Kibushi Risako 木伏理沙子

… Alternative Names

KIBUSHI Risako 木伏理沙子

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Researcher Number	30781596
Other IDs	https://orcid.org/0000-0002-5609-0733
Affiliation (Current)	2025: 富山県立大学, 工学部, 講師
Affiliation (based on the past Project Information) *help	2023: 富山県立大学, 工学部, 講師 2021 – 2022: 富山県立大学, 工学部, 助教 2018 – 2020: 山陽小野田市立山口東京理科大学, 工学部, 助教
Review Section/Research Field	Principal Investigator Basic Section 19020:Thermal engineering-related
Keywords	Principal Investigator パワーエレクトロニクス / サーマルマネジメント / 接触熱抵抗 / 電子機器 / 熱伝導率 / 熱伝導率測定 / CFD解析 / パワー半導体デバイス / 熱・電気錬成解析 / 熱・電気連成解析 … More / SiC / パワー半導体 / 熱設計 / ホットスポット Less

Research Projects
(2 results)
Research Products
(5 results)

Evaluation of Heat Transfer Characteristics Considering Thermal Contact Resistance between Sintered Ag Particles and Metallic Solid Using Steady-State MethodPrincipal Investigator
- Principal Investigator
  
  木伏理沙子
- Project Period (FY)
  2022 – 2025
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 19020:Thermal engineering-related
- Research Institution
  Toyama Prefectural University
Formulation of multiscale thermal model in SiC power semiconductor devicePrincipal Investigator
- Principal Investigator
  
  KIBUSHI Risako
- Project Period (FY)
  2018 – 2022
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 19020:Thermal engineering-related
- Research Institution
  Toyama Prefectural University
  Tokyo University of Science, Yamaguchi

All 2022 2020 2018

All Presentation

[Presentation] SiC MOSFET のホットスポット温度予測手法の検討 - ドレイン電圧と冷却面温度の影響2022
- Author(s)
  小西太一、木伏理沙子、畠山友行、石塚勝
- Organizer
  エレクトロニクス実装学会第37回春季講演大会
- Data Source
  KAKENHI-PROJECT-18K13707
[Presentation] Evaluation of Amount of Heat Through Each Component of SiC Package Using CFD Analysis2022
- Author(s)
  T. Konishi, R. Kibushi, T. Hatakeyama, S. Nakawaga, M. Ishizuka
- Organizer
  2022 International Conference on Electronics Packaging
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K13707
[Presentation] VALUATION OF HEAT FLOW IN A TO-220 PACKAGE MADE OF SIC USING CFD SIMULATION2022
- Author(s)
  R. Kibushi, T. Konishi, T. Hatakeyama, S. Nakagawa, N. Unno, K. Yuki, M. Ishizuka, M. Edatsugi
- Organizer
  The 32nd International Symposium on Transport Phenomena
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K13707
[Presentation] 次世代SiCパワー半導体パッケージにおける信頼性向上のための熱設計手法の開発2020
- Author(s)
  枝次将弥，木伏理沙子，結城和久，海野徳幸
- Organizer
  日本機械学会中国四国学生会第51回学生員卒業研究発表講演会
- Data Source
  KAKENHI-PROJECT-18K13707
[Presentation] Heat Generation and Temperature Distribution of SiC Power MOSFET Using Electro-Thermal Analysis2018
- Author(s)
  R. Kibushi, T. Hatakeyama, K. Yuki, N. Unno and M. Ishizuka
- Organizer
  The 29th International Symposium on Transport Phenomena
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K13707