CHEN CHUANTONG 陳伝とう

… Alternative Names

Chen Chuantong 陳伝とう

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Researcher Number	50791703
Other IDs
Affiliation (Current)	2025: 大阪大学, 産業科学研究所, 特任教授(常勤)
Affiliation (based on the past Project Information) *help	2019 – 2023: 大阪大学, 産業科学研究所, 特任准教授(常勤)
Review Section/Research Field	Principal Investigator Basic Section 21060:Electron device and electronic equipment-related
Keywords	Principal Investigator 信頼性評価 / 大面積接合 / 多素子実装 / 高放熱モジュール / Ag粒子圧粉材 / 低温低圧接合技術 / 高放熱 / 短時間焼結 / Ag シート接合 / 大面積基板接合 … More / パワーモジュール構造 / 高放熱高耐熱実装技術 / 低温短時間焼結 / Ag 圧粉材シート接合 / 低温低加圧 / SiCダイアタッチ / Alシート / ヒーロク / ダイアタッチ接合 / 成膜プロセス / SiCパワーモジュール / 高温信頼性 / パワー半導体 / パワーモジュール / アルミシート接合 Less

Research Projects
(2 results)
Research Products
(34 results)

Development of low-temperature low-pressure large-area bonding technology by high heat-resistant and high-heat dissipation Ag solid porous materialsPrincipal Investigator
- Principal Investigator
  
  陳伝とう
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Osaka University
Development of low temperature low pressure large area heat resistant bonding technologyPrincipal Investigator
- Principal Investigator
  
  Chen Chuantong
- Project Period (FY)
  2019 – 2022
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Osaka University

All 2024 2023 2022 2021 2020 2019

All Journal Article Presentation Book Patent

[Book] Sic Power Module Design: Performance, Robustness and Reliability2022
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Total Pages
  300
- Publisher
  Inst of Engineering & Technology
- ISBN
  9781785619076
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging2024
- Author(s)
  Huo Fupeng、Chen Chuantong、Zhang Zheng、Wang Ye、Suetake Aiji、Takeshita Kazutaka、Yamaguchi Yoshiji、Momose Yashima、Suganuma Katsuaki
- Journal Title
  
  Materials & Design
  
  Volume: 240 Pages: 112863-112863
- DOI
  10.1016/j.matdes.2024.112863
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of micron-sized Cu-Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests2023
- Author(s)
  Chen Chuantong、Kim Dongjin、Liu Yang、Sekiguchi Takuya、Su Yutai、Long Xu、Liu Canyu、Liu Changqing、Suganuma Katsuaki
- Journal Title
  
  Journal of Materials Research and Technology
  
  Volume: 24 Pages: 8967-8983
- DOI
  10.1016/j.jmrt.2023.05.104
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules2023
- Author(s)
  Xu Yuxin、Qiu Xiaoming、Li Wangyun、Wang Suyu、Ma Ninshu、Ueshima Minoru、Chen Chuantong、Suganuma Katsuaki
- Journal Title
  
  Journal of Materials Research and Technology
  
  Volume: 26 Pages: 1079-1093
- DOI
  10.1016/j.jmrt.2023.07.254
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Large-scale bare Cu bonding by 10μm-sized Cu-Ag composite paste in low temperature low pressure air conditions2023
- Author(s)
  Chen Chuantong、Zhao Shuaijie、Sekiguchi Takuya、Suganuma Katsuaki
- Journal Title
  
  Journal of Science: Advanced Materials and Devices
  
  Volume: 8 Issue: 3 Pages: 100606-100606
- DOI
  10.1016/j.jsamd.2023.100606
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures2023
- Author(s)
  Li W.Y.、Chen C.T.、Ueshima M.、Kobatake T.、Suganuma K.
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 150 Pages: 115105-115105
- DOI
  10.1016/j.microrel.2023.115105
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Fatigue-Resistant of Ag Sinter Joining on Ni-P/Pd/Au Finished DBA Substrate with Thick Ni-P Layer During Thermal Shock Test2022
- Author(s)
  Chuantong Chen，Katsuaki Suganuma
- Journal Title
  
  ECS Transactions
  
  Volume: 108 Pages: 21-26
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022
- Author(s)
  Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
- Journal Title
  
  China Welding
  
  Volume: 31 Pages: 15-21
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022
- Author(s)
  Chuantong Chen, Hao Zhang, Jinting Jiu, Xu Long, Katsuaki Suganuma
- Journal Title
  
  China welding
  
  Volume: 31 Pages: 15-21
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Journal Article] Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock2022
- Author(s)
  Liu Yang、Chen Chuantong、Zhang Zheng、Ueshima Minoru、Sakamoto Takeshi、Naoe Takuya、Nishikawa Hiroshi、Oda Yukinori、Suganuma Katsuaki
- Journal Title
  
  Materials & Design
  
  Volume: 224 Pages: 111389-111389
- DOI
  10.1016/j.matdes.2022.111389
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04243
[Journal Article] Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release2020
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Journal Title
  
  Scientific reports
  
  Volume: 10 Issue: 1 Pages: 9042-9042
- DOI
  10.1038/s41598-020-66069-8
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-19K15046
[Patent] 放熱構造体の製造方法2024
- Inventor(s)
  CHEN　CHUANTONG、小林　幸司
- Industrial Property Rights Holder
  CHEN　CHUANTONG、小林　幸司
- Industrial Property Rights Type
  特許
- Filing Date
  2024
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 合金粉末含有組成物、及び半導体装置2023
- Inventor(s)
  CHEN　CHUANTONG、劉洋、直永卓也、上島稔、坂本健志
- Industrial Property Rights Holder
  CHEN　CHUANTONG、劉洋、直永卓也、上島稔、坂本健志
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 金属シート2023
- Inventor(s)
  CHEN　CHUANTONG、上島　稔、下山　章夫
- Industrial Property Rights Holder
  CHEN　CHUANTONG、上島　稔、下山　章夫
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 劣化診断方法および劣化診断装置2023
- Inventor(s)
  CHEN　CHUANTONG、菅沼克昭、柳田憲史、増澤高志
- Industrial Property Rights Holder
  CHEN　CHUANTONG、菅沼克昭、柳田憲史、増澤高志
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 低温焼結性接合用材料および接合構造体2023
- Inventor(s)
  CHEN　CHUANTONG、劉　洋、上島　稔
- Industrial Property Rights Holder
  CHEN　CHUANTONG、劉　洋、上島　稔
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Patent] 表面改質低温焼結接合金属2023
- Inventor(s)
  陳伝とう
- Industrial Property Rights Holder
  陳伝とう
- Industrial Property Rights Type
  特許
- Filing Date
  2023
- Acquisition Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel Al/AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions2023
- Author(s)
  C Chen; Y Liu; M Ueshima; K Suganuma
- Organizer
  2023 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] "(Invited Keynote) Progress of Ag paste sinter joining in WBG power modules "2023
- Author(s)
  C Chen
- Organizer
  The 9th International Forum on Wide Bandgap Semiconductors (IFWS 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Simulation of morphology evolution and pore segregation of Ag sinter joint at high temperature2023
- Author(s)
  Y Wang; C Chen; G Fu; B Wan; K Suganuma
- Organizer
  2023 24th International Conference on Electronic Packaging Technology (ICEPT)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of Ag-Si composite paste joining for high thermal reliability in SiC power module2023
- Author(s)
  C Chen; Y Liu; M Ueshima; K Nakayama; K Suganuma
- Organizer
  Materials Research Society of Japan (MRS-J)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] (Invited Keynote)Progress of Ag sinter joining technology in SiC power modules2023
- Author(s)
  C Chen
- Organizer
  9th International Conference on Welding Science and Engineering (WSE 2023)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Phase Formation and Transformation Behavior in Rapidly Solidified Ag-Si Alloys2023
- Author(s)
  Yicheng Zhang; Koji Nakayama; Chuantong Chen; Minoru Ueshima; Katsuaki Suganuma
- Organizer
  TMS 2024 Annual Meeting & Exhibition
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] High reliability design Ag sinter joining on softened Ni-P/Pt/Ag metallization substrate during harsh thermal cycling2023
- Author(s)
  C Chen; Y Liu; W Li; F Huo; M Ueshima; T Sakamoto; Y Oda,K Suganuma
- Organizer
  2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Improvement of Bonding Strength and Thermal Shock Reliability for Ag Sinter Joining Direct on Al Substrate2023
- Author(s)
  C Chen; R Liu; K Kobayashi; H Osanai; Z Zhang; K Suganuma
- Organizer
  2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions2023
- Author(s)
  Chuantong Chen , Yang Liu, Minoru Ueshima, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Rapid silver sinter joining technology for large area chips2023
- Author(s)
  Luobin Zhang,Chuantong Chen, Fupeng Huo, Wangyun Li, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging2023
- Author(s)
  C Chen; Y Liu; W Li; M Ueshima; K Nakayama; K Suganuma
- Organizer
  2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] "(Invited Keynote) Ag sinter joining and beyond Ag sinter joining technologies for WEB power device in high temperature applications "2023
- Author(s)
  C Chen
- Organizer
  2023 24th International Conference on Electronic Packaging Technology (ICEPT)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules2022
- Author(s)
  Chuantong Chen, Zheng Zhang, Yang Liu, Katsuaki Suganuma
- Organizer
  2022 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] Micro-flake Ag paste sinter joining on bare DBA substrate for high temperature SiC power modules2022
- Author(s)
  Chuantong Chen, Katsuaki Suganuma
- Organizer
  International Conference on Electronics Packaging (ICEP 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04243
[Presentation] Novel approach of die attach technology for SiC power module by pure Al thin film bonding2021
- Author(s)
  Chuantong Chen,Katsuaki Suganuma
- Organizer
  2021 International Conference on Electronics Packaging
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] SiCパワーモジュール向けの新型アルミ膜ダイアタッチ接合技術2020
- Author(s)
  陳伝とう;・菅原徹・菅沼克昭
- Organizer
  第 33 回（2020 年）セラミックス秋季シンポジウム
- Data Source
  KAKENHI-PROJECT-19K15046
[Presentation] Die attach module by Cu sheet interconnect for high temperature applications2019
- Author(s)
  Chuantong Chen, Dongjin Kim, Zheng Zhang, Katsuaki Suganuma
- Organizer
  20th International Conference on Electronic Materials and Packaging (EMAP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19K15046

CHEN CHUANTONG 陳 伝とう

Chen Chuantong 陳 伝とう

Research Projects

Research Products

Development of low-temperature low-pressure large-area bonding technology by high heat-resistant and high-heat dissipation Ag solid porous materialsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of low temperature low pressure large area heat resistant bonding technologyPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Book] Sic Power Module Design: Performance, Robustness and Reliability2022

Author(s)

Total Pages

Publisher

ISBN

Data Source

[Journal Article] Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging2024

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Development of micron-sized Cu-Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests2023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules2023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Large-scale bare Cu bonding by 10μm-sized Cu-Ag composite paste in low temperature low pressure air conditions2023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures2023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Fatigue-Resistant of Ag Sinter Joining on Ni-P/Pd/Au Finished DBA Substrate with Thick Ni-P Layer During Thermal Shock Test2022

Author(s)

Journal Title

Data Source

[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022

Author(s)

Journal Title

Data Source

[Journal Article] Thermal fatigue behaviors of SiC power module by Ag sinter joining under harsh thermal shock test2022

Author(s)

Journal Title

Data Source

[Journal Article] Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Low temperature SiC die-attach bonding technology by hillocks generation on Al sheet surface with stress self-generation and self-release2020

Author(s)

Journal Title

DOI

Data Source

[Patent] 放熱構造体の製造方法2024

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Filing Date

Data Source

[Patent] 合金粉末含有組成物、及び半導体装置2023

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Filing Date

CHEN CHUANTONG 陳伝とう

Chen Chuantong 陳伝とう