ITO Shinji 伊藤真二

Researcher Number	50370317
Affiliation (based on the past Project Information) *help	2012: 独立行政法人物質・材料研究機構, 主任研究員 2012: 独立行政法人物質・材料研究機構, その他部局等, その他 2011: 独立行政法人物質・材料研究機構, 共用基盤部門, 主席エンジニア 2009 – 2010: 独立行政法人物質・材料研究機構, 分析支援ステーション, 主席エンジニア 2008: 独立行政法人物質・材料研究機構, 共用基盤部門, 主席エンジニア
Review Section/Research Field	Except Principal Investigator Structural/Functional materials
Keywords	Except Principal Investigator 疑似体液 / 腐食 / 疲労 / フレッティング / 高窒素鋼 / Niフリー / バイオマテリアル / 配線評価用TEG / パルスめっき技術 / 配線抵抗率 … More / 添加剤フリーめつき技術 / 超高純度めっき材料 / ULSI / 微細構造 / 微量不純物 / Cuの高純度化 / TEG / 分子動力学シミュレーション / 革新的高導電性 / 超高純度めっき材 / 添加剤フリー / Cu 配線 / 収差補正STEM / クレヴァス / Ru膜 / 添加剤フリーめっき / 収差補正TEM / 粒界不純物 / 抵抗率 / 超高純度硫酸銅 / Cu配線 / LSI / 情報材料 / 電子 Less

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.
- Principal Investigator
  
  ONUKI Jin (OONUKI Jin)
- Project Period (FY)
  2008 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (S)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Ibaraki University
Fretting fatigue behaviour of Ni-free high-nitrogen stainless steel in a simulated body fluid
- Principal Investigator
  
  MARUYAMA Norio
- Project Period (FY)
  2008 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  National Institute for Materials Science

All 2012 2011 Other

All Journal Article

[Journal Article] Diallyamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition2012
- Author(s)
  M.Takeuchi, K.Kondo, H.Kuri, M.Bunya, M.Okamoto, T.Saito
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 159
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 高流速めっき法による短時間Cu貫通電極形成および電極の微細組織2011
- Author(s)
  門田裕行、菅野龍一、伊藤雅彦、大貫仁
- Journal Title
  
  エレクトロニクス実装学会誌
  
  Volume: 14 Pages: 513-518
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] Texture and Grain Size Investigation in the Copper Plated Through-Siliconvia for Three Dimensional Chip Stacking Using Electron Backscattering Diffraction2011
- Author(s)
  H.Kadota, R.Kanno, M.Itou, J.Onuki
- Journal Title
  
  Electrochemical and Solid-State Letters
  
  Volume: 14
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011
- Author(s)
  田代優, 門田裕行, 伊藤雅彦, 打越雅仁, 三村耕司, 一色実, 大貫仁
- Journal Title
  
  日本金属学会誌
  
  Volume: 75(掲載決定)
- NAID
  10029368773
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] High-speed through silicon via filling using diallylamine additive2011
- Author(s)
  T.Hayashi, K.Kondo, M.Takeuchi, T.Saitou, N.Okamoto
- Journal Title
  
  J.Electrochem.Soc.
  
  Volume: 158
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014
[Journal Article] 三次元実装用貫通電極の高速めっき技術
- Author(s)
  門田裕行、菅野龍一、伊藤雅彦、大貫仁
- Journal Title
  
  エレクトロニクス実装学会誌 (印刷中)
- NAID
  10026477725
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20226014

1. ONUKI Jin (70315612)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results
2. MIMURA Koji (00091752)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
3. ISHIKAWA Nobuhiro (00370312)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. KONDO Kazuo (50250478)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
5. INAMI Takashi (20091853)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. CHONAN Yasunori (30363740)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. UCHIKOSHI Masahito (60447191)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
8. OHTA Hiromichi (70168946)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. NAGANO Takatoshi (70343621)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. KIMURA Takashi (70370319)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. SASAJIMA Yasushi (80187137)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. AOYAMA Takashi (80363737)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. TASHIRO Suguru (90272111)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results
14. MARUYAMA Norio (00343856)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. HIROMOTO Sachiko (00343880)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. AKIYAMA Eiji (70231834)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
17. KATADA Yasuyuki (30127211)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
18. 一色実 (20111247)

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results

ITO Shinji 伊藤 真二

Research Projects

Research Products

Co-Researchers

Nano-structure Control of Cu Interconnects by a Very High Purity Plating Processes and Its Application to Next-generation LSIs.

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Fretting fatigue behaviour of Ni-free high-nitrogen stainless steel in a simulated body fluid

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Diallyamine type copolymer additive which perfectly bottom-up fills Cu electrodeposition2012

Author(s)

Journal Title

Data Source

[Journal Article] 高流速めっき法による短時間Cu貫通電極形成および電極の微細組織2011

Author(s)

Journal Title

Data Source

[Journal Article] Texture and Grain Size Investigation in the Copper Plated Through-Siliconvia for Three Dimensional Chip Stacking Using Electron Backscattering Diffraction2011

Author(s)

Journal Title

Data Source

[Journal Article] 高純度めっき材料を用いた低抵抗率Cu配線形成プロセスの8インチウエハによる検証2011

Author(s)

Journal Title

NAID

Data Source

[Journal Article] High-speed through silicon via filling using diallylamine additive2011

Author(s)

Journal Title

Data Source

[Journal Article] 三次元実装用貫通電極の高速めっき技術

Author(s)

Journal Title

NAID

Data Source

ITO Shinji 伊藤真二