SATO Takehiko 佐藤武彦

Researcher Number	60379112
Affiliation (based on the past Project Information) *help	2007 – 2008: 大阪大学, 大学院・工学研究科, 教授 2006: Osaka University, Graduate school of Engineering, Professor, 大学院工学研究科, 教授 2005: 大阪大学, 工学研究科, 教授
Review Section/Research Field	Except Principal Investigator Material processing/treatments
Keywords	Except Principal Investigator 低温実装 / 信頼性評価 / 界面反応 / マイクロ接合 / 鉛フリーはんだ / Tin Bismuth Alloy / Microstructure / Evaluation of Reliabilty / Electronics Packaging / Interfacial Reaction … More / Lead Free Solder / Low Temperature Packaging / Micro Joining / 錫・ビスマス合金 / 微細組織 / エレクトロニクス実装 / 添加元素 / 金属間化合物 / 状態図計算 / 延性改善 / 微細化 / 共晶組織 / 低温接合 Less

Effect of Third Element Addition on Eutectic Microstructure of Lead Free Low Temperature Sn-Bi Based Solders
- Principal Investigator
  
  UENISHI Keisuke
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Dvelopment of Sn-Bi Based Low Temperature Solders which Enables Step Soldering
- Principal Investigator
  
  UENISHI Keisuke
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University

All 2009 2008 2007

All Journal Article Presentation

[Journal Article] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009
- Author(s)
  金児仁史, 中西徹洋, 鳥居久範, 作山誠樹, 上西啓介, 佐藤武彦
- Journal Title
  
  エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集 Vol. 15
  
  Pages: 345-348
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009
- Author(s)
  金児仁史、中西徹洋、鳥居久範、赤松俊也、作山誠樹、上西啓介、佐藤武彦
- Journal Title
  
  第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(MATE2009)論文集 Vol.15
  
  Pages: 345-348
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] Sn-Bi共晶はんだへの第三元素添加効果2008
- Author(s)
  金児仁史、鳥居久範、赤松俊也、作山誠樹、上西啓介、佐藤武彦
- Journal Title
  
  第18回マイクロエレクトロニクスシンポジウム(MES2008)論文集 Vol.18
  
  Pages: 203-206
- NAID
  130008032210
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] 低応力実装に向けたSn-Bi低温接合技術電子情報通信学会論文誌C2008
- Author(s)
  作山誠樹、赤松俊也、上西啓介、佐藤武彦
- Journal Title
  
  Vol.Jgl-C, No.11
  
  Pages: 534-541
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] 低応力実装に向けたSn-Bi低温接合技術2008
- Author(s)
  作山誠樹, 赤松俊也, 上西啓介, 佐藤武彦
- Journal Title
  
  電子情報通信学会論文誌C Vol. J91C No. 11
  
  Pages: 534-541
- NAID
  110007380061
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] Sn-Bi共晶はんだへの第三元素添加効果2008
- Author(s)
  金児仁史, 鳥居久範, 作山誠樹, 上西啓介, 佐藤武彦
- Journal Title
  
  マイクロエレクトロニクスシンポジウム論文集 Vol. 18
  
  Pages: 203-206
- NAID
  130008032210
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Journal Article] Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu2007
- Author(s)
  Keisuke Uenishi, H.Torii, S.Nakajima, T.Akamatsu, S.Sakuyama and Takehiko Sato
- Journal Title
  
  Proceedings of International Conference on Electronics Packaging, 2007
  
  Pages: 193-196
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560728
[Presentation] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009
- Author(s)
  金児仁史、中西徹洋、鳥居久範赤松俊也、作山誠樹、上西啓介、佐藤武彦
- Organizer
  第15回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム(mTE2009)
- Place of Presentation
  横浜
- Data Source
  KAKENHI-PROJECT-19560728
[Presentation] Sn-Bi共晶はんだへの第三元素添加効果第18回マイクロエレクトロニクスシンポジゥム2008
- Author(s)
  金児仁史、鳥居久範、赤松俊也、作山誠樹、上西啓介、佐藤武彦
- Place of Presentation
  京都
- Data Source
  KAKENHI-PROJECT-19560728
[Presentation] Effect of AgAddition to Sn-BiEutectic Solders on the Microstructure and Properties of Joints with Cu2007
- Author(s)
  Keisuke Uenishi, H.Torii, S.Nakajima, T.Akamatsu, S.Sakuyama and Takehiko Sato
- Organizer
  International Conference on Electronics Packaging 2007
- Place of Presentation
  東京
- Data Source
  KAKENHI-PROJECT-19560728

1. SHOUJI Ikuo (00323329)

# of Collaborated Projects: 3 results

# of Collaborated Products: 0 results
2. UENISHI Keisuke (80223478)

# of Collaborated Projects: 2 results

# of Collaborated Products: 10 results

SATO Takehiko 佐藤 武彦

Research Projects

Research Products

Co-Researchers

Effect of Third Element Addition on Eutectic Microstructure of Lead Free Low Temperature Sn-Bi Based Solders

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Dvelopment of Sn-Bi Based Low Temperature Solders which Enables Step Soldering

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009

Author(s)

Journal Title

Data Source

[Journal Article] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009

Author(s)

Journal Title

Data Source

[Journal Article] Sn-Bi共晶はんだへの第三元素添加効果2008

Author(s)

Journal Title

NAID

Data Source

[Journal Article] 低応力実装に向けたSn-Bi低温接合技術電子情報通信学会論文誌C2008

Author(s)

Journal Title

Data Source

[Journal Article] 低応力実装に向けたSn-Bi低温接合技術2008

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Sn-Bi共晶はんだへの第三元素添加効果2008

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Effect of Ag Addition to Sn-Bi Eutectic Solders on the Microstructure and Properties of Joints with Cu2007

Author(s)

Journal Title

Data Source

[Presentation] 第三元素添加によるSn-Bi共晶はんだの組織微細化と延性改善効果2009

Author(s)

Organizer

Place of Presentation

Data Source

[Presentation] Sn-Bi共晶はんだへの第三元素添加効果第18回マイクロエレクトロニクスシンポジゥム2008

Author(s)

Place of Presentation

Data Source

[Presentation] Effect of AgAddition to Sn-BiEutectic Solders on the Microstructure and Properties of Joints with Cu2007

Author(s)

Organizer

Place of Presentation

Data Source

SATO Takehiko 佐藤武彦