Ito Kazuhiro 伊藤和博

… Alternative Names

ITO KAZUHIRO 伊藤和博

ITO Kazuhiro 伊藤和博

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Researcher Number	60303856
Other IDs
External Links
Affiliation (Current)	2025: 大阪大学, 接合科学研究所, 教授
Affiliation (based on the past Project Information) *help	2021 – 2023: 大阪大学, 接合科学研究所, 教授 2013 – 2014: 大阪大学, 接合科学研究所, 教授 2012: 大阪大学, 接合科学研究所, 准教授 2007 – 2009: Kyoto University, Graduate School of Engineering Dept of Materials Srience and Engineering, Associate Prof. 2004 – 2006: 京都大学, 工学研究科, 助教授 … More 2003: 京都大学, 工業研究科, 助手 2000 – 2003: Kyoto University, Materials Science and Engineering, Research Associate, 工学研究科, 助手 1999: 京都大学, 大学院・工学研究科, 助手 1998: KYOTO UNIVERSITY,Graduate School of Engineering, Department of Materials Science, 工学研究科, 助手 Less
Review Section/Research Field	Principal Investigator Structural/Functional materials / Structural/Functional materials / Basic Section 26030:Composite materials and interfaces-related / Composite materials/Physical properties / Nanomaterials engineering / Material processing/treatments Except Principal Investigator Structural/Functional materials / Physical properties of metals / Material processing/treatments
Keywords	Principal Investigator SiC / Cu配線 / GaN / a軸比 / c / C11_b構造 / PdZr_2 / MoSi_2 / ワイヤアーク付加製造 / Flow3D … More / 被溶接体振動 / タンデムトーチ / 実効入熱 / マランゴニ対流 / 溶融池流体計算 / 被溶接体正弦波振動 / 溶込み形状 / ダンデムトーチ / ガスメタルアーク溶接 / Ohmic Contacts / Self-formation / Cu Interconnects / Thin Films / 表皮効果 / オーミックコンタクト / 自己組織化 / 薄膜 / 界面反応 / p型伝導 / Ti基酸化物 / 透明導電膜 / ITO / チタン / マグネシウム / Cu合金膜 / IGZO / 接触抵抗 / 密着性 / 抵抗率 / Cu(Ti) / Cu(Mg) / 熱処理 / 金属バッファ層 / 酸溶解 / 導電性基板 / 金属バッファ / ヘテロエビタキシャル成長 / 反応スパッタ / バッファ層 / ヘテロエピタキシャル / TiN / 遷移金属窒化物 / 熱電能 / 熱伝導 / 電気伝導 / 弾性率 / 熱膨張 / 拡散 / 相変態 / 耐酸化コーティング / 遷移金属シリサイド / Mo_5Si_3 / 複相材料 / パック・セメンテーション / 耐酸化性 / 室温靭性 / 高温強度 / Mo / Mo_5SiB_2 / 超高温構造材料 / 転位の分解 / 2<331>転位 / 逆位相境界 / シュミレーション / Modified EAM / 塑性異方性 / 2<331>らせん転位 / 1 … More Except Principal Investigator 組織制御 / クラック / 転位 / 水素吸蔵合金 / Ti_3Al / TiAl-base alloys / 変形 / ラメラ組織 / 一方向凝固 / TiAl / TiAl基合金 / SiC / 引張延性 / 高分解能電子顕微鏡法 / TiAl合金 / Interfacial microstructure / Current transport / Potentiometry / Wide-gap semiconductor / Ohmic contact / STP解析 / 炭化シリコン / ポテンショメトリー / 走査トンネル顕微鏡 / 半導体界面 / 金属 / オーム性電極材料 / 微細構造 / 電流輸送 / STP解析法 / ワイドギャップ半導体 / オーム性電極 / Constraint deformation / Mechanical properties / Lamellar microstructure / Seeding / Directional solidification / 延性 / 強度 / 拘束変形 / 層状(ラメラ)組織 / 凝固条件 / クリープ強度 / 一方向凝固合金 / 一方向凝固プロセス / 変形モード / 破壊応力 / 拘束付き圧縮試験 / Transmission electron microscopy / Crack / Dislocation / Lattice defects / Powdering / Activation / Absorption pressure / Hydrogen-absorbing alloy / 透過電子顕微鏡法 / 格子欠陥 / 微粉化 / 初期活性化 / 水素吸蔵圧 / Mg-Ca-Ni alloys / microstructure control / microstructure / Ti-Al-Nb alloys / Hydrogen absorption / 多相効果 / FeTi / LaNi_5 / Ti-A1-Nb合金 / Ti_3A1 / クラック形成 / 微紛化 / 水素吸放出平衡圧 / 水素吸蔵材料 / Mg-Ni-Ca系合金 / ラーベス相 / Ti-Al-Nb系合金 / Ti_3Al合金 / Mg-Ni-Ca合金 / 組織 / Ti-Al-Nb合金 / 水素吸蔵 / creep / Deformation mechanism / lamellar microstructure / seeding / directional solidification / 破壊靭性 / クリープ特性 / クリープ / 種付け / convergent-beam electron diffraction / Czochralski method / floating-zone method / seed / transition-metal silicide / polytype / flux method / EDS分析 / 収束電子線回折 / チョクラルスキー(CZ)法 / フローティングゾーン(FZ)法 / 種結晶 / 遷移金属シリサイド / ポリタイプ / フラックス法 / Yield stress / tensile ductility / strain incompatibility / high-resolution electron microscopy / grain boundary structure / lamellar structure / TiAl Alloys / Intermetallic compound / 降伏強度 / 塑性歪不適合 / 粒界構造 / 層状組織 / 金属間化合物 / フェライト / 固相変態 / 国際情報交換アメリカ / 凝固 / 微細粒 / オキサイドメタラジー / 溶接 Less

Penetration Shape Improvement and Investigation of its Mechanism in Workpiece Vibration Assisted Gas Metal Arc WeldingPrincipal Investigator
- Principal Investigator
  
  Ito Kazuhiro
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Osaka University
Synthesis of p-type transparent conductive Ti-oxides based films utilizing interface reactionPrincipal Investigator
- Principal Investigator
  
  ITO Kazuhiro
- Project Period (FY)
  2013
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Nanomaterials engineering
- Research Institution
  Osaka University
Seeking innovative alloy elements for development of low-temperature and high-reliability Cu-alloy interconnects and electrodes with reducing process temperaturePrincipal Investigator
- Principal Investigator
  
  ITO KAZUHIRO
- Project Period (FY)
  2012 – 2014
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Oxide utilization technology for microstructure evolution in weld metal
- Principal Investigator
  
  KOMIZO Yuichi
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
導電性基板上でのGaN半導体成膜のための金属バッファ層の開発Principal Investigator
- Principal Investigator
  
  伊藤和博
- Project Period (FY)
  2008 – 2009
- Research Category
  
  Grant-in-Aid for Challenging Exploratory Research
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
Developments of new complex materials using mime and interface diffusion of the supersaturated alloy elements in thin filmsPrincipal Investigator
- Principal Investigator
  
  ITO Kazuhiro, 村上正紀
- Project Period (FY)
  2006 – 2007
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Physical properties
- Research Institution
  Kyoto University
金属バッファ層上でのGaN半導体の結晶成長-遷移金属窒化物に着目して-Principal Investigator
- Principal Investigator
  
  伊藤和博
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
遷移金属ボロシリサイドと関連化合物の機能材料としての基礎物性Principal Investigator
- Principal Investigator
  
  伊藤和博
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
Ohmic contact materials for wide-gap semiconductors : Fabrication and STP analysis.
- Principal Investigator
  
  MURAKAMI Masanori
- Project Period (FY)
  2003 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Physical properties of metals
- Research Institution
  KYOTO UNIVERSITY
C11_b構造を有する超高温構造材料の設計:-c/a軸比の制御-Principal Investigator
- Principal Investigator
  
  伊藤和博
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
Development of fundamental processes of directional solidification of TiAl-base Alloy
- Principal Investigator
  
  YAMAGUCHI Masaharu
- Project Period (FY)
  2001 – 2003
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Structural/Functional materials
- Research Institution
  KYOTO UNIVERSITY
Powdering limit of hydrogen absorbing intermetallic compounds
- Principal Investigator
  
  YAMAGUCHI Masaharu
- Project Period (FY)
  2000 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
Mechanisms of hydride formation in hydrogen-absorbing alloys - with special attention to introduction of lattice defects -
- Principal Investigator
  
  INUI Haruyuki
- Project Period (FY)
  2000 – 2001
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  KYOTO UNIVERSITY
MoSi_2単結晶に見られる塑性異方性に関するatomisticな研究Principal Investigator
- Principal Investigator
  
  伊藤和博
- Project Period (FY)
  1999 – 2001
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Structural/Functional materials
- Research Institution
  Kyoto University
Development of high creep-resistant TiAl-base alloys for directional solidification and measurements of their creep resistance using large-sized specimens
- Principal Investigator
  
  YAMAGUCHI Masaharu
- Project Period (FY)
  1998 – 2000
- Research Category
  
  Grant-in-Aid for Scientific Research (A).
- Research Field
  
  Structural/Functional materials
- Research Institution
  KYOTO UNIVERSITY
Grain boundaries and deformation in two-phase TiAl alloys-Approach with bi-PST TiAl-
- Principal Investigator
  
  INUI Haruyuki
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  KYOTO UNIVERSITY
Synthesis of large beta-SiC single crystals by 'silicide-flux'method
- Principal Investigator
  
  INUI Haruyuki
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Structural/Functional materials
- Research Institution
  KYOTO UNIVERSITY

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All Journal Article Presentation Patent

[Journal Article] Effect of workpiece vibration frequency on heat distribution and material flow in the molten pool in tandem-pulsed gas metal arc welding2023
- Author(s)
  Hamed Zargari Habib、Ito Kazuhiro、Sharma Abhay
- Journal Title
  
  The International Journal of Advanced Manufacturing Technology
  
  Volume: 129 Pages: 2507-2522
- DOI
  10.1007/s00170-023-12424-8
- Peer Reviewed / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K04677
[Journal Article] Synthesis using Cu(Ti) alloy films for self-forming functionality in electronic devices2014
- Author(s)
  K. Ito and K. Kohama
- Journal Title
  
  Transactions of JWRI
  
  Volume: 43 Pages: 37-43
- NAID
  120005588197
- Data Source
  KAKENHI-PROJECT-24360307
[Journal Article] Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates2014
- Author(s)
  K. Ito, K. Hamasaka, K. Kohama, Y. Shirai, and M. Murakami
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 43 Issue: 7 Pages: 2540-2547
- DOI
  10.1007/s11664-014-3224-0
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24360307
[Journal Article] Low-Temperature Synthesis of High-Adhesion Cu(Mg) Alloy Films on Glass Substrates2014
- Author(s)
  Kazuhiro Ito
- Journal Title
  
  Journal of Electrnic Materials
  
  Volume: -
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24360307
[Journal Article] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成2013
- Author(s)
  伊藤和博
- Journal Title
  
  まてりあ
  
  Volume: 52 Pages: 108-115
- NAID
  10031155976
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-24360307
[Journal Article] Effects of TiN Ruffer Layer Thickness on GaN Growth2009
- Author(s)
  K. Ito, Y. Uchida, S. Lee, S. Tsukimoto, Y. Ikemoto, K. Hirata
- Journal Title
  
  Journal of Electronic Materials 38
  
  Pages: 511-517
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20656112
[Journal Article] Simultaneous formation of n-and p-type ohmic contacts to 4H-SiC using the binary Ni/Al system2008
- Author(s)
  K. Ito, T. Onishi, H. Takeda, S. Tsukimoto, M. Konno, Y. Suzuki and M. Murakami
- Journal Title
  
  MRS Proceedings (in press)
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Self-formation of Ti-rich interfacial layers at Cu(Ti)/low-k interfaces2008
- Author(s)
  K. Kohama, K. Ito, S. Tsukimoto, K. Mori, K. Maekawa and M. Murakami
- Journal Title
  
  MRS Proceedings (in press)
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Simultaneous formation of n- and p-type ohmic contacts to 4H-SiC using the binary Ni/A1 system2008
- Author(s)
  K., Ito, T., Onishi, H., Taloda, S., Tsukimoto, M., Konno, Y., Suzuki, M., Morakami
- Journal Title
  
  MRS Proceedings (in press)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Self-formation of Ti-rich interfacial layers at Cu(Ti)/low-k interfaces2008
- Author(s)
  K., Kohama, K., Ito, S., Tsukimoto, K., Mori, K., Maekawa, M., Murakami
- Journal Title
  
  MRS Proceedings (in press)
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Epitaxial growth of GaN layers on ultra-thin metallic TiN buffer layers2007
- Author(s)
  K.Ito, Y.Uchida, S-J.Lee, S.Tsukimoto, Y.Ikemoto, K.Hirata, M.
- Journal Title
  
  Extraction, Processing, Structure and Properties Proceedings on General Abstracts : Electronic, Magnetic, and Photonic Materials Division
  
  Pages: 7-12
- Data Source
  KAKENHI-PROJECT-17760568
[Journal Article] Effects of substrate materials on self-formation of Ti-rich interface layers in Cu(Ti) alloy films2007
- Author(s)
  K., Ito, S., Tsukimoto, T., Kabe, K., Tada, M., Murakami
- Journal Title
  
  Journal of Electronic Materials 36
  
  Pages: 606-613
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Effects of substrate materials on self-formation of Ti-rich interface layers in Cu(Ti)alloy films2007
- Author(s)
  K. Ito, S. Tsukimoto, T. Kabe, K. Tada and M. Murakami
- Journal Title
  
  Journal of Electronic Materials 36
  
  Pages: 606-613
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Resistivity reduction of Cu interconnects2007
- Author(s)
  K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
- Journal Title
  
  Stress-Induced Phenomena in Metallization, AIP Conference Proceedings 945
  
  Pages: 1-10
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Self-formation of Ti-rich interface layers in Cu(Ti) alloy films on various substrates2007
- Author(s)
  K.Ito, S.Tsukimoto, T.Kabe, K.Tada, M.Murakami
- Journal Title
  
  Journal of Electronic Materials
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Fabrication of Cu (Ti) alloy interconnects with self-formation of thin barrier metal layers using a high-2007
- Author(s)
  S. Tsukimoto, T. Onishi, K. Ito, M. Konno, T. Yaguchi, T. Kamino
- Journal Title
  
  Journa of Electronic Materials 36
  
  Pages: 1658-1661
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Resistivity reduction of Cu interconnects2007
- Author(s)
  K., Ito, S., Tsukimoto, M., Moriyama, M., Murakami
- Journal Title
  
  AIP Conference Proceedings 945
  
  Pages: 1-10
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti)interconnects2007
- Author(s)
  S. Tsukimoto, T. Kabe, K. Ito and M. Murakami
- Journal Title
  
  Journal of Electronic Materials 36
  
  Pages: 258-265
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Fabrication of Cu(Ti)alloy interconnects with self-formation of thin barrier metal layers using a high-pressure annealing process2007
- Author(s)
  S. Tsukimoto, T. Onishi, K. Ito, M. Konno, T. Yaguchi, T. Kamino and M. Murakami
- Journal Title
  
  Journal of Electronic Materials 36
  
  Pages: 1658-1661
- Description
  「研究成果報告書概要(和文)」より
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti) interconnects2007
- Author(s)
  S.Tsukimoto, T.Kabe, K.Ito, M.Murakami
- Journal Title
  
  Journal of Electronic Materials
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Characterization of GaN layers grown on metallic TiN buffer layers2007
- Author(s)
  S-J.Lee, K.Ito, Y.Uchida, S.Tsukimoto, Y.Ikemoto, K.Hirata, M.
- Journal Title
  
  Extraction, Processing, Structure and Properties Proceedings on General Abstracts : Electronic, Magnetic, and Photonic Materials Division
  
  Pages: 1-5
- Data Source
  KAKENHI-PROJECT-17760568
[Journal Article] Self-formation of Ti-rich Interfacial Layers in Cu(Ti) Alloy Film2007
- Author(s)
  K.Ito, S.Tsukimoto, M.Murakami
- Journal Title
  
  Japanese Journal of Applied Physics 46
- NAID
  10022547534
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Reduction of Electrical Resistivity of Cu Interconnects2007
- Author(s)
  M.Murakami, M.Moriyama, S.Tsukimoto, K.Ito, T.Onichi
- Journal Title
  
  Extraction, Processing, Structure and Properties Proceedings on Electronic. Maenetic and Photonic Materials Division Symposium
  
  Pages: 1-9
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti) interconnects2007
- Author(s)
  S., Tsukimoto, T., Kabe, K., Ito, M., Murakami
- Journal Title
  
  Journal of Electronic Materials 36
  
  Pages: 258-265
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Resistivity reduction of Cu interconnects2007
- Author(s)
  K., Ito, S. Tsukimoto, M. Moriyama and M. Murakami
- Journal Title
  
  Stress-Induced Phenomena in Metallization, AIP Conference Proceedings 945
  
  Pages: 1-10
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Epitaxial growth of GaN layers on metallic TiN buffer layers2006
- Author(s)
  Y.Uchida, K.Ito, S.Tsukimoto, Y.Ikemoto, K.Hirata, N.Shibata, M.
- Journal Title
  
  Journal of Electronic Materials 35・10
  
  Pages: 1806-1812
- Data Source
  KAKENHI-PROJECT-17760568
[Journal Article] Cu(Ti)合金微細配線における極薄バリア層の自己組織形成2006
- Author(s)
  着本享、大西隆、伊藤和博、村上正紀、今野充、矢口紀恵、上野武志
- Journal Title
  
  日本金属学会会報(まてりあ) 45
  
  Pages: 879-879
- NAID
  10018421961
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Epitaxial GaN Layer Growth Using Nitrogen Enriched TiN Buffer Layers2006
- Author(s)
  K.Ito, Y.Uchida, S-J.Lee, S.Tsukimoto, Y.Ikemoto, K.Hirata, M.
- Journal Title
  
  Materials Research Society Symposium Proceedings 916
- Data Source
  KAKENHI-PROJECT-17760568
[Journal Article] Cu(Ti)合金微細配線における極薄バリア層の自己組織形成2006
- Author(s)
  着本享, 大西隆, 伊藤和博, 村上正紀, 今野充, 矢口紀恵, 上野
- Journal Title
  
  日本金属学会会報(まてりあ) 45
  
  Pages: 879-879
- NAID
  10018421961
- Data Source
  KAKENHI-PROJECT-18360324
[Journal Article] Elastic and thermal expansion anisotropy of Mo-based 5-3 silicides2005
- Author(s)
  Taisuke Hayashi, Kazuhiro Ito et al.
- Journal Title
  
  Materials Science Forum 475-479
  
  Pages: 695-698
- Data Source
  KAKENHI-PROJECT-15686028
[Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system.2005
- Author(s)
  S.Tsukimoto, T.Sakai, T.Onishi, K.Ito, Masanori Murakami
- Journal Title
  
  Journal of Electronic Materials, 34
  
  Pages: 1310-1312
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15206069
[Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system2005
- Author(s)
  S.Tsukimoto, T.Sakai, T.Onishi, Kazuhiro Ito, Masanori Murakami
- Journal Title
  
  Journal of Electronic Materials 34
  
  Pages: 1310-1312
- Data Source
  KAKENHI-PROJECT-15206069
[Journal Article] Effect of Nb and W alloying addition to Mo_5Si_3 on anisotropy of thermal expansion as well as elastic properties2005
- Author(s)
  Taisuke Hayashi, Kazuhiro Ito et al.
- Journal Title
  
  Metallurgical and Materials Transactions A (In press)
- Data Source
  KAKENHI-PROJECT-15686028
[Journal Article] Oxidation protective silicide coating on Mo-Si-B alloys2005
- Author(s)
  Kazuhiro Ito et al.
- Journal Title
  
  Metallurgical and Materials Transactions A (In press)
- Data Source
  KAKENHI-PROJECT-15686028
[Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system2005
- Author(s)
  S.Tsukimoto, T.Sakai, T.Onishi, K.Ito, Masanori Murakami
- Journal Title
  
  Journal of Electronic Materials 34巻
  
  Pages: 1310-1312
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15206069
[Journal Article] Growth of GaN on nitriding TiN buffer layers2005
- Author(s)
  T.Watanabe, K.Ito, S.Tsukimoto, Y.Ushida, M.Moriyama, N.Shibata, M.Murakami
- Journal Title
  
  Materials Transactions 46・9
  
  Pages: 1975-1978
- NAID
  130004452878
- Data Source
  KAKENHI-PROJECT-17760568
[Journal Article] 超高温材料としてのMo-Si-B三元系合金の機械的性質および機能性2005
- Author(s)
  伊藤和博
- Journal Title
  
  まてりあ:日本金属学会 44・2
  
  Pages: 16-21
- NAID
  10014418168
- Data Source
  KAKENHI-PROJECT-15686028
[Journal Article] Reaction diffusion of MoSi_2 and Mo_5SiB_22004
- Author(s)
  Taisuke Hayashi, Kazuhiro Ito et al.
- Journal Title
  
  Intermetallics 13・1
  
  Pages: 93-100
- Data Source
  KAKENHI-PROJECT-15686028
[Journal Article] p型SiC半導体/TiAl系オーミック・コンタクト材の界面構造2004
- Author(s)
  着本享, 伊藤和博, 村上正紀
- Journal Title
  
  日本金属学会会報"まてりあ" 43巻
  
  Pages: 992-992
- NAID
  10014238911
- Data Source
  KAKENHI-PROJECT-15206069
[Journal Article] Epitaxial growth of GaN layers on metallic TiN buffer layers
- Author(s)
  Y.Uchida, K.Ito, S.Tsukimoto, Y.Ikemoto, K.Hirata, N.Shibata, M.Murakami
- Journal Title
  
  Journal of Electronic Materials (投稿中)
- Data Source
  KAKENHI-PROJECT-17760568
[Patent] 半導体素子およびその製造法2006
- Inventor(s)
  内田悠, 李相陳, 伊藤和博, 着木享, 村上正紀, 池本由平, 平田宏治
- Industrial Property Number
  2006-077443
- Filing Date
  2006-03-17
- Data Source
  KAKENHI-PROJECT-17760568
[Patent] 半導体素子およびその製造法2006
- Inventor(s)
  伊藤和博, 内田悠, 着木享, 村上正紀, 池本由平, 平田宏治
- Industrial Property Number
  2006-051163
- Filing Date
  2006-02-27
- Data Source
  KAKENHI-PROJECT-17760568
[Patent] 半導体配線の製造方法2006
- Inventor(s)
  大西隆、武田実佳子、水野雅夫、着本享、可部達也、森田敏文、守山実希、伊藤和博、村上正紀
- Industrial Property Rights Holder
  神戸製鋼所・京都大学
- Industrial Property Number
  2006-192153
- Filing Date
  2006-07-12
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] 溶融池の温度分布と溶湯流動に及ぼす被溶接体振動の影響2023
- Author(s)
  伊藤　和博
- Organizer
  日本金属学会
- Data Source
  KAKENHI-PROJECT-21K04677
[Presentation] Contact-Resistance Reduction for Cu(Ti)/Conductive-Oxide-Film Junction2015
- Author(s)
  伊藤　和博
- Organizer
  The 6th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-6)
- Place of Presentation
  早稲田大学, 東京都
- Year and Date
  2015-06-09
- Invited
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Synthesis of Low Contact-Resistance Cu(Ti) /ITO Junctions2014
- Author(s)
  Kazuhiro Ito, W. Nakagawa, Y. Shirai, M. Murakami
- Organizer
  TMS 143rd Annual Meeting & Exhibition
- Place of Presentation
  San Diego Convention Center (California, USA)
- Data Source
  KAKENHI-PROJECT-25600040
[Presentation] Synthesis of low contact-resistance Cu(Ti)/ITO junctions2014
- Author(s)
  Kazuhiro Ito
- Organizer
  TMS2014 Annual Meeting & Exhibition
- Place of Presentation
  San Diego Convention Center (California, USA)
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Reduction of Contact Resistance for Cu(Ti)/IGZO Junction2014
- Author(s)
  K. Ito, K. Kohama, T. Sano, T. Nabatame and A. Ohi
- Organizer
  The 5th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5) Conjunction with 6th IBB Frontier Symp.
- Place of Presentation
  東京医科歯科大学, 東京都
- Year and Date
  2014-11-19
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Synthesis of low contact-resistance Cu(Ti)/ITO junctions2014
- Author(s)
  伊藤　和博
- Organizer
  The Minerals, Metals & Materials Society
- Place of Presentation
  San Diego Convention Center (California, USA)
- Data Source
  KAKENHI-PROJECT-25600040
[Presentation] p型Ti酸化物透明導電膜の作製と物性評価2013
- Author(s)
  京大工林徳樺(現クボタ), 阪大接合研伊藤和博, 小濱和之, 神鋼リサーチ大西隆, 京大工白井泰治, 立命館村上正紀
- Organizer
  (公社)日本金属学会2013年秋期大会
- Place of Presentation
  金沢大学(石川県)
- Data Source
  KAKENHI-PROJECT-25600040
[Presentation] 子デバイスへのCu配線形成のための金属材料学的アプローチ2013
- Author(s)
  伊藤和博
- Organizer
  日本金属学会　第1回エレクトロニクス薄膜材料研究会(招待講演)
- Place of Presentation
  大阪大学中ノ島センター(大阪府)
- Invited
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] 低抵抗・高密着Cu配線形成のためのCu(Mg)合金膜を用いた低温プロセス開発2013
- Author(s)
  伊藤和博
- Organizer
  日本金属学会
- Place of Presentation
  東京理科大学(東京都)
- Year and Date
  2013-03-27
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成2013
- Author(s)
  伊藤和博
- Organizer
  京都大学工学研究科附属量子理工学教育研究センター第14回公開シンポジウム(招待講演)
- Place of Presentation
  量子理工学教育研究センター(京都府)
- Invited
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Integration of various functions using Ti as an alloy element for Cu interconnects in electronic devices2013
- Author(s)
  Kazuhiro Ito
- Organizer
  韓国金属材料学会2013春期大会(招待講演)
- Place of Presentation
  済州島 (韓国)
- Invited
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Reduction of Contact Resistance for Cu(Ti)/ITO Junction2012
- Author(s)
  Kazuhiro ITO
- Organizer
  Visualization in Joining & Welding Science through Adv. Measurements and Simulation (Visual-JW2012)
- Place of Presentation
  ホテル阪急エキスポパーク(大阪府)
- Year and Date
  2012-11-29
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Reduction of Process Temperature and Time for Producing Low-Resistivity and excellent-Adhesion Cu Interconnects on Glass Substrates Using Cu(Mg) Alloy Films2012
- Author(s)
  Kazuhiro ITO
- Organizer
  The 3rd Int. Symp. on Adv. Materials Development and Integrati on of Novel Structural Metallic and Inorganic Materials (AMDI3)
- Place of Presentation
  ロワジールホテル豊橋(愛知県)
- Year and Date
  2012-11-06
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Self-formation of Ti-rich layers at Cu(TO/low-k interfaces2008
- Author(s)
  K., Kohama, K., Ito, S., Thukimoto, K., Mori, K., Maekawa, M., Murakami
- Organizer
  2008 MRS Spring Meeting
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] TiNバッファ層の選択的酸溶解を用いたGaN層の剥離技術の開発2008
- Author(s)
  池袋哲史, 武田英久, 本橋雄介, 伊藤和博, 池本由平, 平田宏治, 村上
- Organizer
  日本金属学会
- Place of Presentation
  熊本大学
- Year and Date
  2008-09-24
- Data Source
  KAKENHI-PROJECT-20656112
[Presentation] Self-formation of Ti-rich layers at Cu (Ti)/low-k interfaces2008
- Author(s)
  K. Kohama, K. Ito, S. Tsukimoto, K. Mori. K. Maekawa and M. Murakami
- Organizer
  Materials Science Society
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Effect of substrates on self-formation of barrier layers in low Ti content Cu(Ti)/Si samples2008
- Author(s)
  K., Kohama, T., Sato, K., Ito
- Organizer
  Japan Institute of Metals 2008 Anneal, Meeting
- Place of Presentation
  Musashi Institute of Technology
- Year and Date
  2008-03-28
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Simultaneous formation of n- and p-type ohmic contacts to 4H-SiC using the binary Ni/AI system2008
- Author(s)
  K., Ito, T., Onishi, H., Takeda, Sakukimoto, M., Kceno, Y., Suzuki, M., Muraliami
- Organizer
  2008 MRS Spring Meeting
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] 低濃度Cu(TD合金薄膜における自己組織化拡散バリア層形成反応の基板依存性2008
- Author(s)
  小濱和之, 佐藤大樹, 伊藤和博, 他
- Organizer
  日本金属学会
- Place of Presentation
  武蔵工業大学
- Year and Date
  2008-03-28
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Self-formation of Ti-rich layers at Cu(Ti)/low-k interfaces2008
- Author(s)
  K. Kohama, K. Ito, S. Tsukimoto, K. Mori, K. Maekawa and M. Murakami
- Organizer
  2008 Materials Research Society Spring Meeting
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Simultaneous formation of n- and p-type ohmic contacts to 4H-SiC using the binary Ni/Al system2008
- Author(s)
  K. Ito, T. Onishi, H. Takeda, S. Tsukimoto, M. Konno, Y. Suzuki
- Organizer
  Materials Science Society
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] 低濃度Cu(Ti)合金薄膜における自己組織化拡散バリア層形成反応の基板依存性2008
- Author(s)
  小濱和之, 佐藤大樹, 伊藤和博, 着本享, 他
- Organizer
  日本金属学会
- Place of Presentation
  武蔵工業大学
- Year and Date
  2008-03-28
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Simultaneous formation of n-and p-type ohmic contacts to 4H-SiC using the binary Ni/Al system2008
- Author(s)
  K. Ito, T. Onishi, H. Takeda, S. Tsukimoto, M. Konno, Y. Suzuki and M. Murakami
- Organizer
  2008 Materials Research Society Spring Meeting
- Place of Presentation
  Moscone West and San Francisco Marriott
- Year and Date
  2008-03-26
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Reduction of electrical resistivity of Cu interconnects2007
- Author(s)
  M. Murakami, M. Moriyama, S. Tsukimoto, K. Ito, and T. Onichi
- Organizer
  Advanced Metallizations and Interconnect Technologies, in Honor of Prof. K. N. Tu's 70th Birthday(TMS 2007)
- Place of Presentation
  オーランド(アメリカ)
- Year and Date
  2007-02-28
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Resistivity reduction of Cu interconnects2007
- Author(s)
  K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
- Organizer
  9th International Workshop on Stress-Induced Phenomena in Metallization
- Place of Presentation
  ぱるるプラザ京都
- Year and Date
  2007-04-05
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Reduction of electrical resistivity of Cu interconnects2007
- Author(s)
  M., Murekami, M., Moriyama, S., Tsukimoto, K., Ito, T., Onichi
- Organizer
  Advanced Metallivations and Interconnect Tachnologies in Honor of Prof K N. 'Tu's 70th Birthday (TMS 2007)
- Place of Presentation
  Orland
- Year and Date
  2007-02-28
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Resistivity reduction of Cu interconnects2007
- Author(s)
  K., Ito, S., Tsukimoto, M., Moriyama, M., Murakami
- Organizer
  9th International Workshop on Stress -Induced Phenomena in Metallization
- Place of Presentation
  PaRuRu Plaza Kyoto
- Year and Date
  2007-04-05
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Resistivity reduction of Cuinterconnects2007
- Author(s)
  K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
- Organizer
  9th International Workshop on Stress-Induced Phenomena in Metallization
- Place of Presentation
  ぱるるプラザ京都
- Year and Date
  2007-04-05
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Cu(Ti)合金薄膜における自己組織化バリア層の形成に及ぼす基板絶縁膜の影響2007
- Author(s)
  小濱和之, 伊藤和博, 着本享, 他
- Organizer
  日本金属学会
- Place of Presentation
  岐阜大学
- Year and Date
  2007-09-20
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Effect of substrates on self-formation of barrier layers in Cu(Ti)/Si samples2007
- Author(s)
  K., Kohama, K., Ito, S., Tsukimoto
- Organizer
  Japan Institute of Metals 2007 Anneal, Meeting
- Place of Presentation
  Gifu Univ
- Year and Date
  2007-09-20
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] p,n-SiC両伝導型にオーミック性を示すNi-Alコンタクト材の伝導機構2007
- Author(s)
  武田英久, 大西利武, 伊藤和博, 着本享, 村上正紀
- Organizer
  日本金属学会
- Place of Presentation
  岐阜大学
- Year and Date
  2007-09-20
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Simultaneous formation of n- and p-type Ni-Al ohmic contacts to 4H-SiC2007
- Author(s)
  H., Takeda, T., Onishi, K., Ito, S., Tsukimoto, M., Murakami
- Organizer
  Japan Institute of Metals 2007 Anneal, Meeting
- Place of Presentation
  Gifu Univ
- Year and Date
  2007-09-20
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] p,n-SiC両伝導型にオーミック性を示すNi-A1コンタクト材の伝導機構2007
- Author(s)
  武田英久, 大西利武, 伊藤和博, 着本享, 村上正紀
- Organizer
  日本金属学会
- Place of Presentation
  岐阜大学
- Year and Date
  2007-09-20
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] 高圧アニールによるスパッタCu(Ti)合金薄膜材の微細配線化2006
- Author(s)
  着本享, 大西隆, 伊藤和博, 村上正紀
- Organizer
  日本金属学会
- Place of Presentation
  新潟大学五十嵐キャンパス
- Year and Date
  2006-09-18
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] Fabrication of Cu(Ti) alloy interconnects with self-formation of thin barrier metal layers using a high-pressure annealing process2006
- Author(s)
  S., Tsukimoto, T., Onishi, K., Ito, M., Murakami
- Organizer
  Japan Institute of Metals 2006 Anneal Meeting
- Place of Presentation
  Niigata Univ
- Year and Date
  2006-09-18
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-18360324
[Presentation] 接合界面での反応を利用したp型Ti基酸化物導電膜の作製
- Author(s)
  伊藤和博, 林徳樺, 小濱和之, 白井泰治, 村上正紀
- Organizer
  （一社）溶接学会平成26年度秋季全国大会
- Place of Presentation
  黒部市宇奈月国際会館セレネ，富山県
- Year and Date
  2014-09-10 – 2014-09-12
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Cu(Ti)合金膜を用いたIGZO膜への低接触抵抗電極の作製
- Author(s)
  伊藤和博, 小濱和之, 佐野貴之, 生田目俊秀, 大井暁彦
- Organizer
  （公社）日本金属学会 2014年秋期大会
- Place of Presentation
  名古屋大学, 愛知県
- Year and Date
  2014-09-24 – 2014-09-26
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] 電子デバイス用Cu配線におけるCu合金膜を用いた複数機能一体形成
- Author(s)
  伊藤　和博
- Organizer
  日本金属学会秋期講演大会
- Place of Presentation
  名古屋大学, 愛知県
- Year and Date
  2014-09-24 – 2014-09-26
- Invited
- Data Source
  KAKENHI-PROJECT-24360307
[Presentation] Synthesis using Cu(Ti) alloy films for self-forming functionality in electronic devices
- Author(s)
  Kazuhiro ITO
- Organizer
  AUN/SEED-NET Regional Conference on Materials Engineering 2014
- Place of Presentation
  Kuala Lumpur, Malaysia
- Year and Date
  2014-11-11 – 2014-11-12
- Data Source
  KAKENHI-PROJECT-24360307

1. INUI Haruyuki (30213135)

# of Collaborated Projects: 4 results

# of Collaborated Products: 0 results
2. YAMAGUCHI Masaharu (90029108)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
3. MURAKAMI Masanori (70229970)

# of Collaborated Projects: 2 results

# of Collaborated Products: 34 results
4. TSUKIMOTO Susumu (50346087)

# of Collaborated Projects: 2 results

# of Collaborated Products: 40 results
5. JOHNSON Daiv (70283645)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
6. KOMIZO Yuichi (60379104)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. KOHAMA Kazuyuki (00710287)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
8. TANAKA Katsushi (30236575)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. SAKAI Akira (80143543)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
10. KUROKAWA Shu (90303859)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
11. 寺崎秀紀 (20423080)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
12. 田中学 (20243272)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
13. 山田知典 (70586271)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
14. 守山実希 (70303857)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
15. MURAKAMI Takashi

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
16. TETSUI Toshimitsu

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
17. 大西隆

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results

Ito Kazuhiro 伊藤 和博

ITO KAZUHIRO 伊藤 和博

ITO Kazuhiro 伊藤 和博

Research Projects

Research Products

Co-Researchers

Penetration Shape Improvement and Investigation of its Mechanism in Workpiece Vibration Assisted Gas Metal Arc WeldingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Synthesis of p-type transparent conductive Ti-oxides based films utilizing interface reactionPrincipal Investigator

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Seeking innovative alloy elements for development of low-temperature and high-reliability Cu-alloy interconnects and electrodes with reducing process temperaturePrincipal Investigator

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導電性基板上でのGaN半導体成膜のための金属バッファ層の開発Principal Investigator

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Developments of new complex materials using mime and interface diffusion of the supersaturated alloy elements in thin filmsPrincipal Investigator

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金属バッファ層上でのGaN半導体の結晶成長-遷移金属窒化物に着目して-Principal Investigator

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遷移金属ボロシリサイドと関連化合物の機能材料としての基礎物性Principal Investigator

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C11_b構造を有する超高温構造材料の設計:-c/a軸比の制御-Principal Investigator

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MoSi_2単結晶に見られる塑性異方性に関するatomisticな研究Principal Investigator

Ito Kazuhiro 伊藤和博

ITO KAZUHIRO 伊藤和博

ITO Kazuhiro 伊藤和博