (Current)	2025: 地方独立行政法人京都市産業技術研究所, 京都市産業技術研究所, 主席研究員
Affiliation (based on the past Project Information) *help	2024: 地方独立行政法人京都市産業技術研究所, 京都市産業技術研究所, 主席研究員 2018 – 2023: 地方独立行政法人京都市産業技術研究所, 京都市産業技術研究所, 次席研究員 2014 – 2017: 大阪大学, 接合科学研究所, 助教 2013: 大阪大学, 接合科学研究所, 研究員
Review Section/Research Field	Principal Investigator Basic Section 26030:Composite materials and interfaces-related / Composite materials/Surface and interface engineering / Basic Section 26050:Material processing and microstructure control-related Except Principal Investigator Material processing/treatments
Keywords	Principal Investigator 高温強度 / 高融点金属 / セラミックス / SiC / 融点降下 / 微粒子 / ペースト / 接合 / ユビキタス元素 / CNF … More / 粉末プロセス / 粉末冶金 / 自由度 / 熱力学 / 相変態 / 物質移動 / 接合機構 / 低温接合 / Si-Mg状態図 / 状態図 / 曲げ強度 / 界面微細組織 / 引張強度 / ろう接 / 生産工学 / 複合材料 / 構造材料 / 等温凝固 / 液相焼結 / 粉末 / 耐熱部材 / 異材接合 / 再溶融温度 / Siペースト / 放電プラズマ焼結装置 / 焼結 / 粉体 / 炭化ケイ素 … More Except Principal Investigator ITO / チタン / マグネシウム / Cu合金膜 / IGZO / 接触抵抗 / 密着性 / 抵抗率 / Cu(Ti) / Cu(Mg) / 熱処理 / Cu配線 Less

セルロースナノファイバーと金属粉体の複合焼結メタラジーの構築Principal Investigator
- Principal Investigator
  
  小濱和之
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26050:Material processing and microstructure control-related
- Research Institution
  Kyoto Municipal Institute of Industrial Technology and Culture
Investigation of the novel joining dynamics induced by non-equilibrium gas-liquid-solid coexistence state at ceramic joint interface and its application to heat-resistant joint formationPrincipal Investigator
- Principal Investigator
  
  KOHAMA Kazuyuki
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Kyoto Municipal Institute of Industrial Technology and Culture
Joining of Heat-Resistant Materials Using Isothermal Solidification by Evaporation of Additives in Multi-Element Insert MaterialPrincipal Investigator
- Principal Investigator
  
  Kohama Kazuyuki
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Kyoto Municipal Institute of Industrial Technology and Culture
Dissimilar Heat-Resistant Materials Bonding Using Paste-Like Ceramics PowderPrincipal Investigator
- Principal Investigator
  
  KOHAMA Kazuyuki
- Project Period (FY)
  2016 – 2017
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University
Development of Low-Temperature Solid-State Bonding Process for SiC-Fiber-Reinforced SiC-Matrix CompositesPrincipal Investigator
- Principal Investigator
  
  Kohama Kazuyuki
- Project Period (FY)
  2014 – 2015
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University
Seeking innovative alloy elements for development of low-temperature and high-reliability Cu-alloy interconnects and electrodes with reducing process temperature
- Principal Investigator
  
  ITO KAZUHIRO
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University

All 2024 2023 2021 2020 2019 2018 2017 2016 2015 2014 2013 Other

All Journal Article Presentation Patent

[Journal Article] Improved mechanical properties of SiC/SiC brazed joints via added Al in Si-Mg composite fillers2024
- Author(s)
  Kohama Kazuyuki
- Journal Title
  
  Ceramics International
  
  Volume: 50 Issue: 6 Pages: 8634-8642
- DOI
  10.1016/j.ceramint.2023.12.012
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21K04683
[Journal Article] Compositional effects of Si-Mg-A1 composite fillers on the interfacial microstructure and high-temperature strength of SiC/SiC brazed joints2024
- Author(s)
  Kazuyuki Kohama
- Journal Title
  
  Open Ceramics
  
  Volume: 19 Pages: 100641-100641
- DOI
  10.1016/j.oceram.2024.100641
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21K04683
[Journal Article] Interfacial microstructure characterization and strength evaluation of Si3N4/Si3N4 joints with Si-Mg composite filler for high-temperature applications2021
- Author(s)
  Kazuyuki Kohama
- Journal Title
  
  Ceramics International
  
  Volume: - Issue: 16 Pages: 22424-22434
- DOI
  10.1016/j.ceramint.2021.04.252
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18K04726
[Journal Article] Si基複合粉末フィラーの添加元素蒸発による等温凝固を用いたセラミックスの高耐熱接合2021
- Author(s)
  小濱和之
- Journal Title
  
  ぶれいず
  
  Volume: 55 Pages: 32-38
- Data Source
  KAKENHI-PROJECT-21K04683
[Journal Article] Joining of alumina ceramics using silicon-magnesium composite filler for high-temperature applications2020
- Author(s)
  Kazuyuki KOHAMA
- Journal Title
  
  Science and Technology of Welding and Joining
  
  Volume: - Issue: 5 Pages: 1-8
- DOI
  10.1080/13621718.2020.1714874
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18K04726
[Journal Article] Direct solid-state diffusion bonding of zirconium carbide using a spark plasma sintering system2016
- Author(s)
  Kazuyuki Kohama, Kazuhiro Ito
- Journal Title
  
  Materials & Design
  
  Volume: 110 Pages: 888-894
- DOI
  10.1016/j.matdes.2016.08.060
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-16K18246
[Journal Article] Synthesis using Cu(Ti) alloy films for self-forming functionality in electronic devices2014
- Author(s)
  K. Ito and K. Kohama
- Journal Title
  
  Transactions of JWRI
  
  Volume: 43 Pages: 37-43
- NAID
  120005588197
- Data Source
  KAKENHI-PROJECT-24360307
[Journal Article] Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates2014
- Author(s)
  K. Ito, K. Hamasaka, K. Kohama, Y. Shirai, and M. Murakami
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 43 Issue: 7 Pages: 2540-2547
- DOI
  10.1007/s11664-014-3224-0
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24360307
[Patent] CERAMIC BONDING MATERIAL2020
- Inventor(s)
  小濱和之
- Industrial Property Rights Holder
  京都市産業技術研究所
- Industrial Property Rights Type
  特許
- Filing Date
  2020
- Overseas
- Data Source
  KAKENHI-PROJECT-18K04726
[Patent] セラミックス接合材2019
- Inventor(s)
  小濱和之
- Industrial Property Rights Holder
  京都市産業技術研究所
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2019-145396
- Filing Date
  2019
- Data Source
  KAKENHI-PROJECT-18K04726
[Presentation] Si-Mg-Al複合粉末フィラーによるSiC接合体の作製とその高温強度評価2023
- Author(s)
  小濱和之
- Organizer
  溶接学会2023年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-21K04683
[Presentation] Si-Mg複合粉末フィラーへのAl添加によるSiC接合強度の向上2023
- Author(s)
  小濱和之
- Organizer
  溶接学会2023年度春季全国大会
- Data Source
  KAKENHI-PROJECT-21K04683
[Presentation] 接合後に高融点化するSi基フィラーの材料設計とセラミックス高耐熱接合への応用2023
- Author(s)
  小濱和之
- Organizer
  溶接学会第143回マイクロ接合研究委員会
- Invited
- Data Source
  KAKENHI-PROJECT-21K04683
[Presentation] Si-Mg混合粉末フィラーによる窒化ケイ素接合体の作製とその高温強度評価2020
- Author(s)
  小濱和之
- Organizer
  溶接学会2020年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K04726
[Presentation] Si基複合粉末フィラーの添加元素蒸発による等温凝固を用いたセラミックスの高耐熱接合2020
- Author(s)
  小濱和之
- Organizer
  日本溶接協会2020年度第2回先端材料接合委員会／溶接学会第115回界面接合研究委員会合同委員会
- Invited
- Data Source
  KAKENHI-PROJECT-18K04726
[Presentation] Joining of Alumina Ceramics Using Si-Mg Pastes for High-Temperature Application2019
- Author(s)
  Kazuyuki KOHAMA
- Organizer
  The 5th International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K04726
[Presentation] Mg含有Si基ペーストによるアルミナセラミックスの接合2019
- Author(s)
  小濱和之
- Organizer
  一般社団法人溶接学会2019年度秋季全国大会
- Data Source
  KAKENHI-PROJECT-18K04726
[Presentation] Si/Al混合粉末ろう材を用いたSiC/SiC低温接合2018
- Author(s)
  小濱和之，寺田俊一，伊藤和博，篠原貴彦，坂元理絵
- Organizer
  （一社）溶接学会第107回界面接合研究委員会
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] 放電プラズマ焼結装置を用いた直接通電加熱によるTiAl合金/鋼の拡散接合2017
- Author(s)
  小濱和之，西端惇，伊藤和博，江川相輝
- Organizer
  （公社）日本金属学会2018年秋期大会
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] 放電プラズマ焼結装置を用いたTiAl合金と鋼の直接通電加熱接合2017
- Author(s)
  西端惇，小濱和之，伊藤和博，江川相輝
- Organizer
  （一社）溶接学会平成29年秋季全国大会
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] Si/Al混合粉末ろう材のAl蒸発による等温凝固を用いたSiCの低温接合2017
- Author(s)
  小濱和之，寺田俊一，伊藤和博，山本啓，篠原貴彦，坂元理絵
- Organizer
  （一社）溶接学会平成29年度春季全国大会
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] 共晶系Si-Alろう材のAl蒸発による等温凝固を用いたSiCの低温接合2017
- Author(s)
  小濱和之、寺田俊一、伊藤和博、山本啓、篠原貴彦、坂元理絵
- Organizer
  （公社）日本金属学会2017年春期大会
- Place of Presentation
  首都大学東京南大沢キャンパス（東京都八王子市）
- Year and Date
  2017-03-15
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] SiC/SiC Joint Formation by Diffusion Bonding Using Paste-Like Si Powder for High-Temperature Application2016
- Author(s)
  Shunichi TERADA, Kazuyuki KOHAMA, Kazuhiro ITO, Soshu KIRIHARA
- Organizer
  The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2016)
- Place of Presentation
  Osaka, Japan
- Year and Date
  2016-10-17
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] Diffusion Bonding of SiC with Si Powder Application for High-Temperature Resistant Joint2016
- Author(s)
  Kazuyuki Kohama, Shunichi Terada, Kazuhiro Ito, Soshu Kirihara
- Organizer
  The 6th East Asia Symposium on Technology of Welding and Joining
- Place of Presentation
  Incheon, Korea
- Year and Date
  2016-09-08
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] Si微粒子ペーストとAlを用いたSiC接合における再溶融温度を高温維持した接合温度低減2016
- Author(s)
  寺田俊一、小濱和之、山本啓、伊藤和博
- Organizer
  （一社）溶接学会平成28年度秋季全国大会
- Place of Presentation
  ホテル天坊（群馬県渋川市）
- Year and Date
  2016-09-14
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] Siペーストの粒子体積分率制御によるSiC低温接合と接合強度向上2016
- Author(s)
  小濱和之、寺田俊一、伊藤和博、桐原聡秀
- Organizer
  （公社）日本金属学会2016年春期大会
- Place of Presentation
  東京理科大学葛飾キャンパス（東京）
- Year and Date
  2016-03-24
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Si微粒子をインサート材に用いたSiCの低温接合と接合部耐熱性維持2016
- Author(s)
  小濱和之
- Organizer
  （一社）溶接学会若手会員の会溶接・接合若手研究会
- Place of Presentation
  （株）ダイヘン六甲事業所（兵庫県神戸市）
- Invited
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] 接合部微細組織制御による低温接合2016
- Author(s)
  小濱和之
- Organizer
  （一社）溶接学会若手会員の会　溶接・接合若手研究会
- Place of Presentation
  琵琶湖畔おごと温泉木もれび（滋賀県・大津市）
- Year and Date
  2016-03-09
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Si微粒子とAlの混合インサート材によるSiCの低温接合と接合部再溶融温度の高温維持2016
- Author(s)
  寺田俊一、小濱和之、伊藤和博
- Organizer
  （公社）日本金属学会2016年秋期大会
- Place of Presentation
  大阪大学豊中キャンパス（大阪府豊中市）
- Year and Date
  2016-09-21
- Data Source
  KAKENHI-PROJECT-16K18246
[Presentation] Formation of ZrC-ZrC Joints Using Spark Plasma Sintering System2015
- Author(s)
  Kazuyuki Kohama, Kazuhiro Ito
- Organizer
  68th Annual Assembly of International Institute of Welding
- Place of Presentation
  Helsinki (Finland)
- Year and Date
  2015-07-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] 接合部の微細組織制御による固相拡散接合温度の低温化2015
- Author(s)
  小濱和之
- Organizer
  （一社）溶接学会四国支部・（一社）溶接学会若手会員の会共催研究会
- Place of Presentation
  川田工業（株）四国工場（香川県・多度津町）
- Year and Date
  2015-11-12
- Invited
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] 放電プラズマ焼結装置を用いた炭化ジルコニウムの直接固相接合2015
- Author(s)
  小濱和之、伊藤和博
- Organizer
  溶接学会
- Place of Presentation
  東京ビッグサイト（東京都）
- Year and Date
  2015-04-24
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Siペースト塗布による炭化ケイ素の低温接合2015
- Author(s)
  小濱和之、伊藤和博、寺田俊一、桐原聡秀
- Organizer
  溶接学会
- Place of Presentation
  学術総合センター（東京都）
- Year and Date
  2015-04-24
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Siペースト塗布による炭化ケイ素の低温接合2015
- Author(s)
  小濱和之、伊藤和博、寺田俊一、桐原聡秀
- Organizer
  （一社）溶接学会平成27年度春季全国大会
- Place of Presentation
  学術総合センター2階一橋大学一橋講堂（東京）
- Year and Date
  2015-04-24
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Siペースト中間材を用いたSiC接合温度の低温化2015
- Author(s)
  小濱和之、伊藤和博、寺田俊一、桐原聡秀
- Organizer
  日本金属学会
- Place of Presentation
  東京大学駒場IIキャンパス（東京大学）
- Year and Date
  2015-03-18
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Siペースト中間材の初期粒子径分布制御によるSiCの低温・高強度接合2015
- Author(s)
  寺田俊一、小濱和之、伊藤和博、桐原聡秀
- Organizer
  （一社）溶接学会平成27年度秋季全国大会
- Place of Presentation
  北海道科学大学（北海道・札幌市）
- Year and Date
  2015-09-04
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Low-temperature synthesis of Cu interconnects on glass using Cu(Mg) alloy films2014
- Author(s)
  Kazuyuki Kohama
- Organizer
  TMS2014 Annual Meeting & Exhibition
- Place of Presentation
  San Diego Convention Center (California, USA)
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] ZrC-ZrC Bonding Using Spark Plasma Sintering System2014
- Author(s)
  Kazuyuki KOHAMA, Kazuhiro ITO
- Organizer
  The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2014）
- Place of Presentation
  ホテル阪急エキスポパーク（大阪府）
- Year and Date
  2014-11-28
- Data Source
  KAKENHI-PROJECT-26820306
[Presentation] Reduction of Contact Resistance for Cu(Ti)/IGZO Junction2014
- Author(s)
  K. Ito, K. Kohama, T. Sano, T. Nabatame and A. Ohi
- Organizer
  The 5th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5) Conjunction with 6th IBB Frontier Symp.
- Place of Presentation
  東京医科歯科大学, 東京都
- Year and Date
  2014-11-19
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] ガラス基板上への高密着Cu膜の低温接合2013
- Author(s)
  小濱和之
- Organizer
  溶接学会平成25年度秋季全国大会
- Place of Presentation
  岡山理科大学 (岡山県)
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Cu-interconnect synthesis on glass using Cu(Mg) alloy2013
- Author(s)
  Kazuyuki Kohama
- Organizer
  International Symposium on Interfacial Joining and Surface Technology
- Place of Presentation
  大阪大学銀杏会館 (大阪府)
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] 接合界面での反応を利用したp型Ti基酸化物導電膜の作製
- Author(s)
  伊藤和博, 林徳樺, 小濱和之, 白井泰治, 村上正紀
- Organizer
  （一社）溶接学会平成26年度秋季全国大会
- Place of Presentation
  黒部市宇奈月国際会館セレネ，富山県
- Year and Date
  2014-09-10 – 2014-09-12
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Cu(Ti)合金膜を用いたIGZO膜への低接触抵抗電極の作製
- Author(s)
  伊藤和博, 小濱和之, 佐野貴之, 生田目俊秀, 大井暁彦
- Organizer
  （公社）日本金属学会 2014年秋期大会
- Place of Presentation
  名古屋大学, 愛知県
- Year and Date
  2014-09-24 – 2014-09-26
- Data Source
  KAKENHI-PROJECT-24360307

1. ITO KAZUHIRO (60303856)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results

KOHAMA Kazuyuki 小濱 和之

Research Projects

Research Products

Co-Researchers

セルロースナノファイバーと金属粉体の複合焼結メタラジーの構築Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Investigation of the novel joining dynamics induced by non-equilibrium gas-liquid-solid coexistence state at ceramic joint interface and its application to heat-resistant joint formationPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Joining of Heat-Resistant Materials Using Isothermal Solidification by Evaporation of Additives in Multi-Element Insert MaterialPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Dissimilar Heat-Resistant Materials Bonding Using Paste-Like Ceramics PowderPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Low-Temperature Solid-State Bonding Process for SiC-Fiber-Reinforced SiC-Matrix CompositesPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Seeking innovative alloy elements for development of low-temperature and high-reliability Cu-alloy interconnects and electrodes with reducing process temperature

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Improved mechanical properties of SiC/SiC brazed joints via added Al in Si-Mg composite fillers2024

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Compositional effects of Si-Mg-A1 composite fillers on the interfacial microstructure and high-temperature strength of SiC/SiC brazed joints2024

Author(s)

Journal Title

DOI

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[Patent] CERAMIC BONDING MATERIAL2020

KOHAMA Kazuyuki 小濱和之