KURASHIMA Yuichi 倉島優一

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Kurashima Yuichi 倉島優一

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Researcher Number	70408730
Other IDs
Affiliation (Current)	2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究グループ長
Affiliation (based on the past Project Information) *help	2021 – 2023: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究グループ長 2017 – 2020: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 2016: 国立研究開発法人産業技術総合研究所, 集積マイクロシステム研究センター, 主任研究員
Review Section/Research Field	Principal Investigator Basic Section 18020:Manufacturing and production engineering-related / Production engineering/Processing studies Except Principal Investigator Basic Section 25030:Disaster prevention engineering-related
Keywords	Principal Investigator 気密封止 / MEMS / マイクロデバイス / ゲッター / 量子干渉効果 / 脱ガス / 量子干渉 / 接合 / デバイス設計・製造プロセス / 電子・電気材料 … More / マイクロ・ナノデバイス / 封止 / 平滑化 / 表面平滑化 / ＭＥＭＳ / 微細加工 / 実装 / 常温接合 … More Except Principal Investigator スマートシティ / 人工知能 / 防災システム Less

Construction of a dynamic evacuation guidance system based on intelligent and distributed cooperative processing of evacuation guidance devices and disaster prevention sensors
- Principal Investigator
  
  堀井宏祐
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 25030:Disaster prevention engineering-related
- Research Institution
  Kokushikan University
Research about ultra-high hermetic seal bonding for microcavity by quantum sensingPrincipal Investigator
- Principal Investigator
  
  Yuichi Kurashima
- Project Period (FY)
  2019 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 18020:Manufacturing and production engineering-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Room temperature metal bonding for highly hermetic sealing of microdevicePrincipal Investigator
- Principal Investigator
  
  Kurashima Yuichi
- Project Period (FY)
  2016 – 2018
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Production engineering/Processing studies
- Research Institution
  National Institute of Advanced Industrial Science and Technology

All 2022 2021 2020 2019 2018 2017

All Journal Article Presentation

[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022
- Author(s)
  Kariya Shingo、Matsumae Takashi、KURASHIMA Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: - Issue: 5 Pages: 051004-051004
- DOI
  10.35848/1347-4065/ac52b8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021
- Author(s)
  Kurashima Yuichi、Matsumae Takashi、Higurashi Eiji、Yanagimachi Sinya、Kusui Takaaki、Watanabe Mitsuhiro、Takagi Hideki
- Journal Title
  
  Microelectronic Engineering
  
  Volume: 238 Pages: 111513-111513
- DOI
  10.1016/j.mee.2021.111513
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020
- Author(s)
  Matsumae Takashi、Kariya Shingo、Kurashima Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  ECS Transactions
  
  Volume: 98 Issue: 4 Pages: 211-215
- DOI
  10.1149/09804.0211ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Room-temperature Au?Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns2018
- Author(s)
  Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
- Journal Title
  
  Microelectronic Engineering
  
  Volume: 189 Pages: 1-5
- DOI
  10.1016/j.mee.2017.12.004
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-16K06034
[Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  2021 7th International Workshop on Low Temperature Bonding for 3D Integration
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  International Conference on Electronics Packaging 2021
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則
- Organizer
  第38回「センサ・マイクロマシンと応用システム」シンポジウム
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] キャビティ内部にて残留ガスを吸収させたTi/Pt/Au封止接合膜の構造観察2020
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則, 日暮栄治
- Organizer
  2020年度精密工学会秋季大会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020
- Author(s)
  狩谷真悟、松前貴司、倉島優一、日暮栄治、早瀬仁則、高木秀樹
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Au/Ti薄膜の低温接合及びゲッター材への適応性評価2020
- Author(s)
  倉島優一、楠井貴晶、松前貴司、日暮栄治、髙木秀樹、渡邉満洋
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Au/Ti double-layered films for bonding and residual gas gettering in MEMS encapsulation2019
- Author(s)
  Y. Kurashima, T. Matsumae, E. Higurashi, S. Yanagimachi, H. Takagi, Sudiyarmanto, E. Kondoh
- Organizer
  45th International Conference Micro and Nano Engineering
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Auメッキ封止枠を用いた常温気密封止接合 ―剥離転写法によるメッキ表面の平滑化―2019
- Author(s)
  倉島優一　松前貴司　日暮栄治　高木秀樹
- Organizer
  2019年度精密工学会春季大会学術講演会
- Data Source
  KAKENHI-PROJECT-16K06034
[Presentation] Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air2017
- Author(s)
  Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
- Organizer
  2017 5th International Workshop on Low Temperature Bonding For 3d Integration
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16K06034

1. 高木秀樹 (00357344)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
2. 鈴木健太 (60709509)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 松前貴司 (10807431)

# of Collaborated Projects: 1 results

# of Collaborated Products: 10 results
4. 柳町真也 (70358216)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
5. 堀井宏祐 (00447715)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 辻内伸好 (60257798)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 伊藤彰人 (60516946)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. 廣川雄一 (30419147)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

KURASHIMA Yuichi 倉島 優一

Kurashima Yuichi 倉島 優一

Research Projects

Research Products

Co-Researchers

Construction of a dynamic evacuation guidance system based on intelligent and distributed cooperative processing of evacuation guidance devices and disaster prevention sensors

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Research about ultra-high hermetic seal bonding for microcavity by quantum sensingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Room temperature metal bonding for highly hermetic sealing of microdevicePrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Room-temperature Au?Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns2018

Author(s)

Journal Title

DOI

Data Source

[Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021

Author(s)

Organizer

Data Source

[Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021

Author(s)

Organizer

Data Source

[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開 発とその低温化2021

Author(s)

Organizer

Data Source

[Presentation] キャビティ内部にて残留ガスを吸収させたTi/Pt/Au封止接合膜の構造観察2020

Author(s)

Organizer

Data Source

[Presentation] 脱ガス処理後の真空 封止と内部残留ガス ゲッタリングが可能 な MEMS 封止用金属接合膜の開発2020

Author(s)

Organizer

Data Source

[Presentation] Au/Ti薄膜の低温接合及びゲッター材への適応性評価2020

Author(s)

Organizer

Data Source

[Presentation] Au/Ti double-layered films for bonding and residual gas gettering in MEMS encapsulation2019

Author(s)

Organizer

Data Source

[Presentation] Auメッキ封止枠を用いた常温気密封止接合 ―剥離転写法によるメッキ表面の平滑化―2019

Author(s)

Organizer

Data Source

[Presentation] Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air2017

Author(s)

Organizer

Data Source

KURASHIMA Yuichi 倉島優一

Kurashima Yuichi 倉島優一

[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021

[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020