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KURASHIMA Yuichi  倉島 優一

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Kurashima Yuichi  倉島 優一

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Researcher Number 70408730
Other IDs
Affiliation (Current) 2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究グループ長
Affiliation (based on the past Project Information) *help 2021 – 2023: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究グループ長
2017 – 2020: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
2016: 国立研究開発法人産業技術総合研究所, 集積マイクロシステム研究センター, 主任研究員
Review Section/Research Field
Principal Investigator
Basic Section 18020:Manufacturing and production engineering-related / Production engineering/Processing studies
Except Principal Investigator
Basic Section 25030:Disaster prevention engineering-related
Keywords
Principal Investigator
気密封止 / MEMS / マイクロデバイス / ゲッター / 量子干渉効果 / 脱ガス / 量子干渉 / 接合 / デバイス設計・製造プロセス / 電子・電気材料 … More / マイクロ・ナノデバイス / 封止 / 平滑化 / 表面平滑化 / MEMS / 微細加工 / 実装 / 常温接合 … More
Except Principal Investigator
スマートシティ / 人工知能 / 防災システム Less
  • Research Projects

    (3 results)
  • Research Products

    (13 results)
  • Co-Researchers

    (8 People)
  •  Construction of a dynamic evacuation guidance system based on intelligent and distributed cooperative processing of evacuation guidance devices and disaster prevention sensors

    • Principal Investigator
      堀井 宏祐
    • Project Period (FY)
      2022 – 2024
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Review Section
      Basic Section 25030:Disaster prevention engineering-related
    • Research Institution
      Kokushikan University
  •  Research about ultra-high hermetic seal bonding for microcavity by quantum sensingPrincipal Investigator

    • Principal Investigator
      Yuichi Kurashima
    • Project Period (FY)
      2019 – 2021
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 18020:Manufacturing and production engineering-related
    • Research Institution
      National Institute of Advanced Industrial Science and Technology
  •  Room temperature metal bonding for highly hermetic sealing of microdevicePrincipal Investigator

    • Principal Investigator
      Kurashima Yuichi
    • Project Period (FY)
      2016 – 2018
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Production engineering/Processing studies
    • Research Institution
      National Institute of Advanced Industrial Science and Technology

All 2022 2021 2020 2019 2018 2017

All Journal Article Presentation

  • [Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022

    • Author(s)
      Kariya Shingo、Matsumae Takashi、KURASHIMA Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: - Issue: 5 Pages: 051004-051004

    • DOI

      10.35848/1347-4065/ac52b8

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021

    • Author(s)
      Kurashima Yuichi、Matsumae Takashi、Higurashi Eiji、Yanagimachi Sinya、Kusui Takaaki、Watanabe Mitsuhiro、Takagi Hideki
    • Journal Title

      Microelectronic Engineering

      Volume: 238 Pages: 111513-111513

    • DOI

      10.1016/j.mee.2021.111513

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020

    • Author(s)
      Matsumae Takashi、Kariya Shingo、Kurashima Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
    • Journal Title

      ECS Transactions

      Volume: 98 Issue: 4 Pages: 211-215

    • DOI

      10.1149/09804.0211ecst

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Journal Article] Room-temperature Au?Au bonding in atmospheric air using direct transferred atomically smooth Au film on electroplated patterns2018

    • Author(s)
      Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
    • Journal Title

      Microelectronic Engineering

      Volume: 189 Pages: 1-5

    • DOI

      10.1016/j.mee.2017.12.004

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-16K06034
  • [Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021

    • Author(s)
      狩谷 真悟、松前 貴司、倉島 優一、高木 秀樹、早瀬仁則、日暮 栄治
    • Organizer
      2021 7th International Workshop on Low Temperature Bonding for 3D Integration
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021

    • Author(s)
      狩谷 真悟、松前 貴司、倉島 優一、高木 秀樹、早瀬仁則、日暮 栄治
    • Organizer
      International Conference on Electronics Packaging 2021
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開 発とその低温化2021

    • Author(s)
      狩谷 真悟, 松前 貴司, 倉島 優一, 髙木 秀樹, 早瀬 仁則
    • Organizer
      第38回「センサ・マイクロマシンと応用システム」 シンポジウム
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] キャビティ内部にて残留ガスを吸収させたTi/Pt/Au封止接合膜の構造観察2020

    • Author(s)
      狩谷 真悟, 松前 貴司, 倉島 優一, 髙木 秀樹, 早瀬 仁則, 日暮 栄治
    • Organizer
      2020年度精密工学会秋季大会
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] 脱ガス処理後の真空 封止と内部残留ガス ゲッタリングが可能 な MEMS 封止用金属接合膜の開発2020

    • Author(s)
      狩谷真悟、松前貴司、倉島優一、日暮栄治、早瀬仁則、高木秀樹
    • Organizer
      精密工学会春季大会講演会
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] Au/Ti薄膜の低温接合及びゲッター材への適応性評価2020

    • Author(s)
      倉島 優一、楠井 貴晶、松前 貴司、日暮 栄治、髙木 秀樹、渡邉満洋
    • Organizer
      精密工学会春季大会講演会
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] Au/Ti double-layered films for bonding and residual gas gettering in MEMS encapsulation2019

    • Author(s)
      Y. Kurashima, T. Matsumae, E. Higurashi, S. Yanagimachi, H. Takagi, Sudiyarmanto, E. Kondoh
    • Organizer
      45th International Conference Micro and Nano Engineering
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-19H02045
  • [Presentation] Auメッキ封止枠を用いた常温気密封止接合 ―剥離転写法によるメッキ表面の平滑化―2019

    • Author(s)
      倉島優一 松前貴司 日暮栄治 高木秀樹
    • Organizer
      2019年度精密工学会春季大会学術講演会
    • Data Source
      KAKENHI-PROJECT-16K06034
  • [Presentation] Direct transfer of atomically smooth Au film onto electroplated patterns for room-temperature Au-Au bonding in atmospheric air2017

    • Author(s)
      Kurashima Yuichi、Matsumae Takashi、Takagi Hideki
    • Organizer
      2017 5th International Workshop on Low Temperature Bonding For 3d Integration
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-16K06034
  • 1.  高木 秀樹 (00357344)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 3 results
  • 2.  鈴木 健太 (60709509)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 3.  松前 貴司 (10807431)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 10 results
  • 4.  柳町 真也 (70358216)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 2 results
  • 5.  堀井 宏祐 (00447715)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 6.  辻内 伸好 (60257798)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 7.  伊藤 彰人 (60516946)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 8.  廣川 雄一 (30419147)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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