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MURAKAMI Masanori  村上 正紀

ORCIDConnect your ORCID iD *help
Researcher Number 70229970
Other IDs
External Links
Affiliation (based on the past Project Information) *help 2000 – 2006: Kyoto Univ. Professor, 工学研究科, 教授
1999: 京都大学, 大学院・工学研究科, 教授
1995 – 1998: Kyoto Univ., Graduate School of Engineering, Professor, 工学研究科, 教授
1995: Kyoto Univ., Graduate School of Engineering, Professor, 大学院・工学研究科, 教授
1991 – 1994: 京都大学, 工学部, 教授
Review Section/Research Field
Principal Investigator
Structural/Functional materials / Composite materials/Physical properties / Physical properties of metals / Electronic materials/Electric materials / Applied materials science/Crystal engineering / 金属材料(含表面処理・腐食防食)
Except Principal Investigator
Structural/Functional materials / 表面界面物性 / Electronic materials/Electric materials
Keywords
Principal Investigator
Ohmic contact / ZnSe / オーム性電極 / SiC / CdTe / 微細構造 / InGaAs / NiInGe / GaAs / コンタクト抵抗 … More / GaN / 半導体界面 / 金属 / オーミック・コンタクト / 低障壁中間層 / 薄膜 / In / Ohmic Contacts / Self-formation / Cu Interconnects / Thin Films / 表皮効果 / オーミックコンタクト / 自己組織化 / Cu配線 / Interfacial microstructure / Current transport / Potentiometry / Wide-gap semiconductor / STP解析 / 炭化シリコン / ポテンショメトリー / 走査トンネル顕微鏡 / オーム性電極材料 / 電流輸送 / STP解析法 / ワイドギャップ半導体 / contact materials / radiation detectors / ショットキー電極材 / 半導体放射線検出器 / Microstructure / Electrode / Contact resistance / Interface / FET / 拡散バリア材 / 電極 / 接触抵抗 / 界面 / Schottky Barrier / Coutact Resistance / Ohmic Contact / 窒化ガリウム / GuN / ショットキー障壁 / ZuSe / metal interface / Cd-based contact / annealing / deposition / Schottky barrier height / p-ZnSe / トンネル電流 / Au / 分子線エピタキシー / 窒素ラジカルドーピング / Cd基およびTe基 / Au,Nb,Cu,Ag,Ni / 仕事関数 / 自然酸化膜 / アニール / CdZnSe / 高濃度ドープ層 / Cd / Ni / 界面反応 / P型ZnSe / ELECTRONIC MATERIALS / FUMCTIONAL MATERIALS / THIN FILMS / INTERMETALLIC COMPOUNDS / 電子材料 / 機能材料 / 金属間化合物 / thermal strain / thin film / X線回析 / X線回折 / 薄膜応力 / 薄膜歪 … More
Except Principal Investigator
界面 / 電極 / Impurity / Microvoid / Reliability / Copper Interconnect / ULSI / 水素脆性 / Si半導体デバイス / 不純物 / マイクロボイド / 配線信頼性 / Cu配線材 / ULSIデバイス / Tunnel current / Electron source / Display / Surface damage / Field emission / Diamond / 電子放出 / ダイヤモンド状カーボン / 安定性 / スパッタリング / 電気伝導 / 気相成長 / 電界電子放出 / トンネル電流 / 電子源 / ディスプレイ / 表面損傷 / 電解電子放出 / ダイヤモンド / 接触抵抗 / TaTi / オーミック・コンタクト / GaN / 電子材料 / 機能材料 / 薄膜 / 金属間化合物 Less
  • Research Projects

    (12 results)
  • Research Products

    (49 results)
  • Co-Researchers

    (12 People)
  •  Developments of new complex materials using mime and interface diffusion of the supersaturated alloy elements in thin filmsPrincipal Investigator

    • Principal Investigator
      ITO Kazuhiro, 村上 正紀
    • Project Period (FY)
      2006 – 2007
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Composite materials/Physical properties
    • Research Institution
      Kyoto University
  •  Ohmic contact materials for wide-gap semiconductors : Fabrication and STP analysis.Principal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      2003 – 2005
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Research Field
      Physical properties of metals
    • Research Institution
      KYOTO UNIVERSITY
  •  Development of highly reliable contacts on p-type CdTe for radiation detectorsPrincipal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      2001 – 2002
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Structural/Functional materials
    • Research Institution
      KYOTO UNIVERSITY
  •  Formation Mechanism of Unique Voids in Cu Interconnects for ULSI

    • Principal Investigator
      MORIYAMA Miki
    • Project Period (FY)
      2001 – 2002
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Structural/Functional materials
    • Research Institution
      KYOTO UNIVERSITY
  •  水素吸蔵金属とGaN半導体の接合界面における水素の挙動

    • Principal Investigator
      小出 康夫
    • Project Period (FY)
      2000 – 2001
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Structural/Functional materials
    • Research Institution
      Kyoto University
  •  ガリウム・ヒ素化合物半導体用の超新機能電極材料の研究Principal Investigator

    • Principal Investigator
      MURAKAMI Mosanori
    • Project Period (FY)
      1998 – 2000
    • Research Category
      Grant-in-Aid for Scientific Research (A).
    • Research Field
      Structural/Functional materials
    • Research Institution
      KYOTO UNIVERSITY
  •  Physics of contact interface of electron emission devices for display

    • Principal Investigator
      KOIDE Yasuo
    • Project Period (FY)
      1997 – 1998
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      表面界面物性
    • Research Institution
      KYOTO UNIVERSITY
  •  Development of High Performance Ohmic Contact Materials for Full Color Light Enitting Devices.Principal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      1996 – 1997
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Electronic materials/Electric materials
    • Research Institution
      KYOTO UNIVERSITY
  •  金属/化合物半導体界面における電気特性及び微細構造に関する研究

    • Principal Investigator
      OKU Takeo
    • Project Period (FY)
      1995 – 1996
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Electronic materials/Electric materials
    • Research Institution
      Kyoto University
  •  APPLICATION OF INTERMETALLIC COMPOUNDS TO FUNCTIONAL ELECTRONIC MATERIALSPrincipal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      1993 – 1995
    • Research Category
      Grant-in-Aid for General Scientific Research (A)
    • Research Field
      Structural/Functional materials
    • Research Institution
      KYOTO UNIVERSITY
  •  Development of Ohmic contact materials for ZnSe-based blue light emitting devicesPrincipal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      1993 – 1995
    • Research Category
      Grant-in-Aid for Developmental Scientific Research (B)
    • Research Field
      Applied materials science/Crystal engineering
    • Research Institution
      KYOTO UNIVERSITY
  •  Thermal Strain of In films deposited onto Si and GaAs SubstratesPrincipal Investigator

    • Principal Investigator
      MURAKAMI Masanori
    • Project Period (FY)
      1991 – 1992
    • Research Category
      Grant-in-Aid for General Scientific Research (B)
    • Research Field
      金属材料(含表面処理・腐食防食)
    • Research Institution
      KYOTO UNIVERSITY

All 2008 2007 2006 2005 2004

All Journal Article Presentation Patent

  • [Journal Article] Self-formation of Ti-rich interfacial layers at Cu(Ti)/low-k interfaces2008

    • Author(s)
      K. Kohama, K. Ito, S. Tsukimoto, K. Mori, K. Maekawa and M. Murakami
    • Journal Title

      MRS Proceedings (in press)

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Self-formation of Ti-rich interfacial layers at Cu(Ti)/low-k interfaces2008

    • Author(s)
      K., Kohama, K., Ito, S., Tsukimoto, K., Mori, K., Maekawa, M., Murakami
    • Journal Title

      MRS Proceedings (in press)

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Simultaneous formation of n-and p-type ohmic contacts to 4H-SiC using the binary Ni/Al system2008

    • Author(s)
      K. Ito, T. Onishi, H. Takeda, S. Tsukimoto, M. Konno, Y. Suzuki and M. Murakami
    • Journal Title

      MRS Proceedings (in press)

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Resistivity reduction of Cu interconnects2007

    • Author(s)
      K., Ito, S., Tsukimoto, M., Moriyama, M., Murakami
    • Journal Title

      AIP Conference Proceedings 945

      Pages: 1-10

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti)interconnects2007

    • Author(s)
      S. Tsukimoto, T. Kabe, K. Ito and M. Murakami
    • Journal Title

      Journal of Electronic Materials 36

      Pages: 258-265

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Fabrication of Cu(Ti)alloy interconnects with self-formation of thin barrier metal layers using a high-pressure annealing process2007

    • Author(s)
      S. Tsukimoto, T. Onishi, K. Ito, M. Konno, T. Yaguchi, T. Kamino and M. Murakami
    • Journal Title

      Journal of Electronic Materials 36

      Pages: 1658-1661

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti) interconnects2007

    • Author(s)
      S.Tsukimoto, T.Kabe, K.Ito, M.Murakami
    • Journal Title

      Journal of Electronic Materials

    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Self-formation of Ti-rich Interfacial Layers in Cu(Ti) Alloy Film2007

    • Author(s)
      K.Ito, S.Tsukimoto, M.Murakami
    • Journal Title

      Japanese Journal of Applied Physics 46

    • NAID

      10022547534

    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Effects of substrate materials on self-formation of Ti-rich interface layers in Cu(Ti) alloy films2007

    • Author(s)
      K., Ito, S., Tsukimoto, T., Kabe, K., Tada, M., Murakami
    • Journal Title

      Journal of Electronic Materials 36

      Pages: 606-613

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Effects of substrate materials on self-formation of Ti-rich interface layers in Cu(Ti)alloy films2007

    • Author(s)
      K. Ito, S. Tsukimoto, T. Kabe, K. Tada and M. Murakami
    • Journal Title

      Journal of Electronic Materials 36

      Pages: 606-613

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Self-formation of Ti-rich interface layers in Cu(Ti) alloy films on various substrates2007

    • Author(s)
      K.Ito, S.Tsukimoto, T.Kabe, K.Tada, M.Murakami
    • Journal Title

      Journal of Electronic Materials

    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Reduction of Electrical Resistivity of Cu Interconnects2007

    • Author(s)
      M.Murakami, M.Moriyama, S.Tsukimoto, K.Ito, T.Onichi
    • Journal Title

      Extraction, Processing, Structure and Properties Proceedings on Electronic. Maenetic and Photonic Materials Division Symposium

      Pages: 1-9

    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Effect of annealing ambient on self-formation mechanism of diffusion barrier layers used in Cu(Ti) interconnects2007

    • Author(s)
      S., Tsukimoto, T., Kabe, K., Ito, M., Murakami
    • Journal Title

      Journal of Electronic Materials 36

      Pages: 258-265

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Resistivity reduction of Cu interconnects2007

    • Author(s)
      K., Ito, S. Tsukimoto, M. Moriyama and M. Murakami
    • Journal Title

      Stress-Induced Phenomena in Metallization, AIP Conference Proceedings 945

      Pages: 1-10

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Resistivity reduction of Cu interconnects2007

    • Author(s)
      K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
    • Journal Title

      Stress-Induced Phenomena in Metallization, AIP Conference Proceedings 945

      Pages: 1-10

    • Description
      「研究成果報告書概要(和文)」より
    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Cu(Ti)合金微細配線における極薄バリア層の自己組織形成2006

    • Author(s)
      着本 享、大西隆、伊藤 和博、村上 正紀、今野充、矢口紀恵、上野武志
    • Journal Title

      日本金属学会会報(まてりあ) 45

      Pages: 879-879

    • NAID

      10018421961

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] Cu(Ti)合金微細配線における極薄バリア層の自己組織形成2006

    • Author(s)
      着本 享, 大西隆, 伊藤 和博, 村上 正紀, 今野充, 矢口紀恵, 上野
    • Journal Title

      日本金属学会会報(まてりあ) 45

      Pages: 879-879

    • NAID

      10018421961

    • Data Source
      KAKENHI-PROJECT-18360324
  • [Journal Article] ナノ制御による電子デバイス材料の開発2005

    • Author(s)
      村上 正紀
    • Journal Title

      M & E 10

      Pages: 136-142

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system2005

    • Author(s)
      S.Tsukimoto, T.Sakai, T.Onishi, Kazuhiro Ito, Masanori Murakami
    • Journal Title

      Journal of Electronic Materials 34

      Pages: 1310-1312

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices2005

    • Author(s)
      Masanori Murakami, Y.Koide, M.Moriyama, S.Tsukimoto
    • Journal Title

      Materials Science Forum 475-479巻

      Pages: 1705-1714

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices.2005

    • Author(s)
      Masanori Murakami, Y.Koide, M.Moriyama, S.Tsukimoto
    • Journal Title

      Materials Science Forum 475-479

      Pages: 1705-1714

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system2005

    • Author(s)
      S.Tsukimoto, T.Sakai, T.Onishi, K.Ito, Masanori Murakami
    • Journal Title

      Journal of Electronic Materials 34巻

      Pages: 1310-1312

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Simultaneous formation of p- and n-type ohmic contacts to 4H-SiC using the ternary Ni/Ti/Al system.2005

    • Author(s)
      S.Tsukimoto, T.Sakai, T.Onishi, K.Ito, Masanori Murakami
    • Journal Title

      Journal of Electronic Materials, 34

      Pages: 1310-1312

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices2005

    • Author(s)
      Masanori Murakami, Y.Koide, M.Moriyama, S.Tsukimoto
    • Journal Title

      Materials Science Forum 475-479

      Pages: 1705-1714

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Ternary TiAlGe ohmic contacts for p-type 4H-SiC2004

    • Author(s)
      T.Sakai, K.Nitta, S.Tsukimono, M.Moriyama, Masanori Murakami
    • Journal Title

      JOURNAL OF APPLIED PHYSICS 95巻5号

      Pages: 2187-2189

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Correlation between the electrical properties and the interfacial microstructures of TiAl-based ohmic contacts to p-type 4H-SiC2004

    • Author(s)
      S.Tsukimoto, K.Nitta, T.Sakai, M.Moriyama, M.Murakami
    • Journal Title

      Journal of Electronic Materials 33巻

      Pages: 460-466

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices.2004

    • Author(s)
      Masanori Murakami, M.Moriyama, S.Tsukimoto
    • Journal Title

      Transactions of the Materials Research Society of Japan 29

      Pages: 45-50

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Electrical properties and microstructure of ternary Ge/Ti/Al ohmic contacts to p-type 4H-SiC2004

    • Author(s)
      S.Tsukimoto, T.Sakai, M.Murakami
    • Journal Title

      Journal of Applied Physics 96巻

      Pages: 4976-4981

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Correlation between the electrical properties and the interfacial microstructures of TiAl-based ohmic contacts to p-type 4H-SiC.2004

    • Author(s)
      S.Tsukimoto, K.Nitta, T.Sakai, M.Moriyama, M.Murakami
    • Journal Title

      Journal of Electronic Materials, 33

      Pages: 460-466

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Electrical properties and microstructure of ternary Ge/Ti/Al ohmic contacts to p-type 4H-SiC.2004

    • Author(s)
      S.Tsukimoto, T.Sakai, M.Murakami
    • Journal Title

      Journal of Applied Physics 96巻

      Pages: 4976-4981

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Ternary TiAlGe ohmic contacts for p-type 4H-SiC.2004

    • Author(s)
      T.Sakai, K.Nitta, S.Tsukimoto, M.Moriyama, Masanori Murakami
    • Journal Title

      Journal of Applied Physics 95

      Pages: 2187-2189

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices2004

    • Author(s)
      M.Murakami, M.Moriyama, S.Tsukimoto
    • Journal Title

      Transactions of the Materials Research Society of Japan 29巻

      Pages: 45-50

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Electrical properties and microstructure of ternary Ge/Ti/Al ohmic contacts to p-type 4H-SiC.2004

    • Author(s)
      S.Tsukimoto, T.Sakai, M.Murakami
    • Journal Title

      Journal of Applied Physics 96

      Pages: 4976-4981

    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] p型SiC半導体/TiAl系オーミック・コンタクト材の界面構造2004

    • Author(s)
      着本 享, 伊藤 和博, 村上 正紀
    • Journal Title

      日本金属学会会報"まてりあ" 43巻

      Pages: 992-992

    • NAID

      10014238911

    • Data Source
      KAKENHI-PROJECT-15206069
  • [Journal Article] Development of electrode materials for semiconductor devices2004

    • Author(s)
      M.Murakami, M.Moriyama, S.Tsukimoto
    • Journal Title

      Trans. the Materials Research Society of Japan 29巻

      Pages: 45-50

    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-15206069
  • [Patent] 半導体配線の製造方法2006

    • Inventor(s)
      大西隆、武田実佳子、水野雅夫、着本享、可部達也、森田敏文、守山実希、伊藤和博、村上正紀
    • Industrial Property Rights Holder
      神戸製鋼所・京都大学
    • Industrial Property Number
      2006-192153
    • Filing Date
      2006-07-12
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Self-formation of Ti-rich layers at Cu (Ti)/low-k interfaces2008

    • Author(s)
      K. Kohama, K. Ito, S. Tsukimoto, K. Mori. K. Maekawa and M. Murakami
    • Organizer
      Materials Science Society
    • Place of Presentation
      Moscone West and San Francisco Marriott
    • Year and Date
      2008-03-26
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Simultaneous formation of n-and p-type ohmic contacts to 4H-SiC using the binary Ni/Al system2008

    • Author(s)
      K. Ito, T. Onishi, H. Takeda, S. Tsukimoto, M. Konno, Y. Suzuki and M. Murakami
    • Organizer
      2008 Materials Research Society Spring Meeting
    • Place of Presentation
      Moscone West and San Francisco Marriott
    • Year and Date
      2008-03-26
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Self-formation of Ti-rich layers at Cu(TO/low-k interfaces2008

    • Author(s)
      K., Kohama, K., Ito, S., Thukimoto, K., Mori, K., Maekawa, M., Murakami
    • Organizer
      2008 MRS Spring Meeting
    • Place of Presentation
      Moscone West and San Francisco Marriott
    • Year and Date
      2008-03-26
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Self-formation of Ti-rich layers at Cu(Ti)/low-k interfaces2008

    • Author(s)
      K. Kohama, K. Ito, S. Tsukimoto, K. Mori, K. Maekawa and M. Murakami
    • Organizer
      2008 Materials Research Society Spring Meeting
    • Place of Presentation
      Moscone West and San Francisco Marriott
    • Year and Date
      2008-03-26
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Reduction of electrical resistivity of Cu interconnects2007

    • Author(s)
      M. Murakami, M. Moriyama, S. Tsukimoto, K. Ito, and T. Onichi
    • Organizer
      Advanced Metallizations and Interconnect Technologies, in Honor of Prof. K. N. Tu's 70th Birthday(TMS 2007)
    • Place of Presentation
      オーランド(アメリカ)
    • Year and Date
      2007-02-28
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Resistivity reduction of Cu interconnects2007

    • Author(s)
      K., Ito, S., Tsukimoto, M., Moriyama, M., Murakami
    • Organizer
      9th International Workshop on Stress -Induced Phenomena in Metallization
    • Place of Presentation
      PaRuRu Plaza Kyoto
    • Year and Date
      2007-04-05
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Simultaneous formation of n- and p-type Ni-Al ohmic contacts to 4H-SiC2007

    • Author(s)
      H., Takeda, T., Onishi, K., Ito, S., Tsukimoto, M., Murakami
    • Organizer
      Japan Institute of Metals 2007 Anneal, Meeting
    • Place of Presentation
      Gifu Univ
    • Year and Date
      2007-09-20
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Resistivity reduction of Cu interconnects2007

    • Author(s)
      K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
    • Organizer
      9th International Workshop on Stress-Induced Phenomena in Metallization
    • Place of Presentation
      ぱるるプラザ京都
    • Year and Date
      2007-04-05
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Resistivity reduction of Cuinterconnects2007

    • Author(s)
      K. Ito, S. Tsukimoto, M. Moriyama and M. Murakami
    • Organizer
      9th International Workshop on Stress-Induced Phenomena in Metallization
    • Place of Presentation
      ぱるるプラザ京都
    • Year and Date
      2007-04-05
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] p,n-SiC両伝導型にオーミック性を示すNi-A1コンタクト材の伝導機構2007

    • Author(s)
      武田英久, 大西利武, 伊藤和博, 着本享, 村上正紀
    • Organizer
      日本金属学会
    • Place of Presentation
      岐阜大学
    • Year and Date
      2007-09-20
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] p,n-SiC両伝導型にオーミック性を示すNi-Alコンタクト材の伝導機構2007

    • Author(s)
      武田英久, 大西利武, 伊藤和博, 着本享, 村上正紀
    • Organizer
      日本金属学会
    • Place of Presentation
      岐阜大学
    • Year and Date
      2007-09-20
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] Fabrication of Cu(Ti) alloy interconnects with self-formation of thin barrier metal layers using a high-pressure annealing process2006

    • Author(s)
      S., Tsukimoto, T., Onishi, K., Ito, M., Murakami
    • Organizer
      Japan Institute of Metals 2006 Anneal Meeting
    • Place of Presentation
      Niigata Univ
    • Year and Date
      2006-09-18
    • Description
      「研究成果報告書概要(欧文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • [Presentation] 高圧アニールによるスパッタCu(Ti)合金薄膜材の微細配線化2006

    • Author(s)
      着本享, 大西隆, 伊藤和博, 村上正紀
    • Organizer
      日本金属学会
    • Place of Presentation
      新潟大学五十嵐キャンパス
    • Year and Date
      2006-09-18
    • Description
      「研究成果報告書概要(和文)」より
    • Data Source
      KAKENHI-PROJECT-18360324
  • 1.  KOIDE Yasuo (70195650)
    # of Collaborated Projects: 7 results
    # of Collaborated Products: 0 results
  • 2.  MORIYAMA Miki (70303857)
    # of Collaborated Projects: 5 results
    # of Collaborated Products: 10 results
  • 3.  OKU Takeo (30221849)
    # of Collaborated Projects: 4 results
    # of Collaborated Products: 0 results
  • 4.  OTSUKI Akira (10026148)
    # of Collaborated Projects: 3 results
    # of Collaborated Products: 0 results
  • 5.  MORI Hidetsugu (60283644)
    # of Collaborated Projects: 3 results
    # of Collaborated Products: 0 results
  • 6.  ITO Kazuhiro (60303856)
    # of Collaborated Projects: 3 results
    # of Collaborated Products: 34 results
  • 7.  TSUKIMOTO Susumu (50346087)
    # of Collaborated Projects: 2 results
    # of Collaborated Products: 45 results
  • 8.  MATSUBARA Eiichiro (90173864)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 9.  SAKAI Akira (80143543)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 10 results
  • 10.  KUROKAWA Shu (90303859)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 11.  SUZUKI Akira
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 12.  SAKURAI Takeshi
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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