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Tatsumi Hiroaki  巽 裕章

ORCIDConnect your ORCID iD *help
Researcher Number 00961757
Affiliation (Current) 2025: 大阪大学, 接合科学研究所, 准教授
Affiliation (based on the past Project Information) *help 2022 – 2023: 大阪大学, 接合科学研究所, 講師
Review Section/Research Field
Principal Investigator
Basic Section 26050:Material processing and microstructure control-related / 0401:Materials engineering, chemical engineering, and related fields
Keywords
Principal Investigator
複合材 / 半導体実装 / はんだ / 光造形3Dプリンティング(SLA) / ラティス構造 / SLA / 光造形3Dプリンティング / 剛性 / ロータス型ポーラス銅 / 接合 / 熱伝導性 / ポーラス材料 / エレクトロニクス実装
  • Research Projects

    (2 results)
  • Research Products

    (11 results)
  •  Development of Solder-based Composite Joints utilizing Carbon MicrolatticesPrincipal Investigator

    • Principal Investigator
      巽 裕章
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 26050:Material processing and microstructure control-related
    • Research Institution
      Osaka University
  •  Development of highly heat-conductive and low stiffness joint utilizing anisotropic microcomposite structurePrincipal Investigator

    • Principal Investigator
      Tatsumi Hiroaki
    • Project Period (FY)
      2022 – 2023
    • Research Category
      Grant-in-Aid for Research Activity Start-up
    • Review Section
      0401:Materials engineering, chemical engineering, and related fields
    • Research Institution
      Osaka University

All 2024 2023 2022

All Journal Article Presentation Patent

  • [Journal Article] Anisotropic highly conductive joints utilizing Cu-solder microcomposite structure for high-temperature electronics packaging2022

    • Author(s)
      Tatsumi Hiroaki、Nishikawa Hiroshi
    • Journal Title

      Materials & Design

      Volume: 223 Pages: 111204-111204

    • DOI

      10.1016/j.matdes.2022.111204

    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Patent] 熱界面構造及び該熱界面構造の形成方法2023

    • Inventor(s)
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Holder
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2023-066481
    • Filing Date
      2023
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023

    • Inventor(s)
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Holder
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Type
      特許
    • Filing Date
      2023
    • Overseas
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2023

    • Inventor(s)
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Holder
      巽裕章,井手拓哉,村上政明,沼田富行
    • Industrial Property Rights Type
      特許
    • Filing Date
      2023
    • Overseas
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Patent] 熱伝導接合構造、熱伝導接合方法、該熱伝導接合構造を有するヒートシンク、並びに該熱伝導接合構造を有する半導体装置2022

    • Inventor(s)
      巽裕章、井手拓哉、村上政明、沼田富行
    • Industrial Property Rights Holder
      巽裕章、井手拓哉、村上政明、沼田富行
    • Industrial Property Rights Type
      特許
    • Industrial Property Number
      2022-133874
    • Filing Date
      2022
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Presentation] Balance between Volumetric Shrinkage and Mechanical Properties of Pyrolyzed Carbon Lattice2024

    • Author(s)
      Yu-Yen Chen, Hiroaki Tatsumi, Hiroshi Nishikawa
    • Organizer
      2024 Japan-Taiwan Workshop on Electronic Interconnection IV
    • Data Source
      KAKENHI-PROJECT-23K13575
  • [Presentation] ロータス型ポーラス銅・はんだ複合構造を活用した高放熱モジュールの試作評価2024

    • Author(s)
      巽 裕章,磯野 浩,平瀬 加奈,井手 拓哉,西川 宏
    • Organizer
      第30回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(Mate2024)
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Presentation] Low Thermal Resistance Joint using Lotus-type Cu/Solder Composite2024

    • Author(s)
      Hiroaki Tatsumi, Hiroshi Isono, Kana Hirase, Takuya Ide, Hiroshi Nishikawa
    • Organizer
      2024 International Conference on Electronics Packaging (ICEP2024)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Presentation] High-Thermal-Performance Power Semiconductor Module using Solder/Copper Composite Joints2023

    • Author(s)
      Hiroaki Tatsumi
    • Organizer
      The 3rd International Symposium on Design & Engineering by Joint Inverse Innovation for Materials Architecture (DEJI2MA-3)
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Presentation] Enhanced Thermal Conductivity in Micro Composite Structure Joints Utilizing Porous Cu Sheets2023

    • Author(s)
      Hiroaki Tatsumi, Hiroshi Nishikawa
    • Organizer
      The 5th International Conference on Nanojoining and Microjoining (NMJ 2023)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-22K20480
  • [Presentation] Thermal and Mechanical Evaluation of Anisotropic Cu-Solder Composite Joint on High Temperature Storage2022

    • Author(s)
      Tatsumi Hiroaki、Nishikawa Hiroshi
    • Organizer
      TMS2023 152nd Annual Meeting Exhibition
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-22K20480

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