Aoyagi Masahiro 青柳昌宏

… Alternative Names

青柳昌宏アオヤギマサヒロ

Less

Researcher Number	60356334
Affiliation (Current)	2025: 熊本大学, 半導体・デジタル研究教育機構, 卓越教授 2025: 国立研究開発法人産業技術総合研究所, その他部局等, 研究グループ長
Affiliation (based on the past Project Information) *help	2025: 熊本大学, 半導体・デジタル研究教育機構, 卓越教授 2015: 国立研究開発法人産業技術総合研究所, ナノエレクトロニクス研究部門, 研究グループ付 2014: 独立行政法人産業技術総合研究所, ナノエレクトロニクス研究部門, 研究グループ長
Review Section/Research Field	Principal Investigator Electron device/Electronic equipment Except Principal Investigator Sections That Are Subject to Joint Review: Basic Section60040:Computer system-related , Basic Section60090:High performance computing-related / Basic Section 60090:High performance computing-related / Basic Section 60040:Computer system-related
Keywords	Principal Investigator 微細バンプ / シリコン貫通電極 / LSI設計 / 放熱 / デバイス積層 / 3次元LSI Except Principal Investigator 電源 / ロボット / FPGA / 不揮発 / 三次元積層LSI

Robot IoT system platform technology with short recovery time using non-volatile memory stacked LSI/FPGA
- Principal Investigator
  
  大川猛
- Project Period (FY)
  2025 – 2027
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 60040:Computer system-related
  Basic Section 60090:High performance computing-related
  Sections That Are Subject to Joint Review: Basic Section60040:Computer system-related , Basic Section60090:High performance computing-related
- Research Institution
  Kumamoto University
３次元ＬＳＩデバイス積層システムにおける放熱を考慮したＬＳＩデバイス設計技術の研Principal Investigator
- Principal Investigator
  
  青柳昌宏
- Project Period (FY)
  2014 – 2015
- Research Category
  
  Grant-in-Aid for JSPS Fellows
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  National Institute of Advanced Industrial Science and Technology

All 2015 2014

All Journal Article Presentation Patent

[Journal Article] Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit2015
- Author(s)
  Melamed Samson、居村史人、仲川博、菊地克弥、萩本有哉、松本祐教、青柳昌宏
- Journal Title
  
  Microelectronics Journal
  
  Volume: 46 Pages: 1106-1113
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] Investigation of Effects of Metalization on Heat Spreading in Bump-Bonded 3D Systems2015
- Author(s)
  Melamed Samson、菊地克弥、青柳昌宏
- Journal Title
  
  Proceedings of IEEE 3DIC International 3D Systems Integration Conference 2015
  
  Volume: - Pages: 276-279
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties2015
- Author(s)
  Melamed Samson、菊地克弥、青柳昌宏
- Journal Title
  
  Proceedings of IEEE CPMT Symposium Japan 2015
  
  Volume: - Pages: 62-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits2015
- Author(s)
  Melamed Samson、渡辺直也、根本俊介、菊地克弥、青柳昌宏
- Journal Title
  
  Proceedings of 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
  
  Volume: -
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] On-Chip Diode-based Measurement of the Thermal Effects of Die Thinning in Three-Dimensional Integrated Circuits2015
- Author(s)
  Melamed Samson、渡辺直也、根本俊介、菊地克弥、青柳昌宏
- Journal Title
  
  Proceedings of 4th International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
  
  Volume: - Pages: 13-14
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] Method for Back-Annotating Per-Transistor Power Values onto #DIC Layouts to Enable Detailed Thermal Analysis2014
- Author(s)
  Melamed Samson、居村史人、青柳昌宏、仲川博、菊地克弥、萩本有哉、松本祐教
- Journal Title
  
  2014 International Conference on Electronics Packaging (ICEP)
  
  Volume: - Pages: 239-242
- Data Source
  KAKENHI-PROJECT-14F04917
[Journal Article] Investigation of Effects of Die Thinning on Central TSV Bus Driver Thermal Performance2014
- Author(s)
  Melamed Samson、居村史人、青柳昌宏、仲川博、菊地克弥、萩本有哉、松本祐教
- Journal Title
  
  2014 International Workshop on Thermal Investigations of IC's and Systems and Electronics Engineers
  
  Volume: -
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-14F04917
[Patent] 半導体装置、インターポーザ及びその製造方法2014
- Inventor(s)
  Melamed Samson、青柳昌宏ほか
- Industrial Property Rights Holder
  国立研究開発法人産業技術総合研究所
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-119886
- Filing Date
  2014-06-10
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] Investigation of Effects of Metalization on Heat Spreading in Bump-Bonded 3D Systems2015
- Author(s)
  Melamed Samson、菊地克弥、青柳昌宏
- Organizer
  IEEE 3DIC International 3D Systems Integration Conference 2015
- Place of Presentation
  仙台国際センター（宮城県・仙台市）
- Year and Date
  2015-09-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] On-Chip Diode-based Measurement of the Thermal Effects of Die Thinning in Three-Dimensional Integrated Circuits2015
- Author(s)
  Melamed Samson、渡辺直也、根本俊介、菊地克弥、青柳昌宏
- Organizer
  4th International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
- Place of Presentation
  ラフバラ　（英国）
- Year and Date
  2015-06-03
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits2015
- Author(s)
  Melamed Samson、渡辺直也、根本俊介、菊地克弥、青柳昌宏
- Organizer
  21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
- Place of Presentation
  パリ　（フランス）
- Year and Date
  2015-10-01
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties2015
- Author(s)
  Melamed Samson、菊地克弥、青柳昌宏
- Organizer
  IEEE CPMT Symposium Japan 2015
- Place of Presentation
  京都リサーチパーク（京都府・京都市）
- Year and Date
  2015-11-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] Method for Fabricating Microchannels with Photopatternable Adhesives for ３D Integrated Circuits2014
- Author(s)
  Melamed Samson、加藤史樹、Bui Thanh Tung、根本俊介、青柳昌宏
- Organizer
  Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices
- Place of Presentation
  つくば国際会議場（茨城県つくば市）
- Year and Date
  2014-08-27
- Data Source
  KAKENHI-PROJECT-14F04917
[Presentation] Investigation of Effects of Die Thinning on Central TSV Bus Driver Thermal Performance2014
- Author(s)
  Melamed Samson、居村史人、青柳昌宏、仲川博、菊地克弥、萩本有哉、松本祐教
- Organizer
  2014 International Workshop on Thermal Investigations of IC's and Systems
- Place of Presentation
  the Devonport House Hotel(Greenwich,London,UK)
- Year and Date
  2014-09-25
- Data Source
  KAKENHI-PROJECT-14F04917

1. MELAMED SAMSON

# of Collaborated Projects: 2 results

# of Collaborated Products: 26 results
2. 大川猛 (80392596)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 高瀬英希 (50633690)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 菊池豊 (80242288)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. 飯田全広 (70363512)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 瀬戸謙修 (10420241)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 久保木猛 (50756236)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Aoyagi Masahiro 青柳 昌宏

青柳 昌宏 アオヤギ マサヒロ

Research Projects

Research Products

Co-Researchers

Robot IoT system platform technology with short recovery time using non-volatile memory stacked LSI/FPGA

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

３次元ＬＳＩデバイス積層システムにおける放熱を考慮したＬＳＩデバイス設計技術の研Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit2015

Author(s)

Journal Title

Data Source

[Journal Article] Investigation of Effects of Metalization on Heat Spreading in Bump-Bonded 3D Systems2015

Author(s)

Journal Title

Data Source

[Journal Article] Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties2015

Author(s)

Journal Title

Data Source

[Journal Article] Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits2015

Author(s)

Journal Title

Data Source

[Journal Article] On-Chip Diode-based Measurement of the Thermal Effects of Die Thinning in Three-Dimensional Integrated Circuits2015

Author(s)

Journal Title

Data Source

[Journal Article] Method for Back-Annotating Per-Transistor Power Values onto #DIC Layouts to Enable Detailed Thermal Analysis2014

Author(s)

Journal Title

Data Source

[Journal Article] Investigation of Effects of Die Thinning on Central TSV Bus Driver Thermal Performance2014

Author(s)

Journal Title

Data Source

[Patent] 半導体装置、インターポーザ及びその製造方法2014

Inventor(s)

Industrial Property Rights Holder

Industrial Property Rights Type

Industrial Property Number

Filing Date

Data Source

[Presentation] Investigation of Effects of Metalization on Heat Spreading in Bump-Bonded 3D Systems2015

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] On-Chip Diode-based Measurement of the Thermal Effects of Die Thinning in Three-Dimensional Integrated Circuits2015

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Investigation into the Thermal Effects of Thinning Stacked Dies in Three-Dimensional Integrated Circuits2015

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Sensitivity of the Thermal Profile of Bump-Bonded 3D Systems to Inter-die Bonding Layer Properties2015

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Method for Fabricating Microchannels with Photopatternable Adhesives for ３D Integrated Circuits2014

Author(s)

Organizer

Place of Presentation

Aoyagi Masahiro 青柳昌宏

青柳昌宏アオヤギマサヒロ