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J. Mater. Chem
Volume: 5 Pages: 1155-1164
10.1039/c6tc04892g
J. Electron. Mater.
Volume: 27 Pages: 1055-1060
10.1007/s10854-015-3894-2
Volume: 46 Pages: 1576-1586
10.1007/s11664-016-5200-3
J. Alloys Compd.
Volume: 696 Pages: 123-129
10.1016/j.jallcom.2016.11.225
J. Mater. Sci.
Volume: 51 Pages: 3422-3430
10.1007/s10853-015-9659-8
Corrosion Science
Volume: 112 Pages: 150-159
10.1016/j.corsci.2016.07.004
Appl. Phys. Lett.
Volume: 109
10.1063/1.4962333
Materials and Corrosion
Volume: 67 Pages: 522-530
Scientific Report
Volume: 6
10.1038/srep34769
Appl.Phys.Letters
Volume: 104 Pages: 161603-161603
10.1063/1.4872320
Electronic Materials Letters
Volume: N/A
10.1007/s13391-014-4292-2
Acta Materialia
Volume: 89 Pages: 133-140
10.1016/j.actamat.2015.02.011
10.1016/j.jallcom.2015.02.223
J. Mater. Sci. Mater. Electron
10.1007/s10854-015-2717-9
10.1016/j.corsci.2014.12.014
IEEE Trans. CPMT.
Volume: 5 Pages: 902-909
10.1109/tcpmt.2015.2443058
Physical Chemistry Chemical Physics
Volume: 17 Pages: 31110-31116
10.1039/c5cp04582g
RSC Adv.
Volume: 15 Pages: 27657-27664
10.1039/c5ra02722e
工業材料
Volume: 63 Pages: 40-49
130007502800
J. Mater. Sci.: Mater. Electron.
Volume: 26 Pages: 7277-7289
10.1007/s10854-015-3355-y
RSC Advances
Volume: 5 Pages: 90202-90208
10.1039/c5ra18583a
Materials Letters
10.1016/j.matlet.2015.03.054
Volume: 44 Pages: 3896-3903
10.1007/s11664-015-3919-x
Microelectronics Reliability
Volume: 55 Pages: 2554-2559
10.1016/j.microrel.2015.10.003
Volume: 644 Pages: 113-118
10.1016/j.jallcom.2015.04.168
Volume: 55 Pages: 7183-7191
10.1007/s10854-015-3343-2
Jpn. J. Appl. Phys.
Volume: 53 Issue: 4S Pages: 04EB02-04EB02
10.7567/jjap.53.04eb02
210000143550
Journal of Electronic Materials
Volume: 43 Pages: 1-8
10.1007/s11664-013-2706-9
Volume: 53 Issue: 4S Pages: 04EP06-04EP06
10.7567/jjap.53.04ep06
210000143698
Volume: 25 Pages: 3090-3095
10.1007/s10854-014-1988-x
Volume: 137 Pages: 170-173
10.1016/j.matlet.2014.09.006
J. Electron.Mater.
Volume: 43 Pages: 4428-4434
10.1007/s11664-014-3377-x
Journal of Materials Science: Materials in Electronics
Volume: 24 Pages: 4704-4712
10.1007/s10854-013-1463-0
Volume: -
10.1007/s10854-013-1138-x
Volume: 24 Pages: 3897-3904
10.1007/s10854-013-1336-6
Volume: 24 Pages: 1332-1340
Volume: 24 Pages: 3108-3115
10.1007/s10854-013-1218-y
10.1007/s10854-012-0929-9
電子情報通信学会論文誌
Volume: J95-C [11](in press)
110009543934
Volume: 52 Pages: 375-380
Mater. Trans
Volume: (in press)
10031127211
110009543935
J. Electron. Mater
Volume: 53[12](in press)
10.1016/j.microrel.2011.07.088
J.Mater.Res
Volume: 26[3] Pages: 467-474
J.Mater.Sci.Mater.Electron
10.1007/s10854-011-0346-5
ロボット
Volume: No.203 Pages: 34-37
Volume: 40[11] Pages: 2278-2289
Applied PhysicsLetters
Volume: 98 Pages: 73304-73304
Volume: 59[1] Pages: 7255-7267
2011 International Symposium on Computational Models for Life Science
Volume: CMLS-11
Microelectron. Reliab.
Volume: 51[12] Pages: 2290-2297
J.Electron.Mater.
10.1007/s11664-011-1712-z
J. Mater. Res.
Volume: 26[20] Pages: 2624-2631
J.Mater.Res.
J. Mater. Sci. Mater. Electron.
Volume: 21 Pages: 1066-1075
銅と銅合金
Volume: 49 Pages: 122-115
Volume: 49 Pages: 112-115
第23回秋季信頼性シンポジウム発表報文集、東京
Pages: 15-18
Volume: 25[11] Pages: 2175-2182
生産と技術
Volume: 62[3] Pages: 16-19
40017219420
Volume: Vol.62、No.3 Pages: 16-19
Volume: J93-C Pages: 399-405
110007880209
IEEE Transactions on Components and Packaging Technologies (未定)(印刷中)
エレクトロニクス実装学会誌 Vol.12, No.1
Pages: 79-85
110007021785
電子材料 Vol.48, No.2
Pages: 67-73
Materials Chemistry and Physics 114
Pages: 333-338
Conditions, IEEE Trans.CPMT (in press)
電子材料 48[2]
コンバーテック No.7
Pages: 1-4
Scripta Materialia 59[6]
Pages: 649-652
月刊ディスプレイ 14[6]
Pages: 41-47
コンバーテツク 7
IEEE Polytronic 2008 Conference Garmisch-Partenkirchen, Germany, August
Pages: 17-20
Scripta Materialia 59
Proc. IEEE Polytronic 2008 Conference, Garmisch-Partenkirchen, Germany
エレクトロニクス実装学会 (MES2008)
Pages: 147-150
エレクトロニクス実装学会マイクロエレクトロシンポジウム2008論文集 18
International Conference on High Density Packaging (HDP2007) IEEE CPMT June 27-28th, Shanghai
Tokyo, Japan
Pages: 110-113
Proc.6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Polymer Degradation and Stability 92[10]
Pages: 1833-1840
MES2007(第17回マイクロエレクトロニクスシンポジウム)
Pages: 35-38
Vol.54, No.3
Pages: 186-193
6th International IEEE Conference on Polymer and Adhesives in microelectronics and Photonics(Tokyo)
Pages: 30-35
Chemical Physics Letters 441
Pages: 305-308
6th International IEEE Conference on Polymer and Adhesives in microelectronics and Photonics
日本接着剤学会誌 43
Pages: 220-224
Microelectronics Reliability 46 (5-6)
Pages: 850-858
39th International Symposium on Microelectronics (IMAPS2006)
Pages: 1050-1055
Key Engineering Materials 317-318
Pages: 231-234
Soldering & Surface Mount Technology 18[2]
Pages: 40-45
Soldering ＆ Surface Mount Technology 18[2]
J. Mater. Sci. 41(2)
Pages: 583-585
粉砕 50
Pages: 27-31
130007495280
第16回マイクロエレクトロニクスシンポジウ
Pages: 339-343
Microelectronics Reliability 46[7]
Pages: 1113-1118
San Diego October 8-12
Microelectronics Reliability 46(5-6)
J. Mater. Sci. 41 (2)
Proc. 7th IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05)
Pages: 128-133
Transactions on Components, Packaging and Manufacturing Technology
