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Yamanaka Kimihiro  山中 公博

ORCIDConnect your ORCID iD *help
Researcher Number 50609229
Affiliation (based on the past Project Information) *help 2018 – 2020: 中京大学, 工学部, 教授
Review Section/Research Field
Principal Investigator
Basic Section 21060:Electron device and electronic equipment-related
Keywords
Principal Investigator
はんだ接合 / 熱疲労破壊 / 半導体 / 接合部 / 高機能半導体 / パワーモジュール / はんだ接合部 / 低温実装 / 液体金属
  • Research Projects

    (1 results)
  • Research Products

    (7 results)
  • Co-Researchers

    (1 People)
  •  Creation of a solder joint using a liquid metal, which can be assembled at a low temperature and does not have a thermal fatigue.Principal Investigator

    • Principal Investigator
      Yamanaka Kimihiro
    • Project Period (FY)
      2018 – 2020
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Review Section
      Basic Section 21060:Electron device and electronic equipment-related
    • Research Institution
      Chukyo University

All 2020 2019 2018

All Presentation

  • [Presentation] 低温実装を実現する液体金属Gaの電気抵抗の温度特性2020

    • Author(s)
      牧田和也,福澤拓郎,鈴木究,田口博久,山中公博
    • Organizer
      スマートプロセス学会26th Symposium on Microjoining and Assembly Technology in Electronics
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] 液体金属Gaによる低温接合について2020

    • Author(s)
      鈴木究,田口博久,山中公博
    • Organizer
      応用物理学会関西支部2019年度第3回講演会
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] Al-Zn合金板とFe板との間に発生した微細Cuデンドライト結晶薄膜形成2020

    • Author(s)
      田邉ほの香,重盛陽平,和田郁海,,山中公博、田口博久
    • Organizer
      エレクトロニクス実装学会第30回マイクロエレクトロニクスシンポジウム
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] 低温接合を実現する液体金属Gaと電極材の界面反応2019

    • Author(s)
      鈴木究,福澤拓郎,田口博久,山中公博
    • Organizer
      エレクトロニクス実装学会第29回マイクロエレクトロニクスシンポジウム,(研究奨励賞)
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] Formation and Mechanism of Cu Dendrite Crystal Thin Films by an Electrochemical Metal Deposition Method2018

    • Author(s)
      Risa Uda, Junya Kuroda, Kimihiro Yamanaka, and Hirohisa Taguchi
    • Organizer
      European Material Research Society, 2018 Fall Meeting
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] Formation of Cu microparticles and its application to printed electronics2018

    • Author(s)
      Junya Kuroda, Risa Uda, Honoka Tanabe, Kimihiro Yamanaka, and Hirohisa Taguchi
    • Organizer
      European Material Research Society, 2018 Fall Meeting
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-18K04272
  • [Presentation] 高純度Cuデンドライト結晶を利用したCuマイクロ粒子の生成と伝導性塗料の開発2018

    • Author(s)
      田邉ほの香、黒田純也、宇田里紗、山中公博、田口博久
    • Organizer
      エレクロニクス実装学会第28回マイクロエレクトロニクスシンポジウム
    • Data Source
      KAKENHI-PROJECT-18K04272
  • 1.  田口 博久 (30453830)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 7 results

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