XU BIN 許斌

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Bin Xu 許斌

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Researcher Number	20849533
Other IDs
Affiliation (Current)	2025: 東京大学, 大学院工学系研究科(工学部), 特任講師
Affiliation (based on the past Project Information) *help	2022 – 2024: 東京大学, 大学院工学系研究科(工学部), 特任助教
Review Section/Research Field	Principal Investigator Basic Section 19020:Thermal engineering-related Except Principal Investigator Medium-sized Section 19:Fluid engineering, thermal engineering, and related fields
Keywords	Principal Investigator 二次元材料 / 熱伝導率制御 / フォノン波動性輸送 / 4フォノン散乱 / 熱伝導 / 界面 / 自己組織化単層膜 / ダイヤモンド / グラフェン / ミスマッチ界面 … More / フォノンエンジニアリング / 自己組織化単相膜 / ミスマッチ系統 / 界面熱伝導 … More Except Principal Investigator ナノ構造 / 熱輸送 / 非晶質 / フォノンエンジニアリング Less

Innovative phonon engineering in two-dimensional material systemsPrincipal Investigator
- Principal Investigator
  
  許斌
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 19020:Thermal engineering-related
- Research Institution
  The University of Tokyo
Elucidatig the mechanism and promoting the thermal conduction at mismatched interfacePrincipal Investigator
- Principal Investigator
  
  Bin Xu
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 19020:Thermal engineering-related
- Research Institution
  The University of Tokyo
Developing Science of Amorphous Phonon Engineering
- Principal Investigator
  
  塩見淳一郎
- Project Period (FY)
  2022
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 19:Fluid engineering, thermal engineering, and related fields
- Research Institution
  The University of Tokyo

All 2024 2023 2022

All Journal Article Presentation

[Journal Article] Unraveling the mechanisms of thermal boundary conductance at the graphene-silicon interface: Insights from ballistic, diffusive, and localized phonon transport regimes2024
- Author(s)
  Yue Jincheng、Hu Shiqian、Xu Bin、Chen Rongkun、Xiong Long、Guo Rulei、Li Yuanzhe、Nian Lei-Lei、Shiomi Junichiro、Zheng Bo
- Journal Title
  
  Physical Review B
  
  Volume: 109 Issue: 11 Pages: 115302-115302
- DOI
  10.1103/physrevb.109.115302
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189
[Journal Article] Extremely suppressed thermal conductivity of large-scale nanocrystalline silicon through inhomogeneous internal strain engineering2023
- Author(s)
  Xu Bin、Liao Yuxuan、Fang Zhenglong、Li Yifei、Guo Rulei、Nagahiro Ryohei、Ikoma Yoshifumi、Kohno Masamichi、Shiomi Junichiro
- Journal Title
  
  Journal of Materials Chemistry A
  
  Volume: 11 Issue: 35 Pages: 19017-19024
- DOI
  10.1039/d3ta03011c
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189
[Journal Article] Enhanced High Thermal Conductivity Cellulose Filaments via Hydrodynamic Focusing2022
- Author(s)
  Wang Guantong、Kudo Masaki、Daicho Kazuho、Harish Sivasankaran、Xu Bin、Shao Cheng、Lee Yaerim、Liao Yuxuan、Matsushima Naoto、Kodama Takashi、Lundell Fredrik、S?derberg L. Daniel、Saito Tsuguyuki、Shiomi Junichiro
- Journal Title
  
  Nano Letters
  
  Volume: 22 Issue: 21 Pages: 8406-8412
- DOI
  10.1021/acs.nanolett.2c02057
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189, KAKENHI-PROJECT-22H04950, KAKENHI-PROJECT-21H01259
[Journal Article] A novel strategy for GaN-on-diamond device with a high thermal boundary conductance2022
- Author(s)
  Mu Fengwen、Xu Bin、Wang Xinhua、Gao Runhua、Huang Sen、Wei Ke、Takeuchi Kai、Chen Xiaojuan、Yin Haibo、Wang Dahai、Yu Jiahan、Suga Tadatomo、Shiomi Junichiro、Liu Xinyu
- Journal Title
  
  Journal of Alloys and Compounds
  
  Volume: 905 Pages: 164076-164076
- DOI
  10.1016/j.jallcom.2022.164076
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] High thermoelectric performance of bulk silicon by a 3-dimensional network structure2023
- Author(s)
  Bin Xu, Ryohei Nagahiro, Cheng Shao, Yifei Li, Zhenglong Fang, Yuanzhe Li, Yixuan Liao, Shinya Kato, Junichiro Shiomi
- Organizer
  10th US-Japan Joint Seminar on Nanoscale Transport Phenomena
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] Remarkably Suppression Effect on Thermal Boundary Resistance at GaN/Diamond Amorphous Interface2023
- Author(s)
  Bin Xu, Fengwen Mu, Yingzhou Liu, Rulei Guo, Shiqian Hu, Junichiro Shiomi
- Organizer
  第7回フォノンエンジニアリング研究会
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] HPT加工によるシリコン多結晶体の極低熱伝導化2023
- Author(s)
  許　斌、Yifei Li、生駒嘉史、河野正道、塩見淳一郎
- Organizer
  第60回日本伝熱シンポジウム
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] Interfacial thermal conduction engineering in twist bilayer 2D materials2023
- Author(s)
  Bin Xu, Meng An, Satoru Masubuchi, Yuanzhe Li, Tomoki Machida, Junichiro Shiomi
- Organizer
  第66回フラーレン・ナノチューブ・グラフェン総合シンポジウム
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] Unrevealing the unexpected large thermal boundary resistance induced by inelastic heat carrier trapping at GaN-diamond interface2023
- Author(s)
  Bin Xu, Shiqian Hu, Rulei Guo, Fengwen Mu, Junichiro Shiomi
- Organizer
  2024 MRS Spring Meeting
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] 3次元ネック構造によるシリコン熱電材料の高性能化2023
- Author(s)
  許　斌、永廣　怜平、塩見　淳一郎
- Organizer
  第70回応用物理学会春季講演会
- Invited
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] フォノンエンジニアリングとサーマルルーチングによるマルチスケール熱管理2022
- Author(s)
  許　斌
- Organizer
  第6回フォノンエンジニアリング研究会
- Invited
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] グラファイトを用いた３次元的な熱流制御による高性能ヒートスプレッダの実現2022
- Author(s)
  許　斌、 Yuxuan　Liao、方　正隆、長藤圭介、児玉　高志、西川　泰司、塩見　淳一郎
- Organizer
  第59回　日本伝熱シンポジウム
- Data Source
  KAKENHI-PROJECT-22K14189
[Presentation] 高速焼結による高性能ナノ結晶シリコン熱電材料の作製2022
- Author(s)
  許　斌、永廣　怜平、大西正人、塩見　淳一郎
- Organizer
  第83回応用物理学会秋季講演会
- Data Source
  KAKENHI-PROJECT-22K14189

1. 塩見淳一郎 (40451786)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
2. 後藤真宏 (00343872)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 鈴木弘朗 (20880553)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

XU BIN 許 斌

Bin Xu 許 斌

Research Projects

Research Products

Co-Researchers

Innovative phonon engineering in two-dimensional material systemsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Elucidatig the mechanism and promoting the thermal conduction at mismatched interfacePrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Developing Science of Amorphous Phonon Engineering

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Unraveling the mechanisms of thermal boundary conductance at the graphene-silicon interface: Insights from ballistic, diffusive, and localized phonon transport regimes2024

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Extremely suppressed thermal conductivity of large-scale nanocrystalline silicon through inhomogeneous internal strain engineering2023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Enhanced High Thermal Conductivity Cellulose Filaments via Hydrodynamic Focusing2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] A novel strategy for GaN-on-diamond device with a high thermal boundary conductance2022

Author(s)

Journal Title

DOI

Data Source

[Presentation] High thermoelectric performance of bulk silicon by a 3-dimensional network structure2023

Author(s)

Organizer

Data Source

[Presentation] Remarkably Suppression Effect on Thermal Boundary Resistance at GaN/Diamond Amorphous Interface2023

Author(s)

Organizer

Data Source

[Presentation] HPT加工によるシリコン多結晶体の極低熱伝導化2023

Author(s)

Organizer

Data Source

[Presentation] Interfacial thermal conduction engineering in twist bilayer 2D materials2023

Author(s)

Organizer

Data Source

[Presentation] Unrevealing the unexpected large thermal boundary resistance induced by inelastic heat carrier trapping at GaN-diamond interface2023

Author(s)

Organizer

Data Source

[Presentation] 3次元ネック構造によるシリコン熱電材料の高性能化2023

Author(s)

Organizer

Data Source

[Presentation] フォノンエンジニアリングとサーマルルーチングによるマルチスケール熱管理2022

Author(s)

Organizer

Data Source

[Presentation] グラファイトを用いた３次元的な熱流制御による 高性能ヒートスプレッダの実現2022

Author(s)

Organizer

Data Source

[Presentation] 高速焼結による高性能ナノ結晶シリコン熱電材料の作製2022

Author(s)

Organizer

Data Source

XU BIN 許斌

Bin Xu 許斌

[Presentation] グラファイトを用いた３次元的な熱流制御による高性能ヒートスプレッダの実現2022