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Japanese Journal of Applied Physics
Volume: 63
化学工学(ISSN: 0375-9253)
Volume: 87 Pages: 33-36
マテリアルステージ
Volume: 23 Pages: 37-43
化学工学
Proceedings of the 71st Electronic Components and Technology Conference (ECTC 2023)
Volume: none Pages: 444-449
10.1109/ectc51909.2023.00080
オプトロニクス
Volume: 42 Pages: 112-116
Applied Physics Express
Volume: 15 Issue: 11 Pages: 111004-111004
10.35848/1882-0786/ac9d24
機能材料
Volume: 3 Pages: 1-9
Journal of Vacuum Science & Technology B
Volume: 40 Issue: 5 Pages: 052202-052202
10.1116/6.0001836
Volume: 60 Issue: SB Pages: SBBC02-SBBC02
10.35848/1347-4065/abdb81
Volume: 14 Issue: 9 Pages: 091003-091003
10.35848/1882-0786/ac18b0
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 10 Issue: 8 Pages: 1419-1422
10.1109/tcpmt.2020.3009640
Impact
Volume: February Issue: SG Pages: 1-3
10.35848/1347-4065/ab75b8
電子情報通信学会論文誌 C
Volume: J103-C Pages: 183-185
Volume: 59 Issue: SB Pages: SBBA04-SBBA04
10.7567/1347-4065/ab4f3c
210000157397
Volume: 9 Issue: 1 Pages: 181-188
10.1109/tcpmt.2018.2871764
IEEE TRANSACTIONS DEVICE LETTERS
Volume: 40 Issue: 1 Pages: 95-98
10.1109/led.2018.2884452
IEEE Journal of the Electron Devices Society
Volume: 7 Pages: 1225-1231
10.1109/jeds.2019.2936180
Sensors and Materials
Volume: 30 Pages: 225-234
Volume: J101-C Pages: 58-65
表面技術
Volume: 67(8) Pages: 410-420
130005875872
IEEE TRANSACTIONS ON ELECTRON DEVICES
Volume: 64 Issue: 12 Pages: 5065-5072
10.1109/ted.2017.2767598
Volume: 67 Pages: 414-420
ECS Transactions
Volume: 75 Issue: 9 Pages: 285-290
10.1149/07509.0285ecst
電子情報通信学会誌C
Volume: J99-C Pages: 493-500
Volume: 55 Issue: 4S Pages: 04EC07-04EC07
10.7567/jjap.55.04ec07
Volume: 55 Issue: 4S Pages: 04EC03-04EC03
10.7567/jjap.55.04ec03
210000146283
Micromachines
Volume: 7 Issue: 10 Pages: 184-184
10.3390/mi7100184
Journal of Microelectromechanical Systems
Volume: 25 Issue: 1 Pages: 91-100
10.1109/jmems.2015.2480787
IEEE Electron Device Letters
Volume: 37 Issue: 1 Pages: 81-83
10.1109/led.2015.2502584
MRS BULLETIN
Volume: 40 Issue: 3 Pages: 242-247
10.1557/mrs.2015.33
IEEE International Electron Devices Meeting (IEDM) Technical Digest
Volume: - Pages: 669-672
Volume: Vol.61, No.2 Issue: 2 Pages: 533-539
10.1109/ted.2013.2294831
Volume: 61 Issue: 2 Pages: 540-546
10.1109/ted.2013.2295463
Volume: 61 Pages: 374-377
10.1109/iedm.2014.7047054
Volume: 52
Proc. of IEEE 63rd ECTC
Volume: 63 Pages: 891-896
Japanese Journal of Applied Physics (JJAP)
Volume: 52 Issue: 4S Pages: 04CB09-04CB09
10.7567/jjap.52.04cb09
210000141985
Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
10.1109/ted.2013.2280273
IEEE ELECTRON DEVICES LETTERS
Volume: Vol.33 Issue: 2 Pages: 221-223
10.1109/led.2011.2174608
2012 IEEE International Electron Devices Meeting Technical Digest (IEDM)
Volume: - Pages: 789-792
10.1109/iedm.2012.6479157
Volume: - Pages: 657-660
10.1109/iedm.2012.6479124
Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
10.1109/ted.2012.2212709
JOURNAL of Micromechanics and Microengineering
Volume: Vol.22(8) Issue: 8 Pages: 085033-085033
10.1088/0960-1317/22/8/085033
Journal of ELECTRONIC MATERIALS
Volume: Vol.41(4) Issue: 4 Pages: 720-729
10.1007/s11664-012-1949-1
Proc. of IEEE 62nd Electronic Components and Technology Conference
Volume: - Pages: 393-398
10.1109/ectc.2012.6248860
Volume: 58 Issue: 3 Pages: 748-757
10.1109/ted.2010.2099870
電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)
Volume: Vol.J94-C Pages: 394-401
110008761542
Volume: VOL.1 Issue: 12 Pages: 1873-1884
10.1109/tcpmt.2011.2160266
IEEE TRANSACTIONS ON COMPONENTS, PAC KAGING AND MANUFACTURING TECHNOLOGY
Volume: 1 Pages: 1873-1884
Volume: Vol. 1 Pages: 1873-188
Micromachins
Volume: vol.2 Pages: 49-68
Volume: Vol.58 Pages: 748-757
Volume: vol.2 Issue: 1 Pages: 49-68
10.3390/mi2010049
Volume: Vol.J94-C Pages: 411-418
110008761544
Volume: Volume 32 Issue: 7 Pages: 940-942
10.1109/led.2011.2141109
Volume: 2 Pages: 49-68
Volume: Vol.J94-C(招待論文) Pages: 355-364
110008761537
電子情報通信学会論文誌C
Volume: Vol.J93-C Pages: 493-502
APL
Volume: vol.96 Pages: 154105-154105
IEEE Transactions on Nanotechnology (in press)
Applied Physics Letters
Volume: 96
電子材料
Volume: 49 Pages: 17-24
ECS (Electrochemical Society) Transactions
Volume: Vol.33 Pages: 71-90
Japanese Journal of Applied Physics (未定, 印刷中)
40017176042
Volume: VOL.96 Issue: 15
10.1063/1.3328098
Applied Physics Letters Vol.96
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS
Volume: Vol.19 Pages: 1284-1291
電子情報通信学会誌
Volume: Vol.93(招待論文) Pages: 918-922
110007880868
Japanese Journal of Applied Physics (in print)
Volume: Vol.96
Volume: J93-C Pages: 493-502
Volume: Vol.2 Pages: 49-68
電子情報通信学会 和文誌C
Volume: Vol.49 Pages: 17-24
Applied Physics Letters 96(accepted)
ECS Transactions 16
Pages: 27-32
Applied Physics Letters 94
Pages: 63108-63108
Applied Physics Letters 95
Pages: 33118-33118
120003728303
ECS Trans. 18
Pages: 33-37
IEEE IEDM Technical Digest
Pages: 349-352
110008001112
Japanese Journal of Applied Physics Vol.48,No.4
210000066668
エレクトロニクス実装学会誌 12
Pages: 104-109
110007122665
Proceedings of the IEEE Vol.97
Pages: 49-59
Japanese Journal of Applied Physics Vol.48
210000066624
Japanese Journal of Applied Physics 48
Pages: 105-109
エレクトロニクス実装学会誌 Vol.12
ECS Transactions Vol.16
Japanese Journal of Applied Physics C157-1C157-4
Appl. Phys. Lett. 94
210000066588
Semiconductor Science and Technology 24
Pages: 45022-45022
Applied Physics Letter 95
Volume: VOL.48 Issue: 4S Pages: 04C113-04C113
10.1143/jjap.48.04c113
Applied Physics Letter 94
Proceedings of THE IEEE 97
Applied Physics Letter 93
Pages: 113115-113117
120002338347
Japanese Journal of Applied Physics Vol.47
Pages: 2936-2940
Journal of Applied Physics 104
Pages: 74316-74316
Japanese Journal of Applied Physics 47
Pages: 2680-2683
210000064565
Appl. Phys. Lett. 93
International Electron Devices Meeting (IEDM) Technical Digest
Pages: 499-502
応用物理学会分科会 シリコンテクノロジー「多層配線」特集号 No.99
Pages: 34-37
110006935847
International Electron Devices Meeting(IEDM) Technical Digest
JOURNAL OF APPLIED PHYSICS 104
応用物理学会分科会シリコンテクノロジー「多層配線」特集号 No.99
Jpn. J. Appl. Phys. 47
Pages: 2801-2806
IEEE International Electron Devices Meeting
Pages: 985-988
120002070107
Japanese Journal of Applied Physics 46
Pages: 2167-2171
10022547399
IEEE International Electron Devices Meeting (IEDM) Tech. Dig.
Japanese Journal of Applied Physics Vol.45
Pages: 2965-2969
Japanese Journal of Applied Physics (JJAP) 45(4B)
Pages: 3030-3035
10022540983
Japanese Journal of Applied Physics Vol. 45, No. 4B
Surface and Interface Analysis 38,12-13
Pages: 1720-1724
Japanese Journal of Applied Physics Vol.45,No.4B
Pages: 3032-3035
Japan Journal of Applied Physics (JJAP) 45(4B)(In press)
Manuscript of International Conference on Electronics Packaging (ICEP)
Pages: 220-224
Japanese Journal of Applied Physics 45
Pages: 2984-2986
10022542578
Japanese Journal of Applied Physics Vol. 45
Pages: 359-362
120002070106
Extended Abstracts of SSDM International Conf.on Solid State Devices and Materials
Pages: 64-65
IEEE International Electron Device Meeting (IEDM) Tech. Dig.
The 2005 International Conference on Solid State Devices and Materials