HOWLADER Matiar R マティアル R・ハウラダル

… Alternative Names

ハウラダルマティアル R ハウラダルマティアル R

HOWLADER M. M. R. ハウラダルエムエムアール

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Researcher Number	40334354
Affiliation (based on the past Project Information) *help	2006: The University of Tokyo, RCAST, Associate Professor 2004: 東京大学, 先端科学技術研究センター, 教授 2002 – 2003: 東京大学, 先端科学技術研究センター, 寄付研究部門教員 2001: 東京大学, 先端科学技術研究センター, 教員
Review Section/Research Field	Except Principal Investigator Microdevices/Nanodevices / Science and Engineering
Keywords	Except Principal Investigator イオン衝撃 / 表面活性化 / ウエハ接合 / 常温接合 / nitrogen radical / ion irradiation / silicon direct bonding / wafer bonding / surfaace activation / room temperature bonding … More / low temperature bonding / plasma activation / 気密封止 / ガラス接合 / 表件活性化 / 酸素ラジカル / サファイア接合 / シリコン接合 / タンタル酸リチウム / 酸素プラズマ / 窒素ラジカル / シリコン直接接合 / 低温接合 / プラズマ活性化 / 接合 / 水素ラジカル / 異種半導体接合 / マイクロシステム / 接触率 / バンプ / 接合面積 / 接触解析 / FEM Less

Wafer-scale MEMS Package by means of room temperature bonding
- Principal Investigator
  
  SUGA Tadatomo
- Project Period (FY)
  2004 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Microdevices/Nanodevices
- Research Institution
  The University of Tokyo
常温接合によるマイクロシステムインテグレーション
- Principal Investigator
  
  SUGA Tadatomo
- Project Period (FY)
  2001 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research on Priority Areas
- Review Section
  
  Science and Engineering
- Research Institution
  The University of Tokyo

All 2007 2006 2005 2004 Other

All Journal Article

[Journal Article] Surface Activated Bonding Method for Flexible Lamination2007
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics (Polytronic 2007), 6th
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  IEEE, Electronic Components ＆ Technology Conf. (ECTC), 56th., Proceedings. May 31
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  IEEE, Electronic Components & Technology Conf.(ECTC), 56th.Proceedings May31
  
  Pages: 552-558
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006
- Author(s)
  M. M. R. Howlader, T. Suga
- Journal Title
  
  IEEE, Electronic Components & Technology Conf.(ECTC), 56th. Proceedings. May 31
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  Int. Conf. on Electronics Packaging (ICEP2006), Proceedings. Apr. 19-21
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature wafer level glass-glass bonding2006
- Author(s)
  M. M. R. Howlader, S. Suehara, T. Suga
- Journal Title
  
  Sensors and Actuators A127
  
  Pages: 31-31
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature wafer level glass-glass bonding2006
- Author(s)
  M.M.R.Howlader, S.Suehara, T.Suga
- Journal Title
  
  Sensors and Actuators A127
  
  Pages: 31-36
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  Int.Conf.on Electronics Packaging (ICEP2006), Proceedings Apr.19-21
  
  Pages: 342-347
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005
- Author(s)
  M.M.R.Howlader, S.Suehara, H.Takagi, T.H.Kim, R.Maeda, T.Suga
- Journal Title
  
  IEEE Transactions on Advanced Packaging
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature2005
- Author(s)
  M.M.R.Howlader, S.Suehara, T.H.Kim, T.Suga
- Journal Title
  
  Proc.Electronic Component and Technology Conference 55
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005
- Author(s)
  H. Itoh, M. M. R. Howlader, H. Li, T. Suga, M. J. Kim
- Journal Title
  
  Proc. International Conference on Electronics Packaging ICEP 13-15/4
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding for MEMS and microfluidics2005
- Author(s)
  M. M. R. Howlader, S. Suehara, H. Takagi, R. Maeda, and T. Suga
- Journal Title
  
  Proc. Int. Symposium on Wafer Bonding 8
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding for MEMS and microfluidics2005
- Author(s)
  M.M.R.Howlader, S.Suehara, H.Takagi, R.Maeda, T.Suga
- Journal Title
  
  Proc.Int.Symposium on Wafer Bonding 8
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005
- Author(s)
  M. M. R. Howlader, S. Suehara, H. Takagi, T. H. Kim, R. Maeda, T. Suga
- Journal Title
  
  IEEE Transactions on Advanced Packaging
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature microfiuidics packaging using sequential plasma activation process2005
- Author(s)
  M.M.R.Howlader, S.Suehara, H.Takagi, T.H.Kim, R.Maeda, and T.Suga
- Journal Title
  
  IEEE Transactions on Advanced Packaging
  
  Pages: 446-456
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Bonding Processes and Mechanisms for Ionic and Piezoelectric Wafers2005
- Author(s)
  M. M. R. Howlader, T. Suga
- Journal Title
  
  Proc. International Conference on Electronics Packaging ICEP 13-15/4
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005
- Author(s)
  H.Itoh, M.M.R.Howlader, H.Li, T.Suga, M.J.Kim
- Journal Title
  
  Proc.International Conference on Electronics Packaging ICEP
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature2005
- Author(s)
  M. M. R. Howlader, S. Suehara, T. H. Kim, T. Suga
- Journal Title
  
  Proc. Electronic Component and Technology Conference 55
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005
- Author(s)
  H.Itoh, M.M.R.Howlader, H.Li, T.Suga, M.J.Kim
- Journal Title
  
  Proc.International Conference on Electronics Packaging ICEP 13-15/4
  
  Pages: 94-99
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Room temperature wafer level glass/glass bonding2005
- Author(s)
  M.M.R.Howlader, S.Suehara, T.Suga
- Journal Title
  
  Sensors and Actuators A
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level and chip size direct wafer bondingat room temperature2004
- Author(s)
  M.M.R.Howlader, T.Suga, Moon J Kim
- Journal Title
  
  206th Electrochemical Society Meeting 3-8/10
  
  Pages: 150-160
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding for wafer scale glass/glass integration2004
- Author(s)
  T.Suehara, M.M.R.Howlader, T.H.Kim.T.Suga
- Journal Title
  
  ECS, Int.Semiconductor Technology Conf., 3rd., (ISTC2004), Proceedings 15-17/9
  
  Pages: 424-431
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004
- Author(s)
  M. M. R. Howlader, H.Okada, T. H. Kim, T. Itoh, T. Suga
- Journal Title
  
  Journal of Electrochemical Society 151
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding for microelectronics and MEMSpackaging2004
- Author(s)
  M.M.R.Howlader, T.Suga
- Journal Title
  
  The Electrochemical Society International Semiconductor Technology Conference
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level andchip size direct wafer bondingat room temperature2004
- Author(s)
  M. M. R. Howlader, T. Suga, Moon J Kirn
- Journal Title
  
  206th Electrochemical Society Meeting 3-8/10
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Lamination and de-laminationprocesses for Cu/LCP for electronic packaging2004
- Author(s)
  M.M.R.Howlader, K.Nanbu, T.Saizou, T.Suga
- Journal Title
  
  The Eleventh International Conference on Intergranular and Inetrphase Boundaries.
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Oxidation behavior of leadfree solder bumps and their bonding characteristics2004
- Author(s)
  H. Ozawa, M. M. R. Howlader, M. Satou, H. Ozaki, T. Suga
- Journal Title
  
  14th Micro Electronics Symposium(MES) of Japan, Institute for Electronics Packaging
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Oxidation behavior of leadfree solder bumps and their bonding characteristics2004
- Author(s)
  H.Ozawa, M.M.R.Howlader, M.Satou
- Journal Title
  
  14th Micro Electronics Symposium (MES) of Japan institute for Electronics Packaging
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004
- Author(s)
  M.M.R.Howlader, H.Okada, T.H.Kim, T.Itoh, and T.Suga
- Journal Title
  
  Journal of Electrochemical Society 151
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding formicroelectronics and MEMSpackaging2004
- Author(s)
  M. M. R. Howlader, T. Suga
- Journal Title
  
  ECS, Int. Semiconductor Technology Conf. 3rd.(ISTC2004) 15-17/9(Proceedings)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Sequential activation process for silicon direct bonding2004
- Author(s)
  T. H. Kim, M. M. R. Howlader, T. Suga
- Journal Title
  
  The 4th International Conference on Alternative Substrate Technology 21-25/3
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surface activated bonding for wafer scale glass/glass integration2004
- Author(s)
  T. Suehara, M. M. R. Howlader, T. H. Kim, T. Suga
- Journal Title
  
  ECS, Int. Semiconductor Technology Conf., 3rd.,(ISTC20O4) 15-17/9(Proceedings)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Oxidation behavior of leadfree solder bumps and their bonding characteristics2004
- Author(s)
  H.Oaawa, M.M.R.Howlader, M.Satou, H.Ozaki, T.Suga
- Journal Title
  
  14th Micro Electronics Symposium(MES)of Japan, Institute for Electronics Packaging
  
  Pages: 129-132
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level surface activatedbonding tool for MEMS packaging2004
- Author(s)
  M.M.R.Howlader, H.Okada, T.H.Kim, T.Itoh, T.Suga
- Journal Title
  
  Journal of Electrochemical Society 151
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] MEMS packagingusing room temperature wafer bonding2004
- Author(s)
  M. M. R. Howlader, T. H. Kim, T. Suga
- Journal Title
  
  The 4th International Conference on Alternative Substrate Technology 21-25/3
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Wafer level and chip size direct wafer bondingat room temperature2004
- Author(s)
  M.M.R.Howlader, T.Suga, Moon J Kim
- Journal Title
  
  206th Electrochemical Society Meeting
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] Surfaceactivated bonding for Sn-Ag and their oxidation mechanism2004
- Author(s)
  Y.Wang, M.M.R.Howlader, N.Hosoda.K, Okamoto, T.Suga.M.
- Journal Title
  
  The Electrochemical Society International Semiconductor Technology Conference
- Data Source
  KAKENHI-PROJECT-16201028
[Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature
- Author(s)
  M. M. R. Howlader, T. Suga
- Journal Title
  
  Int. Conf. on Electronics Packaging(ICEP2006), Proceedings. Aor 2006
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16201028

1. SUGA Tadatomo (40175401)

# of Collaborated Projects: 2 results

# of Collaborated Products: 37 results
2. HIGURASHI Eiji (60372405)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 伊藤寿浩 (80262111)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 細田直江 (50280954)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

HOWLADER Matiar R マティアル R・ハウラダル

ハウラダル マティアル R ハウラダル マティアル R

HOWLADER M. M. R. ハウラダル エムエムアール

Research Projects

Research Products

Co-Researchers

Wafer-scale MEMS Package by means of room temperature bonding

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

常温接合によるマイクロシステムインテグレーション

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Surface Activated Bonding Method for Flexible Lamination2007

Author(s)

Journal Title

Data Source

[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

Author(s)

Journal Title

Data Source

[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] A Novel Method for Bonding of Ionic Wafers at Room Temperature2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006

Author(s)

Journal Title

Data Source

[Journal Article] Room temperature wafer level glass-glass bonding2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] Room temperature wafer level glass-glass bonding2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] SAB Method for Bonding of Ionic Wafers at Room Temperature2006

Author(s)

Journal Title

Description

Data Source

[Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005

Author(s)

Journal Title

Data Source

[Journal Article] Sequential Plasma Activation Process for Microfluidics Packaging at Room Temperature2005

Author(s)

Journal Title

Data Source

[Journal Article] Combined Process of Radical and RIE for Si Direct Bonding2005

Author(s)

Journal Title

Description

Data Source

[Journal Article] Surface activated bonding for MEMS and microfluidics2005

Author(s)

Journal Title

Description

Data Source

[Journal Article] Surface activated bonding for MEMS and microfluidics2005

Author(s)

Journal Title

Data Source

[Journal Article] Room temperature microfluidics packaging using sequential plasma activation process2005

Author(s)

Journal Title

ハウラダルマティアル R ハウラダルマティアル R

HOWLADER M. M. R. ハウラダルエムエムアール