Mariappan Murugesan マリアッパンムルゲサン

… Alternative Names

マリアッパンムルゲサンマリアッパンムルゲサン

MARIAPPAN Murugesan マリアッパンムルゲサン

MURUGESAN Mariappan ムルゲサンマリアッパン

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Researcher Number	10509699
Affiliation (Current)	2025: 東北大学, 未来科学技術共同研究センター, 学術研究員
Affiliation (based on the past Project Information) *help	2019 – 2023: 東北大学, 未来科学技術共同研究センター, 学術研究員 2011 – 2014: 東北大学, 未来科学技術共同研究センター, 産学官連携研究員
Review Section/Research Field	Except Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Electronic materials/Electric materials / Electron device/Electronic equipment
Keywords	Except Principal Investigator TSV / FHE / 3D-IC / チップレット / フレキシブル集積 / 垂直配線 / システムインテグレーション / 実装工学 / フレキシブルインターコネクト / 半導体実装工学 … More / Cuピラー / アセンブリ / マストランスファー / 半導体パッケージング工学 / 表面張力 / 貫通配線 / 微小コンポーネント / 自己組織化実装 / ナノアセンブリ / 自己組織化 / ナノ配線 / 染色 / ナノワイヤ / 誘導自己組織化 / 超微細配線 / ブロック高分子 / DSA / 三次元集積 / フレキシブルコイル / 高分子材料 / 応力 / マイクロXRD / PDMS / ウエハレベルパッケージ / 応力エンジニアリング / 応力解析 / 埋め込みデバイス / 無線給電 / 三次元実装 / 人工網膜 / 常温接合 / FOWLP / マイクロLEDディスプレイ / 材料力学 / 応力制御 / 半導体パッケージ / フレキシブルデバイス / ＴＳＶ / ポリイミド / 気相堆積重合 / 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ Less

Holistic Integration Engineering with Micro-assembly and Wirelets
- Principal Investigator
  
  福島誉史
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Challenging Research (Pioneering)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Nano-Interconnect Formation by Directed Self-Assembly with Staining
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2020 – 2021
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress Engineering
- Principal Investigator
  
  Fukushima Takafumi
- Project Period (FY)
  2019 – 2023
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (B))
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Tohoku University
Thermally Stable Thin Polymeric Multi-Layer Fromation with ALD
- Principal Investigator
  
  FUKUSHIMA Takafumi
- Project Period (FY)
  2013 – 2014
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Tohoku University
High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

All 2021 2020 2014 2013 2012 2011 Other

All Journal Article Presentation

[Journal Article] Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics2021
- Author(s)
  M. Mariappan, Y. Susumago, K. Sumitani, Y. Imai, S. Kimura, T. Fukushima
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 60 Issue: SB Pages: SBBC02-SBBC02
- DOI
  10.35848/1347-4065/abdb81
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19KK0101
[Journal Article] Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration2014
- Author(s)
  M. Murugesan , T. Fukushima, J.C. Bea, Y. Sato, H. Hashimoto, K.W. Lee , and M. Koyanagi
- Journal Title
  
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
  
  Volume: 61 Pages: 374-377
- DOI
  10.1109/iedm.2014.7047054
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25630118
[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Presentation] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD2020
- Author(s)
  M. Murugesan, Y. Susumago, T. Odashima, H. Kino, T. Tanaka, K. Sumitani, Y. Imai, S. Kimura, and T. Fukushima
- Organizer
  The 2020 International Conference on Solid State Devices and Materials (SSDM)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19KK0101
[Presentation] Revisiting the Silicon-Lattice in the High-Density 3D-LSIs in the Perspective of Device Reliability2013
- Author(s)
  85. M. Murugesan, T. Fukushima, J.C. Bea, K.W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) Technical Digest
- Place of Presentation
  米国、Washington DC
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization2013
- Author(s)
  165. T. Fukushima, M. Murugesan, J. Bea, K.W. Lee, M. Koyanagi
- Organizer
  Extended Abstract of International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  福岡
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Characterization of Vapor Deposited Polyimides and Process Integration with the Polymeric Liner for Via-Last/Backside-Via Cu-TSV Formation
- Author(s)
  Takafumi Fukushima, Murugesan Mariappan, Jichoel Bea, Kang-Wook Lee, and Mitsumasa Koyanagi
- Organizer
  International Conference on Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくば国際会議場（つくば市竹園2-20-3）
- Year and Date
  2014-09-09 – 2014-09-11
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] Replacing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits
- Author(s)
  Murugesan Mariappan, Takafumi Fukushima, JiChel Beatrix, Hiroyuki Hashimoto, Yutaka Sato, Kangwook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
- Organizer
  the 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Orlando, Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-25630118
[Presentation] 高分子材料を用いた三次元集積技術III：気相堆積ポリイミドTSVライナーの形成と特性評価
- Author(s)
  福島誉史，Murugesan Mariappan，裵　志哲，橋本宏之，佐藤　優，李　康旭，小柳光正
- Organizer
  エレクトロニクス実装学会　第29回春季講演大会
- Place of Presentation
  東京大学（東京都文京区本郷7-3-1）
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-25630118

1. FUKUSHIMA Takafumi (10374969)

# of Collaborated Projects: 5 results

# of Collaborated Products: 16 results
2. BEA Jichel (40509874)

# of Collaborated Projects: 3 results

# of Collaborated Products: 11 results
3. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 2 results

# of Collaborated Products: 8 results
4. LEE KANGWOOK (90534503)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
5. TANAKA Tetsu (40417382)

# of Collaborated Projects: 1 results

# of Collaborated Products: 8 results
6. 裴艶麗 (70451622)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 木野久志 (10633406)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
8. 清山浩司 (60412722)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
9. 橋本宏之 (80589432)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Mariappan Murugesan マリアッパン ムルゲサン

マリアッパン ムルゲサン マリアッパン ムルゲサン

MARIAPPAN Murugesan マリアッパン ムルゲサン

MURUGESAN Mariappan ムルゲサン マリアッパン

Research Projects

Research Products

Co-Researchers

Holistic Integration Engineering with Micro-assembly and Wirelets

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Nano-Interconnect Formation by Directed Self-Assembly with Staining

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Heterogeneous System Integration of Flexible Electronics Based on Multi-Scale Stress Engineering

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Thermally Stable Thin Polymeric Multi-Layer Fromation with ALD

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

High Performance, Low Power Hetero-CMOS Device using Compound Si Wafer

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Laue microdiffraction evaluation of bending stress in Au wiring formed on chip-embedded flexible hybrid electronics2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Highly Beneficial Organic Liner with Extremely Low Thermal Stress for Fine Cu-TSV in 3D-Integration2014

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011

Author(s)

Journal Title

DOI

Data Source

[Presentation] Evaluation of bending stress in Au-wiring formed over FHE by micro-XRD2020

Author(s)

Organizer

Data Source

[Presentation] Revisiting the Silicon-Lattice in the High-Density 3D-LSIs in the Perspective of Device Reliability2013

Author(s)

Organizer

Place of Presentation

Data Source

[Presentation] Low-Temperature and High-Step-Coverage Polyimide TSV Liner Formation by Vapor Deposition Polymerization2013

Author(s)

Organizer

Place of Presentation

Mariappan Murugesan マリアッパンムルゲサン

マリアッパンムルゲサンマリアッパンムルゲサン

MARIAPPAN Murugesan マリアッパンムルゲサン

MURUGESAN Mariappan ムルゲサンマリアッパン