HAMM Didier ハムディディエ

Researcher Number	50324702
External Links
Affiliation (based on the past Project Information) *help	2001 – 2004: 京都大学, エネルギー理工学研究所, 助手
Review Section/Research Field	Principal Investigator Material processing/treatments / Material processing/treatments Except Principal Investigator Material processing/treatments
Keywords	Principal Investigator 陽極酸化 / 多孔質シリコン / ナノ構造 / 自発的構造形成 / マクロ構造 / セルフスタンデング / 柱状構造 / 表面形態 Except Principal Investigator Metal patterning / Immersion plating … More / Electrodeposition / Laser / Photo-excitation / Porous silicon / パターニング / 金属パターニング / 置換めっき / 電析 / レーザー / 光励起 / 多孔質シリコン Less

シリコンの陽極酸化時における多孔質構造のナノからマクロへの自発的変化Principal Investigator
- Principal Investigator
  
  HAMM Didier
- Project Period (FY)
  2003 – 2004
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Kyoto University
Electrochemical Maskless Metal Patterning on Silicon Using Photo-excited Carriers
- Principal Investigator
  
  OGATA Yukio
- Project Period (FY)
  2002 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  KYOTO UNIVERSITY
湿式プロセスによる半導体特性を利用する金属-シリコン複合材料の形成Principal Investigator
- Principal Investigator
  
  HAMM Didier
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Kyoto University

All 2004

All Journal Article

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004
- Author(s)
  D.Hamm, T.Sakka, Y.H.Ogata
- Journal Title
  
  Electrochimica Acta 49
  
  Pages: 4949-4955
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-14350383
[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004
- Author(s)
  D.Hamm, T.Sakka, Y.H.Ogata
- Journal Title
  
  Electrochimica Acta 49・27
  
  Pages: 4949-4955
- Data Source
  KAKENHI-PROJECT-14350383
[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004
- Author(s)
  Didier Hamm
- Journal Title
  
  Electrochim.Acta 49・27
  
  Pages: 4949-4955
- Data Source
  KAKENHI-PROJECT-15760539
[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004
- Author(s)
  D.Hamm, T.Sakka, Y.H.Ogata
- Journal Title
  
  Electrochimica Acta 49(27)
  
  Pages: 4949-4955
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-14350383

1. OGATA Yukio (30152375)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
2. SAKKA Tetsuo (10196206)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results

HAMM Didier ハムディディエ

Research Projects

Research Products

Co-Researchers

シリコンの陽極酸化時における多孔質構造のナノからマクロへの自発的変化Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Electrochemical Maskless Metal Patterning on Silicon Using Photo-excited Carriers

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

湿式プロセスによる半導体特性を利用する金属-シリコン複合材料の形成Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Description

Data Source

HAMM Didier ハム ディディエ

Research Projects

Research Products

Co-Researchers

シリコンの陽極酸化時における多孔質構造のナノからマクロへの自発的変化Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Electrochemical Maskless Metal Patterning on Silicon Using Photo-excited Carriers

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

湿式プロセスによる半導体特性を利用する金属-シリコン複合材料の形成Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Data Source

[Journal Article] Immersion Plating of Copper onto Porous Silicon with Different Thickness2004

Author(s)

Journal Title

Description

Data Source

HAMM Didier ハムディディエ