AKAIKW Masatake 赤池正剛

… Alternative Names

AKAIKE Masatake 赤池正剛

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Researcher Number	50150959
Affiliation (based on the past Project Information) *help	2016: 東京大学, 工学系研究科, 研究員 2005 – 2006: 東京大学, 先端科学技術研究センター, リサーチフェロー
Review Section/Research Field	Except Principal Investigator Composite materials/Surface and interface engineering / Electron device/Electronic equipment
Keywords	Except Principal Investigator 表面活性化 / 接合 / 酸化膜還元 / 銅直接接合 / ナノ密着層 / 集積化 / 水素ラジカル / ハイブリッド接合 / プラチナ触媒 / ぎ酸 … More / 実装 / 銅ー銅接合 / 活性化接合 / 還元 / 直接接合 / 接合界面 / 低温接合 / ギ酸 / Fast atom beam / Aluminum / Surface activation / Bonding / Gallium nitride / オーミックコンタクト / シリコン / 高速原子ビーム / アルミニウム / 窒化ガリウム Less

Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt Catalyst
- Principal Investigator
  
  Suga Tadatomo
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  The University of Tokyo
Surface activated bonding of GaN and its application for optical devices
- Principal Investigator
  
  HIGURASHI Eiji
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  The University of Tokyo

All 2017 2016 2015 2014 2008 2007 Other

All Journal Article Presentation

[Journal Article] Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid2017
- Author(s)
  Masahisa Fujino, Masatake Akaike, Naoya Matsuoka, and Tadatomo Suga
- Journal Title
  
  Japanese Journal of Applied Physics 56, 04CC01 (2017)
  
  Volume: 56 Issue: 4S Pages: 04CC01-04CC01
- DOI
  10.7567/jjap.56.04cc01
- NAID
  210000147553
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26289247
[Journal Article] Direct bonding for dissimilar metals assisted by carboxylic acid vapor2015
- Author(s)
  J.-M. Song, S.-K. Huang, M. Akaike, and T. Suga
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 54 Issue: 3 Pages: 030217-030217
- DOI
  10.7567/jjap.54.030217
- NAID
  210000144828
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289247
[Journal Article] Effect of Formic Acid Vapor In Situ Treatment Process on Cu Low-Temperature Bonding2014
- Author(s)
  Wenhua Yang, Masatake Akaike, Tadatomo Suga
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: 6 Issue: 6 Pages: 951-956
- DOI
  10.1109/tcpmt.2014.2315761
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26289247
[Journal Article] Surface Activated Bonding for GaN/Al and Electrical Characterization of Bonded Interface2008
- Author(s)
  A. Kaneko, E. Higurashi, M. Akaike, T. Suga
- Journal Title
  
  Proc. International Conference on Electronics Packaging (in press)
- NAID
  130004589249
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Surface Activated Bonding for GaN/Al and Electrical Characterization of Bonded Interface2008
- Author(s)
  A. Kaneko, E. Higurashi, M. Akaike, T. Suga
- Journal Title
  
  Proc. International Conference on Electronics Packaging (印刷中)
- NAID
  130004589249
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] GaNとA1の表面活性化接合と接合界面の電気的特性評価2008
- Author(s)
  金子明弘、日暮栄治、赤池正剛、須賀唯知
- Journal Title
  
  第22回エレクトロニクス実装学会講演大会講演論文集
  
  Pages: 235-236
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Surface activated bonding for GaN/Al and electrical characterization of bonded interface2008
- Author(s)
  A. Kaneko, E. Higurashi, M. Akaike, T. Suga
- Journal Title
  
  Proc. 22^<nd> JIEP Annual Meeting
  
  Pages: 235-236
- NAID
  130004589249
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] GaNとAlの表面活性化接合と接合界面の電気的特性評価2008
- Author(s)
  金子明弘, 目暮栄治, 赤池正剛, 須賀唯知
- Journal Title
  
  第22回エレクトロニクス実装学会講演大会講演論文集
  
  Pages: 235-236
- NAID
  130004589249
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Room temperature GaN-GaAs direct bonding by argon-beam surface activation2007
- Author(s)
  Eiji Higurashi, Yuichiro Tokuda, Masatake Akaike, and Tadatomo Suga
- Journal Title
  
  Proceedings of SPIE Vol.6717
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Feasibility of SAB using Nano-adhesion Layer for Low Temperature GaN Wafer Bonding2007
- Author(s)
  T. Susa, T. Wakamatsu, M. Akaike, A. Shigetou, E. Higurashi
- Journal Title
  
  Proc. of Electronic Components and Technology Conference
  
  Pages: 1815-1818
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Feasibility of SAB using Nano-adhesion Layer for Low Temperature GaN Wafer Bonding2007
- Author(s)
  T. Suga, T. Wakamatsu, M. Akaike, A. Shigetou, E. Higurashi
- Journal Title
  
  Proc. of Electronic Components and Technology Conference
  
  Pages: 1815-1818
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Effect of SAB process on GaN surfaces for low temperature bonding2007
- Author(s)
  T. Wakamatsu, T. Suga, M. Akaike, A. Shigetou, E. Higurashi
- Journal Title
  
  Proc. of 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
  
  Pages: 41-44
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Effect of SAB process on GaN surfaces for low temperature bonding2007
- Author(s)
  T. Wakamatsu, T. Suga, M. Akaike, A. Shigetou, E. Higurashi
- Journal Title
  
  Proc. of 6th International IEEE Conference on Polymersand Adhesives in Microelectronics and Photonics
  
  Pages: 41-44
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Room temperature GaN-GaAs direct bonding by argon-beam surfaceactivation2007
- Author(s)
  Eiji Higurashi, Yuichiro Tokuda, Masatake Akaike, Tadatomo Suga
- Journal Title
  
  Proceedings of SPIE Vol. 6717
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Journal Article] Room temperature GaN-GaAs direct bonding by argon-beam surface activation2007
- Author(s)
  Eiji Higurashi, Yuichiro Tokuda, Masatake Akaike, Tadatomo Suga
- Journal Title
  
  Proceedings of SPIE Vol. 6717
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-17360155
[Presentation] 銅のギ酸還元反応に関する研究2016
- Author(s)
  藤野真久、松岡直也、赤池正剛、佐藤健太、須賀唯知
- Organizer
  エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京工業大学（東京都目黒区）
- Year and Date
  2016-03-22
- Data Source
  KAKENHI-PROJECT-26289247
[Presentation] Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding2015
- Author(s)
  N. Matsuoka, M. Fujino, M. Akaike, and T. Suga
- Organizer
  ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
- Place of Presentation
  Taipei（台湾）
- Year and Date
  2015-10-21
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289247
[Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct and Hybrid Bonding at Low Temperature
- Author(s)
  Tadatomo Suga, Masakate Akaike, Wenhua Yang
- Organizer
  The 64th Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Florida, USA
- Year and Date
  2014-05-27 – 2014-05-30
- Data Source
  KAKENHI-PROJECT-26289247
[Presentation] 白金触媒を用いたギ酸処理による銅の直接接合のプロセスパラメータ
- Author(s)
  松岡直弥, 赤池正剛, 須賀唯知
- Organizer
  第29回エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学、東京都
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-26289247
[Presentation] Formic Acid Treatment with Pt Catalyst for Cu Direct Bonding at Low Temperature
- Author(s)
  Tadatomo Suga, Masakate Akaike, Naoya Matsuoka
- Organizer
  International Conferenceon Electronics Packaging (ICEP2014)
- Place of Presentation
  富山国際会議場、富山県
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-26289247

1. HIGURASHI Eiji (60372405)

# of Collaborated Projects: 1 results

# of Collaborated Products: 11 results
2. Suga Tadatomo (40175401)

# of Collaborated Projects: 1 results

# of Collaborated Products: 8 results
3. FUJINO Masahisa (70532274)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results

AKAIKW Masatake 赤池 正剛

AKAIKE Masatake 赤池 正剛

Research Projects

Research Products

Co-Researchers

Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt Catalyst

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Surface activated bonding of GaN and its application for optical devices

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid2017

Author(s)

Journal Title

DOI

NAID

Data Source

[Journal Article] Direct bonding for dissimilar metals assisted by carboxylic acid vapor2015

Author(s)

Journal Title

DOI

NAID

Data Source

[Journal Article] Effect of Formic Acid Vapor In Situ Treatment Process on Cu Low-Temperature Bonding2014

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Surface Activated Bonding for GaN/Al and Electrical Characterization of Bonded Interface2008

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] Surface Activated Bonding for GaN/Al and Electrical Characterization of Bonded Interface2008

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] GaNとA1の表面活性化接合と接合界面の電気的特性評価2008

Author(s)

Journal Title

Data Source

[Journal Article] Surface activated bonding for GaN/Al and electrical characterization of bonded interface2008

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] GaNとAlの表面活性化接合と接合界面の電気的特性評価2008

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] Room temperature GaN-GaAs direct bonding by argon-beam surface activation2007

Author(s)

Journal Title

Data Source

[Journal Article] Feasibility of SAB using Nano-adhesion Layer for Low Temperature GaN Wafer Bonding2007

Author(s)

Journal Title

Description

Data Source

[Journal Article] Feasibility of SAB using Nano-adhesion Layer for Low Temperature GaN Wafer Bonding2007

Author(s)

Journal Title

Description

Data Source

[Journal Article] Effect of SAB process on GaN surfaces for low temperature bonding2007

Author(s)

Journal Title

Description

AKAIKW Masatake 赤池正剛

AKAIKE Masatake 赤池正剛