MORI Takao 森孝男

Researcher Number	30275078
Other IDs
Affiliation (based on the past Project Information) *help	2014 – 2017: 富山県立大学, 工学部, 教授 2011: 富山県立大学, 工学部, 教授 2006 – 2008: 富山県立大学, 工学部, 教授 2005: 富山県立大学, 工学部, 助教授
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials Except Principal Investigator Materials/Mechanics of materials
Keywords	Principal Investigator Reliability / Eletric substrate / Thermal fatigue lifetime / Phase growth / Lead free solder / 信頼性 / 電子基板 / 熱疲労寿命 / 相成長 / 鉛フリーはんだ … More Except Principal Investigator … More 寿命評価 / 熱疲労 / はんだ / 放射光 / X線マイクロCT / マイクロ接合部 / 高密度実装 / 信頼性設計 / ヘルスモニタリング / エレクトロニクス実装 / 寿命 / 放射光CT / モニタリング / 電子デバイス・機器 / Ｘ線マイクロＣＴ Less

Development of Integrated Health Management for High Reliability Electronics Based on Synchrotron Radiation Computed Tomography Technologies
- Principal Investigator
  
  Sayama Toshihiko
- Project Period (FY)
  2015 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Industrial Technology Center,
Development of Reliability Evaluation Technique for Fatigue Failure in Electronic Packages by Applying Integrated Nondestructive Monitoring Based on Synchrotron Radiation Micro-tomography
- Principal Investigator
  
  SAYAMA Toshihiko
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Industrial Technology Center,
Development of Health Monitoring Technique for Thermal Fatigue Evaluation in High Density PCBs by Synchrotron Radiation CT
- Principal Investigator
  
  SAYAMA Toshihiko
- Project Period (FY)
  2009 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Industrial Technology Center,
Development of Evaluation Technique for Thermal Fatigue Lifetime in Micro-joints by Synchrotron Radiation X-ray CT
- Principal Investigator
  
  SAYAMA Toshihiko
- Project Period (FY)
  2006 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Industrial Technology Center,
Development of Health Monitoring Technique in Lead Free Solder Joints of Electric Substrate by Phase Growth ParameterPrincipal Investigator
- Principal Investigator
  
  MORI Takao
- Project Period (FY)
  2005 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Toyama Prefectural University

All 2017 2016 2015 2012 2011 2009 2008 2007 2006 Other

All Journal Article Presentation Patent

[Journal Article] In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading2017
- Author(s)
  Tsuritani Hiroyuki、Sayama Toshihiko、Okamoto Yoshiyuki、Takayanagi Takeshi、Hoshino Masato、Uesugi Kentaro、Ooi Junya、Mori Takao
- Journal Title
  
  ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  
  Volume: -
- DOI
  10.1115/ipack2017-74177
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15K05708
[Journal Article] 繰返し通電負荷を受けるパワーデバイスに対する適切な熱的信頼性試験のための放射光ラミノグラフィモニタリングの応用2017
- Author(s)
  岡本佳之, 高柳毅, 釣谷浩之, 佐山利彦, 星野真人, 上杉健太朗, 東方浩紀, 大井純也, 森孝男
- Journal Title
  
  平成29年度 SPring-8 産業新分野支援課題・一般課題（産業分野）実施報告書（2017A）
  
  Volume: - Pages: 25-28
- Open Access
- Data Source
  KAKENHI-PROJECT-15K05708
[Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2016
- Author(s)
  岡本佳之, 高柳毅, 釣谷浩之, 佐山利彦, 上杉健太朗, 星野真人, 長瀬達則, 森孝男
- Journal Title
  
  SPring-8利用研究成果集（電子ジャーナル）
  
  Volume: 4
- NAID
  130007969228
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-24560120
[Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2015
- Author(s)
  岡本佳之, 高柳毅, 釣谷浩之, 佐山利彦, 上杉健太朗, 星野真人, 長瀬達則, 森孝男
- Journal Title
  
  SPring-8利用研究成果集（電子ジャーナル）
  
  Volume: 3 Pages: 1-4
- NAID
  130007969228
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-15K05708
[Journal Article] Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects2011
- Author(s)
  Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
- Journal Title
  
  Trans. ASME J. Electronic Packaging
  
  Volume: Vol.133, No.2 Pages: 0210071-9
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560108
[Journal Article] Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects2011
- Author(s)
  Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., Mori, T.
- Journal Title
  
  Trans.ASME J.Electronic Packaging
  
  Volume: 133 Issue: 2
- DOI
  10.1115/1.4003992
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560108
[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009
- Author(s)
  釣谷浩之、佐山利彦、岡本佳之、高柳毅、上杉健太朗、森孝男
- Journal Title
  
  日本機械学会論文集 A編 75
  
  Pages: 799-806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560108
[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,森孝男
- Journal Title
  
  日本機械学会論文集
  
  Volume: Vol.75, No.755 Pages: 799-806
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560108
[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009
- Author(s)
  釣谷浩之 , 佐山利彦, 岡本佳之, 高柳毅,上杉健太朗, 森孝男
- Journal Title
  
  日本機械学会論文集A Vol. 75, No.755
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18560096
[Journal Article] 放射光X線マイクロCTによるSn-Pbはんだ接合部における微細組織変化の観察2007
- Author(s)
  釣谷浩之, 佐山利彦, 高柳毅, 上杉健太朗, 森孝男
- Journal Title
  
  日本金属学会会報まてりあ Vol. 46, No.12
  
  Pages: 821-821
- NAID
  10020007559
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18560096
[Journal Article] Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-joints by Synchrotron Radiation X-ray Micro-tomography2007
- Author(s)
  Tsuritani, H., Sayama, T., Uesugi, K., Takayanagi, T., Mori, T
- Journal Title
  
  Trans. ASME J. of Electronic Packaging Vol. 129,No. 4
  
  Pages: 434-439
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18560096
[Patent] はんだ接合部の疲労評価方法2008
- Inventor(s)
  森孝男,佐山利彦,長井喜昭,高柳毅
- Acquisition Date
  2008-08-15
- Data Source
  KAKENHI-PROJECT-18560096
[Presentation] 高剛性ラップジョイント試験体を用いたはんだ接合部の疲労寿命に及ぼすひずみ速度の影響評価2015
- Author(s)
  森　孝男
- Organizer
  日本機械学会2015年度年次大会
- Place of Presentation
  北海道大学工学部
- Year and Date
  2015-09-14
- Data Source
  KAKENHI-PROJECT-15K05708
[Presentation] Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints by Using Lap-joint Shear Specimen with High Stiffness Fixtures2015
- Author(s)
  Takao Mori
- Organizer
  ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2015)
- Place of Presentation
  San Francisco, CA, USA
- Year and Date
  2015-07-06
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K05708
[Presentation] 放射光X線ラミノグラフィーを用いた電子基板はんだ接合部における熱疲労き裂の非破壊観察2012
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,星野真人,森孝男
- Organizer
  第26回エレクトロニクス実装学会
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 放射光X線CTによるチップ抵抗はんだ接合部における熱疲労き裂進展過程の実験的評価2012
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,森孝男
- Organizer
  第25回エレクトロニクス実装学会
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 異なる大きさのチップ抵抗はんだ接合部における熱疲労き裂進展の3次元非破壊評価2012
- Author(s)
  岡本佳之,高柳毅,釣谷浩之,佐山利彦,上杉健太朗,森孝男
- Organizer
  第26回エレクトロニクス実装学会
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 放射光X線CT装置を用いた複雑形状を有するはんだ接合部における熱疲労き裂進展の3次元非破壊評価2011
- Author(s)
  岡本佳之,高柳毅,釣谷浩之,佐山利彦,上杉健太朗,森孝男
- Organizer
  日本機械学会2011年度年次大会
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] Three-dimensional and Nondestructive Evaluation of Thermal Fatigue Crack Propagation Process in Complex-shapedSolder Joints by Synchrotron Radiation X-ray Micro-tomography2011
- Author(s)
  Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
- Organizer
  Proc. of Inter PACK2011
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] チップ抵抗鉛フリーはんだ接合部の熱疲労き裂の放射光X線CTを応用した非破壊観2011
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,森孝男
- Organizer
  日本機械学会2010年度年次大会
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 放射光X線CTによるはんだマイクロ接合部における熱疲労損傷の評価2009
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,森孝男
- Organizer
  第158回日本鉄鋼協会秋季講演大会シンポジウム論文集「階層的3D/4D解析によるミクロ組織の多様性の解明」
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 放射光X線CTを応用したFBGA鉛フリー接合部の熱疲労き裂の非破壊観察2009
- Author(s)
  釣谷浩之,佐山利彦,岡本佳之,高柳毅,上杉健太朗,森孝男
- Organizer
  第19回マイクロエレクトロニクスシンポジウム
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] Nondestructive Evaluation of Thermal Fatigue Crack Propagationin Sn-Ag-Cu Solder Joints by Synchrotron Radiation X-ray Micro-tomography2009
- Author(s)
  Turitani, H., Sayama, T., Takayanagi, T., Okamoto, Y., Uesugi, K., and Mori, T
- Organizer
  Proc. of InterPACK2009, ASME
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] Phase Growth Process of Sn-3.0Ag-0.5Cu Solder Joints under Mechanical Cyclic Loading at the Same Temperature2009
- Author(s)
  Okamoto, Y., Takayanagi, T., Sayama, T., Ejiri, Y., Nakano, H., and Mori, T
- Organizer
  Proc. of InterPACK2009, ASME
- Data Source
  KAKENHI-PROJECT-21560108
[Presentation] 放射光X線CTによる3次元データを用いたフリップチップはんだ接合部のき裂進展過程の評価2008
- Author(s)
  釣谷浩之, 佐山利彦, 岡本佳之, 高柳毅, 上杉健太朗,森孝男
- Organizer
  第18回マイクロエレクトロニクスシンポジウム論文集, Vol. 18 (2008), pp. 291-294.
- Data Source
  KAKENHI-PROJECT-18560096
[Presentation] Sn-3.OAg-0.5Cuはんだ接合部の相成長と力学的パラメータに関する研究2007
- Author(s)
  江尻康浩, 森孝男, 佐山利彦, 高柳毅, 岡本佳之, 子強
- Organizer
  目本機械学会第20回計算力学講演会
- Place of Presentation
  立命館大学(京田辺)
- Year and Date
  2007-11-26
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17560075
[Presentation] Application of Synchrotron Radiation X-rayMicro-tomography to NondestrucEvaluation of Thermal Fatigue Flip Chip Interconnects2007
- Author(s)
  Turitani, H., Sayama, T., Okamoto, Y., Takayanagi, T., Uesugi, K., Mori, T
- Organizer
  Proc. Of InterPACK 07 ASME IPACK2007-33170
- Data Source
  KAKENHI-PROJECT-18560096
[Presentation] 放射光X線CT装るフリップチップ接合部における熱疲労き裂の観察2007
- Author(s)
  釣谷浩之, 佐山利彦, 上杉健太朗, 高柳毅岡本佳之, 森孝男
- Organizer
  Proc. Of Symposium on Microjoining and and Assembly Technology in Electronics Vol. 13 pp. 303-308
- Data Source
  KAKENHI-PROJECT-18560096
[Presentation] Sn-3.0Ag-0.5Cuはんだ接合部の相成長と力学的パラメータに関する研究2007
- Author(s)
  江尻康浩、森孝男, ほか4名
- Organizer
  (社)日本機械学会第20回計算力学講演会
- Place of Presentation
  立命館大学(京田辺市)
- Year and Date
  2007-11-26
- Data Source
  KAKENHI-PROJECT-17560075
[Presentation] 放射光X線CTを用いたフリップチップ接合部における熱疲労き裂進展過程の評価,2007
- Author(s)
  釣谷浩之, 佐山利彦, 岡本佳之, 高柳毅, 上杉健太朗, 森孝男
- Organizer
  日本機械学会 2007年度年次大会講演論文集 pp. 221-222
- Data Source
  KAKENHI-PROJECT-18560096
[Presentation] Sn-3.0Ag-0.Cuはんだ接合部の相成長変化に及ぼす温度とひずみの影響2006
- Author(s)
  森孝男, 南博, 佐山利彦, 高柳毅
- Organizer
  日本機械学会2006年度年次大会
- Place of Presentation
  熊本大学(熊本)
- Year and Date
  2006-09-20
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17560075
[Presentation] Influence of Temperature and Strain on Phase Growth Process in Sn-3.0Ag-0.5Cu Solder Joints2006
- Author(s)
  Takao, Mori, Hiroshi, Minami, Toshihiko, Sayama, Takeshi, Takayanag
- Organizer
  JSME 2006 Annual Conference
- Place of Presentation
  Kumamoto University (Kumamoto)
- Year and Date
  2006-09-20
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17560075
[Presentation] ダイアタッチはんだ接合部における熱疲労き裂進展の放射光X線ラミノグラフィによる非破壊観察
- Author(s)
  釣谷浩之, 花村拓哉, 佐山利彦, 岡本佳之, 高柳毅, 星野真人, 上杉健太朗, 森孝男
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-24560120
[Presentation] Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints by Using Lap-joint Shear Specimen with High Stiffness Fixtures
- Author(s)
  Sayama, T., Okamoto, Y., Kinoshita, M., and Mori, T.
- Organizer
  ASME InterPACK2015
- Place of Presentation
  San Francisco
- Year and Date
  2015-07-06 – 2015-07-09
- Data Source
  KAKENHI-PROJECT-24560120
[Presentation] 高剛性ラップジョイントせん断試験によるはんだ接合部の疲労き裂発生寿命評価
- Author(s)
  木下雅巧, 佐山利彦, 釣谷浩之, 岡本佳之, 森孝男
- Organizer
  日本機械学会2014年度年次大会
- Place of Presentation
  東京電機大学
- Year and Date
  2014-09-07 – 2014-09-10
- Data Source
  KAKENHI-PROJECT-24560120
[Presentation] Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography
- Author(s)
  Tsuritani, H., Sayama, T., Okamoto, Y., Takayanagi, T., Hoshino, M., Uesugi, K., Hanamura, T., and Mori, T.
- Organizer
  ASME InterPACK2015
- Place of Presentation
  San Francisco
- Year and Date
  2015-07-06 – 2015-07-09
- Data Source
  KAKENHI-PROJECT-24560120

1. UESUGI Kentaro (80344399)

# of Collaborated Projects: 5 results

# of Collaborated Products: 26 results
2. SAYAMA Toshihiko (40416128)

# of Collaborated Projects: 4 results

# of Collaborated Products: 29 results
3. TSURITANI Hiroyuki (70416147)

# of Collaborated Projects: 4 results

# of Collaborated Products: 22 results
4. YU Qiang (80242379)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

MORI Takao 森 孝男

Research Projects

Research Products

Co-Researchers

Development of Integrated Health Management for High Reliability Electronics Based on Synchrotron Radiation Computed Tomography Technologies

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Reliability Evaluation Technique for Fatigue Failure in Electronic Packages by Applying Integrated Nondestructive Monitoring Based on Synchrotron Radiation Micro-tomography

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Health Monitoring Technique for Thermal Fatigue Evaluation in High Density PCBs by Synchrotron Radiation CT

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Evaluation Technique for Thermal Fatigue Lifetime in Micro-joints by Synchrotron Radiation X-ray CT

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Health Monitoring Technique in Lead Free Solder Joints of Electric Substrate by Phase Growth ParameterPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] In-Situ Monitoring via Synchrotron Radiation Laminography of Thermal Fatigue Cracks at Die-Attached Joints Under Cyclic Energization Loading2017

Author(s)

Journal Title

DOI

Data Source

[Journal Article] 繰返し通電負荷を受けるパワーデバイスに対する適切な熱的信頼性試験のための放射光ラミノグラフィモニタリングの応用2017

Author(s)

Journal Title

Data Source

[Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2016

Author(s)

Journal Title

NAID

Data Source

[Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2015

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects2011

Author(s)

Journal Title

Data Source

[Journal Article] Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects2011

Author(s)

Journal Title

DOI

Data Source

[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009

Author(s)

Journal Title

Data Source

[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009

Author(s)

Journal Title

Data Source

[Journal Article] 放射光X線マイクロCTによるフリップチップはんだ接合部における熱疲労寿命の非破壊評価2009

Author(s)

Journal Title

Data Source

[Journal Article] 放射光X線マイクロCTによるSn-Pbはんだ接合部における微細組織変化の観察2007

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-joints by Synchrotron Radiation X-ray Micro-tomography2007

MORI Takao 森孝男