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Zhan Tianzhuo  ジャン テンゾウ

ORCIDConnect your ORCID iD *help
Researcher Number 00803389
Other IDs
Affiliation (based on the past Project Information) *help 2021 – 2023: 東洋大学, 学際・融合科学研究科, 准教授
Review Section/Research Field
Principal Investigator
Basic Section 29020:Thin film/surface and interfacial physical properties-related
Keywords
Principal Investigator
熱マネジメント / ロジック半導体 / 硬X線光電子分光 / 層間絶縁膜 / 界面分析 / 有限要素法シミュレーション / 界面結合 / low-k層間絶縁膜 / ルテニウム / 界面熱抵抗 / 配線
  • Research Projects

    (1 results)
  • Research Products

    (7 results)
  •  Thermal Management of Ru and Graphene Interconnects in Next-Generation Logic SemiconductorsPrincipal Investigator

    • Principal Investigator
      Zhan Tianzhuo
    • Project Period (FY)
      2021 – 2023
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Review Section
      Basic Section 29020:Thin film/surface and interfacial physical properties-related
    • Research Institution
      Toyo University

All 2023 2022 2021

All Journal Article Presentation

  • [Journal Article] Effects of Thermal Boundary Resistance on Thermal Management of Gallium-Nitride-Based Semiconductor Devices: A Review2023

    • Author(s)
      Zhan Tianzhuo、Xu Mao、Cao Zhi、Zheng Chong、Kurita Hiroki、Narita Fumio、Wu Yen-Ju、Xu Yibin、Wang Haidong、Song Mengjie、Wang Wei、Zhou Yanguang、Liu Xuqing、Shi Yu、Jia Yu、Guan Sujun、Hanajiri Tatsuro、Maekawa Toru、Okino Akitoshi、Watanabe Takanobu
    • Journal Title

      Micromachines

      Volume: 14 Issue: 11 Pages: 2076-2076

    • DOI

      10.3390/mi14112076

    • Peer Reviewed / Open Access / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886, KAKENHI-PROJECT-23K22800
  • [Journal Article] Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits2022

    • Author(s)
      Zhan Tianzhuo、Sahara Keita、Takeuchi Haruki、Yokogawa Ryo、Oda Kaito、Jin Zhicheng、Deng Shikang、Tomita Motohiro、Wu Yen-Ju、Xu Yibin、Matsuki Takeo、Wang Haidong、Song Mengjie、Guan Sujun、Ogura Atsushi、Watanabe Takanobu
    • Journal Title

      ACS Applied Materials & Interfaces

      Volume: 14 Issue: 5 Pages: 7392-7404

    • DOI

      10.1021/acsami.1c20366

    • Peer Reviewed / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886
  • [Presentation] Effect of Nanoscale Thermal Transport on Thermal Management of Interconnects in Deeply Scaled VLSI2023

    • Author(s)
      Tianzhuo Zhan
    • Organizer
      2nd Global Summit on Nanotechnology and Materials Science GSNMS 2023
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886
  • [Presentation] Thermal Boundary Resistance of Ruthenium Interconnects in Next Generation VLSI2022

    • Author(s)
      Tianzhuo Zhan
    • Organizer
      The 13th Asian Thermophysical Properties Conference
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886
  • [Presentation] Effect of thermal boundary resistance on thermal management of interconnects in logic chips2022

    • Author(s)
      Tianzhuo Zhan
    • Organizer
      3rd International Conference on Materials Science & Nanotechnology
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886
  • [Presentation] Modification of interface between the interconnect and dielectric layers for thermal management of VLSI interconnects2022

    • Author(s)
      Tianzhuo Zhan
    • Organizer
      Advances in Surfaces, Interfaces, and Interphases 2022
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886
  • [Presentation] Modification of thermal boundary resistance for thermal management of interconnect system in advanced VLSI circuits circuits2021

    • Author(s)
      Zhan Tianzhuo
    • Organizer
      The 18th International Symposium on Bioscience and Nanotechnology
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-21K04886

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