ISHIZUKA Masaru 石塚勝

Researcher Number	60326072
Other IDs
External Links
Affiliation (based on the past Project Information) *help	2009 – 2012: Toyama Prefectural University, 工学部, 教授 2004 – 2005: 富山県立大学, 工学部, 教授
Review Section/Research Field	Principal Investigator Thermal engineering
Keywords	Principal Investigator estimation of amount of dissipated heat / modeling of components / incorporation with electric design and thermaldesign / switch mode power supply / thermal design / computational fluid dynamics (CFD) / パワー半導体 / 熱流体シミュレーション / 電機設計との統合 / 電子機器の熱設計 … More / 消費電力の推定 / 部品のモデル化 / 熱設計と電気設計の統合 / 小型スイッチング電源 / 熱設計 / CFD解析ソフト / データマップ / 平面方向熱抵抗 / 縦方向熱抵抗 / 熱抵抗測定装置 / 基板の熱伝導率 / 熱抵抗 / 配線面積比 / 内方向有効熱伝導率 / 最適熱設計 / 等価熱伝導 / CFDソフトウェア / プリント配線基板 / 高密度実装 / 電子機器 / 配線パターン / PCB / 計測手法 / 面内方向有効熱伝導 / 熱伝導率 / エネルギー工学 / 輻射 / 伝熱機器 / 伝導 / 対流 Less

Study on temperature rise of printed circuit boards havingdifferent thermal conductivity values across a boardPrincipal Investigator
- Principal Investigator
  
  ISHIZUKA Masaru
- Project Period (FY)
  2009 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Thermal engineering
- Research Institution
  Toyama Prefectural University
Development of the thermal design approach for electronic equipment incorporated with electric design and CFD software.Principal Investigator
- Principal Investigator
  
  ISHIZUKA Masaru
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Thermal engineering
- Research Institution
  Toyama Prefectural University

All 2012 2011 2010 2009 2008 2005 2004

All Journal Article Presentation Book

[Book] Heat Transfer-Engineering Applications2011
- Author(s)
  Masaru Ishizuka, Tomoyuki Hatakeyama
- Total Pages
  15
- Publisher
  InTech
- Data Source
  KAKENHI-PROJECT-21560221
[Book] 半導体・電子機器の熱設計&解析2010
- Author(s)
  石塚勝
- Publisher
  三松株式会社
- Data Source
  KAKENHI-PROJECT-21560221
[Book] 半導体・電子機器の熱設計&解析2010
- Author(s)
  石塚勝
- Total Pages
  219
- Publisher
  三松株式会社
- Data Source
  KAKENHI-PROJECT-21560221
[Book] 図解入門よくわかる電子機器の熱設計2009
- Author(s)
  石塚勝
- Total Pages
  209
- Publisher
  秀和システム
- Data Source
  KAKENHI-PROJECT-21560221
[Book] 設計技術・解析ハンドブック開発設計用2009
- Author(s)
  石塚勝監修
- Publisher
  丸善
- Data Source
  KAKENHI-PROJECT-21560221
[Book] 図解入門よくわかる電子機器の熱設計2009
- Author(s)
  石塚勝
- Publisher
  秀和システム
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistances2012
- Author(s)
  Masaru Ishizuka
- Journal Title
  
  Journal of Physics: Conference Series
  
  Volume: 395 Pages: 1-8
- NAID
  10011326197
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] A Test Bench for Validationof CFD Analysis for Air Flow in ThinElectronic Casing Model2012
- Author(s)
  T. Hatakeyama, M. Ishizuka, R. Kibushi andS. Nakagawa
- Journal Title
  
  Journal ofPhysics: Conference Series
  
  Volume: 395(1)
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 有効熱伝導率を用いたCFD解析によるPDB の熱設計2012
- Author(s)
  畠山友行,木伏理沙子,石塚勝
- Journal Title
  
  電子情報通信学会論文誌
  
  Volume: J95-C(11) Pages: 427-433
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate2011
- Author(s)
  Masaru Ishizuka, Tomoyuki Hatakeyama
- Journal Title
  
  Active and Passive Electronic Components
  
  Volume: 2011 Pages: 1-8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Application of ThermalNetwork Model to Transient ThermalAnalysis of Power Electronic PackageSubstrate2011
- Author(s)
  M. Ishizuka, T. Hatakeyama, Y. Funawatashi,and K. Koizumi
- Journal Title
  
  Active and Passive ElectronicComponents
  
  Volume: 2011 Pages: 8-8
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)2011
- Author(s)
  Takashi Fukue, Masaru Ishizuka, Tomoyuki Hatakeyama
- Journal Title
  
  Heat Transfer-Asian Research
  
  Volume: 40 Pages: 369-386
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Effects ofan Inner Object on Natural Convective HeatTransfer in an Enclosure with a Heat Sourceon the Bottom Wall2010
- Author(s)
  Y. Funawatashi and M. Ishizuka
- Journal Title
  
  JP Journal of Heat andMass Transfer
  
  Volume: 4(1) Pages: 1-15
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 小型空冷ファンの風量に及ぼす障害物の影響2010
- Author(s)
  中村元, 福江高志, 小泉雄大, 石塚勝
- Journal Title
  
  日本機械学会論文集(B編)
  
  Volume: 76-768 Pages: 1184-1190
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Reduction of Thermal Resistancefor Chip Test Technology by using SuperThermal Conductivity Material and MirrorFinished Silicon2010
- Author(s)
  T. Hatakeyama, M. Ishizuka,, Y. Nakata, M.Kuji, Y. Hiok, S. Nakagawa and T.Tomimura
- Journal Title
  
  Transaction of TheInstitute of Electronic packaging
  
  Volume: 13(1) Pages: 97-103
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 垂直チャネルモデル内の自然空冷に対するチャネル壁面間距離の最適値2010
- Author(s)
  西野泰史, 石塚勝, 中川慎二
- Journal Title
  
  Thermal Science and Engineering
  
  Volume: 18-2 Pages: 35-44
- NAID
  10026961392
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 基板自立型アルミ電解コンデンサの熱解析モデル2010
- Author(s)
  小泉雄大, 石塚勝, 中川慎二, 畠山友行
- Journal Title
  
  Thermal Science and Engineering
  
  Volume: 18-2 Pages: 57-70
- NAID
  10026961439
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 相変化現象を伴う電子機器の熱解析への熱回路網法の応用2009
- Author(s)
  高桑貞一, 石塚勝, 中川慎二, 高木寛二
- Journal Title
  
  Thermal Science and Engineering 17
  
  Pages: 105-112
- NAID
  10025228132
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 電子機器の熱解析へのEXCEL表計算機能の適用(日射を受ける筐体のビジュアルな熱回路網法解析例)2009
- Author(s)
  富村寿夫, 石塚勝
- Journal Title
  
  日本機械学会論文集(A編)巻755号 75
  
  Pages: 792-798
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 、電子機器の熱解析へのEXCEL 表計算機能の適用(日射を受ける筐体のビジュアルな熱回路網法解析例)2009
- Author(s)
  富村寿夫、石塚勝
- Journal Title
  
  日本機械学会論文集(A 編)
  
  Volume: 75(755) Pages: 792-798
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Thermal Performance of a Forced Convection Air Cooled PBGA Package in a Compact Thin Casing2009
- Author(s)
  M.Ishizuka, S.Nakagawa, Y.Nishino, T.Fukue, K.Nakayama
- Journal Title
  
  JP Journal of Heat and Mass Transfer 2
  
  Pages: 259-277
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] ThermalPerformance of a Forced Convection AirCooled PBGA Package in a Compact ThinCasing2009
- Author(s)
  M. Ishizuka, and S. Nakagawa, Y. Nishino, T.Fukue and K. Nakayama
- Journal Title
  
  JP Journal of Heat and MassTransfer
  
  Volume: 2(3) Pages: 259-277
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] Study onThe Heat Sink Performance for LSIPackages Using A Thermo-Siphon Structurewith PF-5060 Refrigerants2009
- Author(s)
  M. Ishizuka, and S. Nakagawa, Y.Funawatashi and T. Hatakeyama
- Journal Title
  
  JP Journal ofHeat and Mass Transfer
  
  Volume: 3(2) Pages: 117-129
- Data Source
  KAKENHI-PROJECT-21560221
[Journal Article] 温度場伝播の情報可視化によるヒートスプレッダ内非定常温度予測モデルの開発2005
- Author(s)
  矢澤和明, 中川慎二, 石塚勝
- Journal Title
  
  可視化情報学会論文集 25,7
  
  Pages: 1346-5260
- NAID
  10016922804
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] 薄型自然空冷電子機器の筐体傾きによる煙突効果(第2報,出口開口率を考慮した熱設計整理式の提案)2005
- Author(s)
  北村陽児, 石塚勝, 中川慎二
- Journal Title
  
  日本機械学会論文集(B編) 71巻,706号
  
  Pages: 1625-1631
- NAID
  110005051578
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] 温度場伝播の情報可視化によるヒートスプレッダ内非定常温度予測モデルの開発2005
- Author(s)
  矢澤和明, 中川慎二, 石塚勝
- Journal Title
  
  可視化情報学会論文集 25,7
  
  Pages: 1346-5260
- NAID
  10016922804
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] 薄型自然空冷電子機器の筐体傾きによる煙突効果(第2報,出口開口率を考慮した熱設計整理式の提案)2005
- Author(s)
  北村陽児, 石塚勝, 中川慎二
- Journal Title
  
  日本機械学会論文集(B編) 71巻,706号,
  
  Pages: 1625-1631
- NAID
  110005051578
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Thermal Modeling with Transfer Function for the Transient Chip-On-Substrate Problem2005
- Author(s)
  K.Yazawa, M.Ishizuka
- Journal Title
  
  Thermal Science & Engineering Vol.13, No.1
  
  Pages: 37-40
- NAID
  10014382922
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination2004
- Author(s)
  Y.Kitamura, M.Ishizuka
- Journal Title
  
  ASME Journal of Electronic Packaging 126
  
  Pages: 423-428
- NAID
  110002480352
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] 電気回路設計との統合によるスイッチング電源の熱設計手法の開発2004
- Author(s)
  小泉雄大, 上坊寺明人, 長原邦明, 石塚勝
- Journal Title
  
  日本機械学会論文集(B編) 70・690
  
  Pages: 488-495
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Development of Thermal Simulation Method for a Switch Mode Power Supply and Its Integration with Electric Circuit Analysis (in the Case of Natural Convection Air Cooled Switch Mode Power Supply)2004
- Author(s)
  K.Koizumi, A.Joboji, K.Nagahara, M.Ishizuka
- Journal Title
  
  Heat Transfer-Asian Research 33(8)
  
  Pages: 473-489
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] A Numerical and Experimental Study on the Effect of Inclination on Thermal Behaviors of Natural Convection inside Thin Electronic Equipment Casing2004
- Author(s)
  Y.Kitamura, M.Ishizuka, S.Nakagawa
- Journal Title
  
  IMechE Journal of Power and Energy-Proceedings of the Institution of Mechanical Engineers Part A) Vol.218, Vol.7
  
  Pages: 501-508
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] A Numerical and Experimental Study on the Effect of Inclination on Thermal Behaviors of Natural Convection inside Thin Electronic Equipment Casing2004
- Author(s)
  Y.Kitamura, M.Ishizuka, S.Nakagawa
- Journal Title
  
  IMechE Journal of Power and Energy - Proceedings of the Institution of Mechanical Engineers Part A) Vol.218,Vol.7
  
  Pages: 501-508
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Development of Thermal Simulation Method for a Switch Mode Power Supply) and Its Integration with Electric Circuit Analysis (in the Case of Natural Convection Air Cooled Switch Mode Power Supply)2004
- Author(s)
  K.Koizumi, A.Joboji K.Nagahara, M.Ishizuka
- Journal Title
  
  Heat Transfer-Asian Research 33(8)
  
  Pages: 473-489
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Development of Thermal Simulation Method for a Switch Mode Power Supply) and Its Integration with Electric Circuit Analysis (in the Case of Natural Convection Air Cooled Switch Mode Power Supply)2004
- Author(s)
  K.Koizumi, A.Joboji, K.Nagahara, M.Ishizuka
- Journal Title
  
  Heat Transfer-Asian Research 33・8
  
  Pages: 473-489
- Data Source
  KAKENHI-PROJECT-16560190
[Journal Article] Thermal Modeling and Experimental verification of High-Frequency Inductors2004
- Author(s)
  K.koizumi, M.Ishizuka
- Journal Title
  
  Thermal Science & Engineering 12・3
  
  Pages: 19-26
- NAID
  10013067874
- Data Source
  KAKENHI-PROJECT-16560190
[Presentation] COMPARISON BETWEEN PIV RESULTS AND CFD SIMULATIONS OF AIR FLOWS IN A THIN ELECTRONICS CASING MODE2012
- Author(s)
  Masaru Ishizuka
- Organizer
  International Mechanical Engineering Congress & Exposition IMECE2012
- Place of Presentation
  Houston, Texas, USA
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Experimental Study on the Perfoompact Heat Sink for LSI Packages2012
- Author(s)
  Masaru Ishizuka
- Organizer
  IMPACT Conference 2012,
- Place of Presentation
  Taipei Nangang Exhibition Center
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Study on the natural aircooling design of electronic equipmentcasings: effects of the height and size ofoutlet vent on the flow resistance2012
- Author(s)
  M. Ishizuka,, T. Hatakeyama andR .Kibushi
- Organizer
  EUROTHERM 2012,6th European Thermal Sciences ConferenceEurotherm 2012
- Place of Presentation
  Poitiers - Futuroscope France
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Measurement Technique of In-PlaneThermal Resistance ofPCB2011
- Author(s)
  T. Hatakeyama, M. Ishizuka, S. Nakagawa,Y. Nakano, M. Hirokawa, T. Tomimura
- Organizer
  The 8thASME-JSME Thermal Engineering JointConference (AJTEC2011)
- Place of Presentation
  Waikiki Beach Marriott Resort & Spa,Honolulu, Hawaii.
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] nvestigation of Effect of Wiring Patterns on In-Plane Thermal Conductivity of Printed Circuit Boards2011
- Author(s)
  Yuta Nakano, Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Masataka Hirokawa, Toshio Tomimur
- Organizer
  Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems
- Place of Presentation
  Portland、米国
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Development of PracticalThermal Analysis for Package CoolingTechnology Using Phase Change Material2011
- Author(s)
  (Invited)M. Ishizuka, T. Hatakeyama, S.Nakagawa
- Organizer
  INCOTEE 2011 : International Conferenceon Thermal Energy and Environment,Kalasalingam University
- Place of Presentation
  Nadu India
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Thermal Design andPerformance of Compact Heat Sinks used inPersonal Computers2011
- Author(s)
  (Invited)M. Ishizuka
- Organizer
  WORKSHOP OnONE-DAY International Workshop on"Recent Advances in Thermal Engineering"in Bengal Engineering and ScienceUniversity
- Place of Presentation
  Shibpur, Howrah, West Bengal,India
- Year and Date
  2011-03-22
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Development of Practical Thermal Analysis for Package Cooling Technology Using Phase Change Material2011
- Author(s)
  M.Ishizuka
- Organizer
  INCOTEE 2011
- Place of Presentation
  Kalasalingam University, India
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Tomimura USE OF THERMALNETWORK MODEL IN TRANSIENTTHERMAL ANALYSIS OF POWERELECTRONIC PACKAGESUBSTRATEOF THE POWERELECTRONIC PACKAGE SUBSTRATE2011
- Author(s)
  M. Ishizuka, T. Hatakeyama, R.Kibushi, T.Fukue, T.
- Organizer
  International Symposium on TransportPhenomena
- Place of Presentation
  Delft, The Netherlands
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Thermal ResistanceMeasurement and Thermal NetworkAnalysis of Printed Circuit Board WithThermal Vias2011
- Author(s)
  T. Hatakeyama, M. Ishizuka, S. Nakagawa,and S. Takakuwa
- Organizer
  Proceedings of the ASME2011 Pacific Rim Technical Conference &Exposition on Packaging and Integration ofElectronic and PhotonicSystems,InterPACK2011
- Place of Presentation
  Portland, Oregon
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Investigation of Effect of WiringPatterns on In-Plane Thermal Conductivityof Printed Circuit Boards2011
- Author(s)
  Y. Nakano, T. Hatakeyama, M. Ishizuka, S.Nakagawa, M. Hirokawa, and T.Tomimura
- Organizer
  Proceedings of theASME 2011 Pacific Rim TechnicalConference & Exposition on Packaging andIntegration of Electronic and PhotonicSystems
- Place of Presentation
  Portland, Oregon, USA
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Comparisonbetween Experimental Results and CFDSimulations for Air Flows in a ThinElectronics Casing Model2010
- Author(s)
  M. Ishizuka, S. Nakagawa, T.Hatakeyama, Yasushi Nishino
- Organizer
  ITherm 2010
- Place of Presentation
  LasVegas, Nevada, USA
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Development ofPractical Thermal Design Technique ofPrinted Circuit Boards for Power Electronics2010
- Author(s)
  T. Hatakeyama, M. Ishizuka, S.Nakagawa, K. Watanabe
- Organizer
  ITherm 2010
- Place of Presentation
  Las Vegas, Nevada, USA
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Cooling Chip TestTechnology by Using Super ThermalConductivity Material2010
- Author(s)
  T. Hatakeyama, M.Ishizuka, S. Nakagawa,Y. Hioki, T. Tomimura
- Organizer
  ICEP 2010Proceedings TD4-2,ICEP2010,Sapporo
- Place of Presentation
  Convention Center, Hokkaido, Japan CenterHokkaido
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Heat Sink Design inHome Appliances and personal computer2010
- Author(s)
  (Invited)M.Ishizuka
- Organizer
  1st WORKSHOP On Leading-edgeTheories and Practices in Design-Perspectives of Product Design andFundamental Technology -Session I -Leading-edge Product Design(Part 1)
- Place of Presentation
  IIIT-J(Indian Institute of Information &Technology, Jabalpur) , India
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] The Performance of Compact Finned HeatSink for LSI Packages in Combined andNatural and Forced air Flows2010
- Author(s)
  M. Ishizuka, T. Hatakeyama, S. Nakagawa
- Organizer
  21stInternational Symposium on TransportPhenomena
- Place of Presentation
  Kaohsiung City, Taiwan
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Thermal Characterization of High-Density Interconnects in the Form of Equivalent Thermal Conductivity2009
- Author(s)
  M.Ishizuka, W.Nakayama, T.Fukue, K.Koizumi
- Organizer
  ASME InterPACK '09
- Place of Presentation
  San Francisco
- Data Source
  KAKENHI-PROJECT-21560221
[Presentation] Synthesis of CFD AnalysesAnd Experiments In Developing A ThermalNetwork Model of A Simulated HeatSpreader Panel2008
- Author(s)
  M. Ishizuka,, S. Nakagawa , T. Yoshida andW. Nakayama
- Organizer
  Proceedings ofIMECE2008, International MechanicalEngineering Congress and Exposition
- Place of Presentation
  Boston, Massachusetts, USA
- Data Source
  KAKENHI-PROJECT-21560221

1. 小泉雄大

# of Collaborated Projects: 1 results

# of Collaborated Products: 1 results

ISHIZUKA Masaru 石塚 勝

Research Projects

Research Products

Co-Researchers

Study on temperature rise of printed circuit boards havingdifferent thermal conductivity values across a boardPrincipal Investigator

Principal Investigator

Project Period (FY)

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Research Institution

Development of the thermal design approach for electronic equipment incorporated with electric design and CFD software.Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Book] Heat Transfer-Engineering Applications2011

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[Book] 半導体・電子機器の熱設計&解析2010

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[Book] 半導体・電子機器の熱設計&解析2010

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[Book] 図解入門よくわかる電子機器の熱設計2009

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[Book] 設計技術・解析ハンドブック 開発設計用2009

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[Book] 図解入門よくわかる電子機器の熱設計2009

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[Journal Article] Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistances2012

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[Journal Article] A Test Bench for Validationof CFD Analysis for Air Flow in ThinElectronic Casing Model2012

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[Journal Article] 有効熱伝導率を用いたCFD解析によるPDB の熱設計2012

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[Journal Article] Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate2011

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[Journal Article] Application of ThermalNetwork Model to Transient ThermalAnalysis of Power Electronic PackageSubstrate2011

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[Journal Article] Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)2011

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[Journal Article] Effects ofan Inner Object on Natural Convective HeatTransfer in an Enclosure with a Heat Sourceon the Bottom Wall2010

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[Journal Article] 小型空冷ファンの風量に及ぼす障害物の影響2010

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[Journal Article] Reduction of Thermal Resistancefor Chip Test Technology by using SuperThermal Conductivity Material and MirrorFinished Silicon2010

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ISHIZUKA Masaru 石塚勝

[Book] 設計技術・解析ハンドブック開発設計用2009