KAJIHARA Masanori 梶原正憲

Researcher Number	10161035
External Links
Affiliation (based on the past Project Information) *help	2004 – 2005: 東京工業大学, 大学院・総合理工学研究科, 助教授 1994 – 2000: 東京工業大学, 大学院・総合理工学研究科, 助教授 1993: 東京工業大学, 総合理工学研究科, 助教授
Review Section/Research Field	Principal Investigator Physical properties of metals / Physical properties of metals Except Principal Investigator Structural/Functional materials
Keywords	Principal Investigator 粒界拡散 / 粒界移動 / Cu-Fe二元系合金 / 溶解反応 / Eco-materials / Pb-free solders / Electronic devices / Soldering / Intermetallics / Reactive diffusion … More / Conductor materials / 固相接合 / 固相反応 / 電子材料 / 低環境負荷材料 / 無鉛はんだ合金 / 電子機器 / はんだ接合 / 金属間化合物 / 反応拡散 / 導電性材料 / Silica particle / Mechanical property / Tilt boundary / Bicrystal / Boundary energy / シリカ粒子 / 透過型電子顕微鏡 / 傾角粒界 / 双結晶 / 粒界エネルギー / Interdiffusion / Dissolution Reaction / Fe-Cu Binary System / Diffusion Controlled Grain Boundary Migration / Diffusion Induced Recrystallization / 相互拡散 / 拡散律速型界面移動 / 拡散誘起再結晶 / 化学的駆動力 / 再結晶 / 拡散律速型相変態 / 拡散対 / 全率固溶体 / 組織変化 / 拡散型相変態 / 整合析出 / 界面移動 / 析出反応 / 拡散律速型変態 … More Except Principal Investigator Elasticity / Creep / Orowan mechanism / Diffusional relaxation / High-temperature deformation / Dispersion-hardened alloys / 弾性論 / クリープ / オロワン機構 / 拡散緩和 / 高温変形 / 分散強化合金 Less

Development and Analysis of New Conductor Materials for Electronic IndustryPrincipal Investigator
- Principal Investigator
  
  KAJIHARA Masanori
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Physical properties of metals
- Research Institution
  Tokyo Institute of Technology
構造変化を伴わない純粋な拡散律速型界面・粒界移動による組成不連続相変態の反応挙動Principal Investigator
- Principal Investigator
  
  梶原正憲
- Project Period (FY)
  1999
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas (A)
- Research Institution
  Tokyo Institute of Technology
Relationships between character and mechanical properties of symmetric and asymmetric grain boundariesPrincipal Investigator
- Principal Investigator
  
  KAJIHARA Masanori
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Physical properties of metals
- Research Institution
  Tokyo Institute of Technology
拡散誘起再結晶を利用して界面性格を制御した拡散型相変態の反応挙動Principal Investigator
- Principal Investigator
  
  梶原正憲
- Project Period (FY)
  1998
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas (A)
- Research Institution
  Tokyo Institute of Technology
High-Temperature Deformation and Diffusional Relaxation of Particle-Dispersion Hardened Alloys
- Principal Investigator
  
  KATO Masaharu
- Project Period (FY)
  1995 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Tokyo Institute of Technology
A New Alloy Design Method utilizing Diffusion Induced RecrystallizationPrincipal Investigator
- Principal Investigator
  
  KAJIHARA Masanori
- Project Period (FY)
  1994 – 1995
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  Physical properties of metals
- Research Institution
  Tokyo Institute of Technology
安定相および準安定相の共存する合金中の析出・溶解反応Principal Investigator
- Principal Investigator
  
  梶原正憲
- Project Period (FY)
  1993
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  Physical properties of metals
- Research Institution
  Tokyo Institute of Technology

All 2006 2005 Other

All Journal Article

[Journal Article] Fast penetration of Sn into Ag by diffusion induced recrystallization2006
- Author(s)
  T.Takenaka, M.Kajihara
- Journal Title
  
  Mater Trans. 47[3]
  
  Pages: 822-828
- NAID
  10017960171
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Effect of Ni on reactive diffurion between Au and Sn at solid state temperatures2006
- Author(s)
  M.Mita, K.Miura, T.Takenaka, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Sci.Eng.B 126[1]
  
  Pages: 37-43
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Kinetic features of reactive diffusion in binary systems2006
- Author(s)
  M.Kajihara
- Journal Title
  
  Defect and Diffusion Forum 249
  
  Pages: 91-96
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Fast Penetration of Sn into Ag by Diffusion Induced Recrystallization2006
- Author(s)
  T.Takenaka, M.Kajihara
- Journal Title
  
  Mater.Trans. 47・3
  
  Pages: 822-828
- NAID
  10017960171
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb2006
- Author(s)
  T.Yamashina, M.Kajihara
- Journal Title
  
  Mater.Trans. 47・3
  
  Pages: 829-837
- NAID
  10017960212
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Chemical driving force for diffusion induced recrystallization or diffusion induced grain boundary migration in a binary system consisting of nonvolatile elements2006
- Author(s)
  M.Kajihara
- Journal Title
  
  Scripta Mater. 54
  
  Pages: 1767-1772
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb2006
- Author(s)
  T.Yamashina, M.Kajihara
- Journal Title
  
  Mater. Trans. 47・3
  
  Pages: 829-837
- NAID
  10017960212
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Fast Penetration of Sn into Ag by Diffusion Induced Recrystallization2006
- Author(s)
  T.Takenaka, M.Kajihara
- Journal Title
  
  Mater. Trans. 47・3
  
  Pages: 822-828
- NAID
  10017960171
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Quantitative explanation for uphill diffusion of Sn during reactive diffusion between Cu-Sn alloys and Nb2006
- Author(s)
  T.Yamashina, M.Kajihara
- Journal Title
  
  Mater.Trans. 47[3]
  
  Pages: 829-837
- NAID
  10017960212
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Effect of Ni on reactive diffusion between Au and Sn at solid state temperatures2006
- Author(s)
  M.Mita, M.Kajihara et al.
- Journal Title
  
  Mater. Sci. Eng. B 126・1
  
  Pages: 37-43
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Effect of Ni on reactive diffusion between Au and Sn at solid state temperatures2006
- Author(s)
  M.Mita, M.Kajihara et al.
- Journal Title
  
  Mater.Sct.Eng.B 126・1
  
  Pages: 37-43
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Ni_3Sn_4 layer during reactive diffusion between Ni and Sn at solid state temperatures2005
- Author(s)
  M.Mita, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Sci.Eng.A 403[1-2]
  
  Pages: 269-275
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Nb_3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb2005
- Author(s)
  Y.Muranishi, M.Kajihara
- Journal Title
  
  Mater.Sci.Eng.A 404[1-2]
  
  Pages: 33-41
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Pd and Sn at solid-state temperatures2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater.Sct.Eng.A 406・1-2
  
  Pages: 134-141
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Pd and Sn atsolid-state temperatures2005
- Author(s)
  T.Takenaka, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Sci.Eng.A 406[1-2]
  
  Pages: 134-141
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive Diffusion between Ag and Sn at Solid State Temperatures2005
- Author(s)
  K.Suzuki, M.Kajihara et al.
- Journal Title
  
  Mater.Trans. 46・5
  
  Pages: 969-973
- NAID
  10015701932
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433 to 473 K2005
- Author(s)
  T.Takenaka, S.Kano, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Sci.Eng.A 396[1]
  
  Pages: 115-123
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Au-Sn and Ag-Sn compounds during solid-state reactive diffusion between Au-Ag alloys and Sn2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater.Trans. 46・8
  
  Pages: 1825-1832
- NAID
  130004823910
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Temperature dependence of kinetics for reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater. Trans. 46・10
  
  Pages: 2142-2149
- NAID
  10018277439
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Ni_3Sn_4 layer during reactive diffusion between Ni and Sn at solid state temperatures2005
- Author(s)
  M.Mita, M.Kajihara et al.
- Journal Title
  
  Mater. Sci. Eng. A 403・1-2
  
  Pages: 269-275
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Nb_3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb2005
- Author(s)
  Y.Muranishi, M.Kajihara
- Journal Title
  
  Mater. Sci. Eng. A 404・1-2
  
  Pages: 33-41
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Relationship between temperature dependence of interdiffusion and kinetics of reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater. Sci. Eng. A 403・1-2
  
  Pages: 234-240
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Au-Sn and Ag-Sn compounds during solid-state reactive diffusion between Au-Ag alloys and Sn2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater. Trans. 46・8
  
  Pages: 1825-1832
- NAID
  130004823910
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Au-Sn and Ag-Sn compounds during solid-state reactive diffusion between Au-Ag alloys and Sn2005
- Author(s)
  T.Takenaka, S.Kano, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Trans. 46[8]
  
  Pages: 1825-1832
- NAID
  130004823910
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433 to 473 K2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater. Sci. Eng. A 396・1
  
  Pages: 115-123
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433 to 473 K2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater.Sct.Eng.A 396・1
  
  Pages: 115-123
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Relationship between temperature dependence of interdiffusion and kinetics of reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater.Sci.Eng.A 403[1-2]
  
  Pages: 234-240
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Relationship between temperature dependence of interdiffusion and kinetics of reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater.Sci.Eng.A 403・1-2
  
  Pages: 234-240
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Temperature dependence of kinetics for reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater.Trans. 46[10]
  
  Pages: 2142-2149
- NAID
  10018277439
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Nb_3Sn layer during reactive diffusion between Cu-8.3Sn alloy and Nb2005
- Author(s)
  Y.muranishi, M.Kajihara
- Journal Title
  
  Mater.Sci.Eng.A 404・1-2
  
  Pages: 33-1
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Ag and Sn at solid state temperatures2005
- Author(s)
  K.Suzuki, S.Kano, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Trans. 46[5]
  
  Pages: 969-973
- NAID
  10015701932
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of Ni_3Sn_4 layer during reactive diffusion between Ni and Sn at solid state temperatures2005
- Author(s)
  M.Mita, M.Kajihara et al.
- Journal Title
  
  Mater.Sct.Eng.A 403・1-2
  
  Pages: 269-275
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive Diffusion between Ag and Sn at Solid State Temperatures2005
- Author(s)
  K.Suzuki, M.Kajihara et al.
- Journal Title
  
  Mater. Trans. 46・5
  
  Pages: 969-973
- NAID
  10015701932
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Temperature dependence of kinetics for reactive diffusion in a hypothetical binary system2005
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater.Trans. 46・10
  
  Pages: 2142-2149
- NAID
  10018277439
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Pd and Sn at solid-state temperatures2005
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater. Sci. Eng. A 406・1-2
  
  Pages: 134-141
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive Diffusion between Ag and Sn at Solid State Temperatures
- Author(s)
  K.Suzuki, S.Kano, M.Kajihara et al.
- Journal Title
  
  Materials Transactions (印刷中)
- NAID
  10015701932
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Kinetics of reactive diffusion in the (Au-Ni)/Sn system at solid-state temperatures
- Author(s)
  Y.Yato, M.Kajihara
- Journal Title
  
  Mater.Sci.Eng.A (in press)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Ag-Au alloys and Sn at solid-sate temperatures
- Author(s)
  T.Takenaka, M.Kajihara et al.
- Journal Title
  
  Mater. Sci. Eng. A (in press)
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Quantitative evaluation of interdiffusion in Fe_2Al_5 during reactive diffusion in the binary Fe-Al system
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater. Trans. (in press)
- NAID
  10018160328
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Kinetics of reactive diffusion in the (Au-Ni)/Sn system at solid-state temperatures
- Author(s)
  Y.Yato, M.Kajihara
- Journal Title
  
  Mater. Sci. Eng. A (in press)
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Growth behavior of compound layers in Sn/Cu/Sn diffusion couples during annealing at 433 to 473 K
- Author(s)
  T.Takenaka, S.Kano, M.Kajihara et al.
- Journal Title
  
  Materials Science and Engineering A (印刷中)
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Quantitative evaluation of interdiffusion in Fe_2Al_5 during reactive diffusion in the binary Fe-Al system
- Author(s)
  M.Kajihara
- Journal Title
  
  Mater.Trans. (in press)
- NAID
  10018160328
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575
[Journal Article] Reactive diffusion between Ag-Au alloys and Sn at solid-state temperatures
- Author(s)
  T.Takenaka, M.Kajihara, N.Kurokawa, K.Sakamoto
- Journal Title
  
  Mater.Sci.Eng.A (in press)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560575

1. KATO Masaharu (50161120)

# of Collaborated Projects: 6 results

# of Collaborated Products: 0 results
2. ONAKA Susumu (40194576)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. FUJII Toshiyuki (40251665)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

KAJIHARA Masanori 梶原 正憲

Research Projects

Research Products

Co-Researchers

Development and Analysis of New Conductor Materials for Electronic IndustryPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

構造変化を伴わない純粋な拡散律速型界面・粒界移動による組成不連続相変態の反応挙動Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Institution

Relationships between character and mechanical properties of symmetric and asymmetric grain boundariesPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

拡散誘起再結晶を利用して界面性格を制御した拡散型相変態の反応挙動Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Institution

High-Temperature Deformation and Diffusional Relaxation of Particle-Dispersion Hardened Alloys

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

A New Alloy Design Method utilizing Diffusion Induced RecrystallizationPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

安定相および準安定相の共存する合金中の析出・溶解反応Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Fast penetration of Sn into Ag by diffusion induced recrystallization2006

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] Effect of Ni on reactive diffurion between Au and Sn at solid state temperatures2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] Kinetic features of reactive diffusion in binary systems2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] Fast Penetration of Sn into Ag by Diffusion Induced Recrystallization2006

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb2006

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Chemical driving force for diffusion induced recrystallization or diffusion induced grain boundary migration in a binary system consisting of nonvolatile elements2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] Quantitative Explanation for Uphill Diffusion of Sn during Reactive Diffusion between Cu-Sn Alloys and Nb2006

Author(s)

Journal Title

NAID

Description

KAJIHARA Masanori 梶原正憲