SHIGETOU Akitsu 重藤暁津

… Alternative Names

SHIGETO Akitsu 重藤暁津

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Researcher Number	70469758
Affiliation (Current)	2025: 国立研究開発法人物質・材料研究機構, ナノアーキテクトニクス材料研究センター, チームリーダー
Affiliation (based on the past Project Information) *help	2016 – 2020: 国立研究開発法人物質・材料研究機構, 構造材料研究拠点, 主幹研究員 2015 – 2016: 国立研究開発法人物質・材料研究機構, 構造材料研究拠点, 主任研究員 2015: 国立研究開発法人物質・材料研究機構, その他部局等, その他研究員 2014: 独立行政法人物質・材料研究機構, その他部局等, その他研究員 2012 – 2014: 独立行政法人物質・材料研究機構, その他部局等, その他 … More 2013: 独立行政法人物質・材料研究機構, 環境・エネルギー材料部門ハイブリッド材料ユニット, 主任研究員 2011 – 2012: 独立行政法人物質・材料研究機構, その他部局等, 研究員 2009 – 2010: National Institute for Materials Science, ハイブリッド材料センター, 主任研究員 Less
Review Section/Research Field	Principal Investigator Electron device/Electronic equipment Except Principal Investigator Complex systems
Keywords	Principal Investigator 大気圧 / 低温 / 接合 / MEMS / 実装 / 低温大気圧接合 / 表面・界面 / 電子デバイス・機器 / ハイブリッド接合 / 低温大気圧 … More / ハイブリッド / インターコネクション / 異種材料 / インターコネクト / 構造・機能材料 / 異種材料接合 / 軽量構造材料 / IoT / 移動体 / 構造材料 / 電子実装 / 複合材料 / 界面 / 表面 / 表面・界面物性 / 複合材料・物性 / 真空紫外光 / パワーエレクトロニクス / PDMS / SiC / Si / GaN / VUV / ワイドバンドギャップ半導体 / ヘテロインテグレーション / 大気圧接合 / 3次元実装 / 低温接合 / 表面改質 / TEM / XPS … More Except Principal Investigator 核酸 / 表面・界面物性 / 高密度実装 / 微細接続 / ﾊｲﾌﾞﾘｯﾄﾞ皮膜 / ＤＮＡ / ﾊﾞｲｵﾐﾒﾃｨｸｽ / 生物模倣 / バイオミメティク / DNA / エレクトのニクス実装 / 放熱 / ハイブリッド皮膜 / 接合 / 表面 / 表面階層構造 / セルフアライメント / エレクトロニクス実装 / 自己治癒 / 防汚 / 昆虫 / 剥離 / 接着 / バイオミメティクス Less

Lightweight and Smart Hybrid Materials by Low Temperature Ambient BondingPrincipal Investigator
- Principal Investigator
  
  SHIGETOU Akitsu
- Project Period (FY)
  2017 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  National Institute for Materials Science
Low Temperature and Non-Vacuum Bonding of Wide Bandgap Semiconductor Materials by VUV/Vapor-Assisted MethodPrincipal Investigator
- Principal Investigator
  
  Shigetou Akitsu
- Project Period (FY)
  2014 – 2017
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  National Institute for Materials Science
Dynamics of biomimetic hierarchical structure
- Principal Investigator
  
  Hosoda Naoe
- Project Period (FY)
  2012 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research on Innovative Areas (Research in a proposed research area)
- Review Section
  
  Complex systems
- Research Institution
  National Institute for Materials Science
Vapor-assisted hybrid bonding of organic/inorganic substrates at low temperature and atmospheric pressurePrincipal Investigator
- Principal Investigator
  
  SHIGETOU Akitsu
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  National Institute for Materials Science
Development of Low Temperature Bonding Technology for Glass and Polymer Substrates in Ambient Air for Future Three-Dimensional MEMS PackagingPrincipal Investigator
- Principal Investigator
  
  SHIGETO Akitsu
- Project Period (FY)
  2009 – 2010
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  National Institute for Materials Science

[Book] 溶接接合教室－特論編－「異種材料の低温大気圧接合」2020
- Author(s)
  重藤暁津
- Publisher
  溶接学会
- Data Source
  KAKENHI-PROJECT-17H01275
[Book] 超親水・親油性表面の技術（第4章）2018
- Author(s)
  重藤暁津
- Total Pages
  15
- Publisher
  サイエンス＆テクノロジー
- ISBN
  9784864281713
- Data Source
  KAKENHI-PROJECT-17H01275
[Book] 真空紫外光照射と極薄架橋形成による有機・無機材料の低温大気圧混載接合の要素技術（第４章親水性表面の応用展開・活用事例）. 超親水・親油性表面の技術2018
- Author(s)
  重藤暁津
- Total Pages
  16
- Publisher
  サイエンス＆テクノロジー
- ISBN
  9784864281713
- Data Source
  KAKENHI-PROJECT-17H01275
[Book] エレクトロニクス実装学会誌（特集記事：研究室訪問　国立研究開発法人物質・材料研究機構機能性材料研究拠点光機能分野プラズモニクスグループ）2017
- Author(s)
  宮崎英樹　重藤暁津
- Total Pages
  1
- Publisher
  （社）エレクトロニクス実装学会
- Data Source
  KAKENHI-PROJECT-26289112
[Book] ハイブリッド材料創製のツールとしての接合技術,"PEN NEWS LETTER 9月号web版2013
- Author(s)
  重藤暁津
- Data Source
  KAKENHI-PROJECT-23686057
[Book] ハイブリッド材料創製のツールとしての接合技術2013
- Author(s)
  重藤暁津
- Total Pages
  4
- Publisher
  PEN NEWS LETTER（ISSN 2185 - 3231）
- Data Source
  KAKENHI-PROJECT-23686057
[Book] 3次元システムインパッケージと材料技術2012
- Author(s)
  重藤暁津他26名共同執筆
- Total Pages
  294
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-23686057
[Book] 3次元SiPのためのバンプレスインタコネクト,"16章, 3次元システムインパッケージと材料技術2012
- Author(s)
  重藤暁津, 26名
- Publisher
  シーエムシー出版
- Data Source
  KAKENHI-PROJECT-23686057
[Book] 3D Integration for VLSI Systems, in Chapter 10 "Surface modification bodning at low temperature for three-dimensional hetero integration(ISDN : 978-981-4303-82-8)2011
- Author(s)
  Akitsu Shigetou
- Total Pages
  26
- Publisher
  Pan Stanford Publishing
- Data Source
  KAKENHI-PROJECT-21760269
[Book] 3D Integration for VLSI Systems, Chapter 10 "SURFACE MODIFICATION BONDING AT LOW TEMPERATURE FOR THREE-DIMENSIONAL HETERO-INTEGRATION"2011
- Author(s)
  A.Shigetou
- Total Pages
  26
- Publisher
  Pan Stanford Publishing Book(In press)
- Data Source
  KAKENHI-PROJECT-21760269
[Book] Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration,"3D Integration for VLSI Systems2011
- Author(s)
  A. Shigetoul. (other 13 authors, no order)
- Publisher
  Pan Stanford Publishing
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Different Interfacial Structures of Cu/In Obtained by Surface Activated Bonding (SAB) in Vacuum and Vapor-Assisted Vacuum Ultraviolet (V-VUV) at Atmospheric Pressure2020
- Author(s)
  Yu-Shan Chiu, Robert Kao, Akitsu Shigetou
- Journal Title
  
  Materials and Design
  
  Volume: -
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Systematic studies for improving device performance of quantum well infrared stripe photodetectors2020
- Author(s)
  Hainey Mel F.、Mano Takaaki、Kasaya Takeshi、Ochiai Tetsuyuki、Osato Hirotaka、Watanabe Kazuhiro、Sugimoto Yoshimasa、Kawazu Takuya、Arai Yukinaga、Shigetou Akitsu、Miyazaki Hideki T.
- Journal Title
  
  Nanophotonics
  
  Volume: 9 Issue: 10 Pages: 3373-3384
- DOI
  10.1515/nanoph-2020-0095
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275, KAKENHI-PROJECT-19H00875
[Journal Article] Hybrid Bonding in Ambient Atmosphere for Automotive IoT2020
- Author(s)
  SHIGETOU Akitsu
- Journal Title
  
  JOURNAL OF THE JAPAN WELDING SOCIETY
  
  Volume: 89 Issue: 6 Pages: 438-446
- DOI
  10.2207/jjws.89.438
- NAID
  130007903891
- ISSN
  0021-4787, 1883-7204
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Different interfacial structures of Cu/In obtained by surface activated bonding (SAB) in vacuum and vapor-assisted vacuum ultraviolet (V-VUV) at atmospheric pressure2020
- Author(s)
  Chiu Yu-Shan、Kao C.Robert、Shigetou Akitsu.
- Journal Title
  
  Materials & Design
  
  Volume: 195 Pages: 109065-109065
- DOI
  10.1016/j.matdes.2020.109065
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Patchwork metasurface quantum well photodetectors with broadened photoresponse2020
- Author(s)
  Hainey Mel F.、Mano Takaaki、Kasaya Takeshi、Jimba Yoji、Miyazaki Hiroshi、Ochiai Tetsuyuki、Osato Hirotaka、Watanabe Kazuhiro、Sugimoto Yoshimasa、Kawazu Takuya、Arai Yukinaga、Shigetou Akitsu、Miyazaki Hideki T.
- Journal Title
  
  Optics Express
  
  Volume: 29 Issue: 1 Pages: 59-59
- DOI
  10.1364/oe.408515
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275, KAKENHI-PROJECT-19H00875
[Journal Article] Near-field resonant photon sorting applied: dual-band metasurface quantum well infrared photodetectors for gas sensing2020
- Author(s)
  Hainey Mel F.、Mano Takaaki、Kasaya Takeshi、Ochiai Tetsuyuki、Osato Hirotaka、Watanabe Kazuhiro、Sugimoto Yoshimasa、Kawazu Takuya、Arai Yukinaga、Shigetou Akitsu、Miyazaki Hideki T.
- Journal Title
  
  Nanophotonics
  
  Volume: 9 Issue: 16 Pages: 4775-4784
- DOI
  10.1515/nanoph-2020-0456
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275, KAKENHI-PROJECT-19H00875
[Journal Article] Synchronously wired infrared antennas for resonant single-quantum-well photodetection up to room temperature2020
- Author(s)
  Hideki T. Miyazaki, Takaaki Mano, Takeshi Kasaya, Hirotaka Osato, Kazuhiro Watanabe, Yoshimasa Sugimoto, Takuya Kawazu, Yukinaga Arai, Akitsu Shigetou, Tetsuyuki Ochiai, Yoji Jimba, Hiroshi Miyazaki
- Journal Title
  
  Nature Communications
  
  Volume: 11 Issue: 1 Pages: 1-10
- DOI
  10.1038/s41467-020-14426-6
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275, KAKENHI-PROJECT-19H00875
[Journal Article] Organic-Inorganic Solid-State Hybridization with High-Strength and Anti-Hydrolysis Interface2019
- Author(s)
  Tilo Hong-Wei Yang, Robert Kao, Akitsu Shigetou
- Journal Title
  
  Nature: Scientific Reports
  
  Volume: 9
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] 次世代パワー半導体用接合技術の動向2018
- Author(s)
  重藤暁津, 並木尚己
- Journal Title
  
  YANO E Plus
  
  Volume: 118 Pages: 73-76
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum2017
- Author(s)
  Fu Weixin、Shigetou Akitsu、Shoji Shuichi、Mizuno Jun
- Journal Title
  
  Materials Science and Engineering: C
  
  Volume: 79 Pages: 860-865
- DOI
  10.1016/j.msec.2017.05.058
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Evolution of Surface Chemical Structure Induced by Ar Fast Atom Beam (Ar-FAB) Bombardment and Vacuum Ultraviolet (VUV) Irradiation for Low Temperature Hybrid Bonding2017
- Author(s)
  H.W. Yang, C.R. Kao, and A. Shigetou
- Journal Title
  
  Electronics Materials
  
  Volume: 印刷中
- Peer Reviewed / Acknowledgement Compliant / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] 次世代パワー半導体用接合技術の動向2017
- Author(s)
  並木尚己　重藤暁津
- Journal Title
  
  YANO E Plus
  
  Volume: 118 Pages: 73-76
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Fast Atom Beam- and Vacuum-Ultraviolet-Activated Sites for Low-Temperature Hybrid Integration2017
- Author(s)
  Yang Hong-Wei、Kao C. Robert、Shigetou Akitsu
- Journal Title
  
  Langmuir
  
  Volume: 33 Issue: 34 Pages: 8413-8419
- DOI
  10.1021/acs.langmuir.7b02010
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Journal Article] Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum2017
- Author(s)
  W. Fu, J. Mizuno, S. Shoji, and A. Shigetou
- Journal Title
  
  Materials Science & Engineering C
  
  Volume: 印刷中
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Low temperature direct bonding between PEEK and Pt via vapor-assisted vacuum ultraviolet surface modificatrion2017
- Author(s)
  Weixin Fu, Akitsu Shigetou, Shuichi Shoji, Jun Mizuno
- Journal Title
  
  MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
  
  Volume: 7 Issue: 2 Pages: 49-62
- DOI
  10.17265/2161-6221/2017.3-4.001
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-26289112, KAKENHI-PROJECT-16H04508
[Journal Article] Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection2016
- Author(s)
  M. Ohyama、M. Nimura、J. Mizuno、S. Shoji、T. Nonaka、Y. Shinba、A. Shigetou
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 59 Pages: 134-139
- DOI
  10.1016/j.microrel.2015.12.033
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508, KAKENHI-PROJECT-26289112
[Journal Article] valuation of hybrid bonding technology of single0micron pitch with planar structure for 3D interconnection2016
- Author(s)
  M. Ohyama, M. Nimura, J. Mizuno, S. Shoji, T. Nonaka, and A. Shigetou
- Journal Title
  
  IEEE Journal of Microelectronics Reliability
  
  Volume: 59 Pages: 134-139
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] 低温大気圧接合による有機無機材料ハイブリッド化2016
- Author(s)
  重藤暁津
- Journal Title
  
  ケミカルエンジニヤリング
  
  Volume: 61 Pages: 287-293
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] 新しい機能性表面/界面創製のツールとしての低温大気圧ハイブリッド接合技術2016
- Author(s)
  重藤暁津，梶原優介
- Journal Title
  
  エレクトロニクス実装学会誌
  
  Volume: 19
- NAID
  130005155004
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] 低温大気圧接合による有機無機材料ハイブリッド化2016
- Author(s)
  重藤暁津
- Journal Title
  
  ケミカルエンジニヤリング
  
  Volume: 61 Pages: 287-293
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Hybrid Bonding Technology at Low Temperature and Atmospheric Pressure for Multi-Field Applications2016
- Author(s)
  重藤暁津　梶原優介
- Journal Title
  
  Journal of The Japan Institute of Electronics Packaging
  
  Volume: 19 Issue: 2 Pages: 120-126
- DOI
  10.5104/jiep.19.120
- NAID
  130005155004
- ISSN
  1343-9677, 1884-121X
- Language
  Japanese
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] 低温大気圧による有機無機材料ハイブリッド化2016
- Author(s)
  重藤暁津
- Journal Title
  
  ケミカルエンジニアリング
  
  Volume: 61 Pages: 287-293
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Evaluation of hybrid bonding technology of single0micron pitch with planar structure for 3D interconnection2016
- Author(s)
  M. Ohyama, M. Nimura, J. Mizuno, S. Shoji, T. Nonaka, and A. Shigetou
- Journal Title
  
  IEEE Journal of Microelectronics Reliability
  
  Volume: 59 Pages: 134-139
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Hybrid Bonding Technology with Planar Structure for 3D Interconnection of Microbump with Single-Micron Pitch2015
- Author(s)
  Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, and Akitsu Shigetou
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 印刷中
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-26289112
[Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2014
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou et. al.
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: -
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2014
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou. (other authors)
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: vol. 4 Pages: 762-768
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI2014
- Author(s)
  M. Nimura, J. Mizuno, S. Shoji, K. Sakuma, H. Ogino, T. Enomoto, A, Shigetou
- Journal Title
  
  IEEE Transactions on Components, Packaging and Manufacturing Technology
  
  Volume: Vol.4 Issue: 5 Pages: 762-768
- DOI
  10.1109/tcpmt.2014.2311094
- Peer Reviewed / Acknowledgement Compliant / Open Access
- Data Source
  KAKENHI-PROJECT-23226010, KAKENHI-PROJECT-26289112
[Journal Article] Study on Hybrid Au-Underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou, (other authors)
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: vol. 3, No. 4
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2013
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou et al. (other 4 authors)
- Journal Title
  
  Proc. IEEE Electronic and Components & Technology Conference (ECTC)
  
  Volume: ー Pages: 1153-1157
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2013
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou et al. (other 4 authors),
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: in press
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] 中間層を用いた表面活性化手法によるポリマー/ポリマーおよびポリマー/ガラス常温接合2013
- Author(s)
  松前貴司，藤野真久，重藤暁津，ほか著者3名
- Journal Title
  
  社）エレクトロニクス実装学会春季講演大会講演論文集
  
  Volume: -
- NAID
  130007429958
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Study on Hybrid Au-Underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013
- Author(s)
  2) M. Nimura, J. Mizuno, A. Shigetou et al. (other 4 authors)
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: 3 Pages: 558-565
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Vacuum Ultraviolet Irradiation Treatment for Reducing Gold - Gold Bonding Temperature2013
- Author(s)
  A. Okada, S. Shoji, M. Nimura1, A. Shigetou, K. Sakuma and J. Mizuno
- Journal Title
  
  Materials Transactions
  
  Volume: Vol. 54, No. 11
- NAID
  130004824999
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] 真空紫外光照射を利用した金属，樹脂基板の大気圧混載接合2013
- Author(s)
  重藤暁津，マノアジャヤン，水野潤
- Journal Title
  
  社）エレクトロニクス実装学会春季講演大会講演論文集
  
  Volume: -
- NAID
  130007429404
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Vacuum Ultraviolet Irradiation Treatment for Reducing Gold–Gold Bonding Temperature2013
- Author(s)
  A. Okada, S. Shoji, M. Nimura, A. Shigetou et. al.
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 54 Issue: 11 Pages: 2139-2143
- DOI
  10.2320/matertrans.MF201313
- NAID
  130004824999
- ISSN
  1345-9678, 1347-5320
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Study on Hybrid Au-Underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou et. al.
- Journal Title
  
  IEEE Transactions on Components, Packaging, and Manufacturing Technology
  
  Volume: 3 Issue: 4 Pages: 558-565
- DOI
  10.1109/tcpmt.2013.2240566
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] ハイブリッド材料創製のツールとしての接合技術2013
- Author(s)
  重藤　暁津
- Journal Title
  
  PEN NEWS LETTER 9月号 web版
  
  Volume: ー
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Nanoadhesion Layer for Enhanced Si-Si and Si-SiN Wafer Bonding2012
- Author(s)
  R. Kondou, C. Wang, A. Shigetou, and T. Suga
- Journal Title
  
  Journal of Microelectronics Reliability
  
  Volume: vol. 52, No. 2 Pages: 342-346
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] 環境調和型実装技術:省エネルギ,新材料,新しい技術第二部低環境負荷な接合手法による異種材料のハイブリッド化2012
- Author(s)
  重藤暁津,水野潤,安田清和
- Journal Title
  
  エレクトロニクス実装学会誌
  
  Volume: vol. 15, No. 1
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150 C and Atmospheric Pressure2012
- Author(s)
  Akitsu Shigetou
- Journal Title
  
  JOURNAL OF ELECTRONIC MATERIALS
  
  Volume: 41 Issue: 8 Pages: 2274-2280
- DOI
  10.1007/s11664-012-2091-9
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] 低環境負荷な接合手法による異種材料のハイブリッド化2012
- Author(s)
  重藤暁津
- Journal Title
  
  JOURNAL OF JAPAN INSTITUTE OF ELECTRONICS PACKAGING
  
  Volume: 15 Pages: 29-33
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Eco-friendly bonding technologies for hybrid integration2012
- Author(s)
  Akitsu Shigetou
- Journal Title
  
  表面実装技術（韓国語，韓国尖端社）
  
  Volume: 8 Pages: 60-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Eco-Friendly Bonding Technologies for Hybrid Integration2012
- Author(s)
  A. Shigetou, J. Mizuno, and K. Yasuda
- Journal Title
  
  Surface Mount Technology(韓国尖端社)(Ohm社共同出版)
  
  Volume: No. 8 Pages: 60-65
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] Eco-friendly bonding technologies for hybrid integration2012
- Author(s)
  重藤暁津
- Journal Title
  
  表面実装技術
  
  Volume: 8 Pages: 60-65
- Peer Reviewed
- Data Source
  KAKENHI-PLANNED-24120005
[Journal Article] Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150 C and Atmospheric Pressure2012
- Author(s)
  A. Shigetou and T. Suga
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: Vol. 41, No. 8 Pages: 2274-2280
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23686057
[Journal Article] 有機材料も含めた異種材料混載接合の可能性2010
- Author(s)
  重藤暁津
- Journal Title
  
  エレクトロニクス実装学会誌 13
  
  Pages: 107-113
- NAID
  10025984589
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] 有機材料も含めた異種材料混載接合の可能性2010
- Author(s)
  重藤暁津
- Journal Title
  
  (社)エレクトロニクス実装学会誌
  
  Volume: 13 Pages: 107-113
- NAID
  10025984589
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] 有機材料も含めた異種材料混載接合の可能性2010
- Author(s)
  重藤暁津
- Journal Title
  
  エレクトロニクス実装学会誌 Vol.13, No.2
  
  Pages: 107-113
- NAID
  10025984589
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Feasibility of hetero integration of including organic materials2010
- Author(s)
  A.Shigetou
- Journal Title
  
  Surface Mount Technology (Korea)
  
  Volume: 11 Pages: 52-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Nanoadhesion Layer for Enhanced SiO2-SiN Wafer Bonding2010
- Author(s)
  R.Kondou, C.Wang, A.Shigetou, T.Suga
- Journal Title
  
  Scripta Materialia
  
  Volume: (accepted)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Feasibility of hetero integration of including organic materials2010
- Author(s)
  A.Shigetou
- Journal Title
  
  Surface Mount Technology (In Korean) Vol.11, No.7
  
  Pages: 52-59
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Modified Diffusion Bonding of Chemical Mechanical Polishing (CMP)-Cu at 150C at Ambient Pressure2009
- Author(s)
  A.Shigetou, T.Suga
- Journal Title
  
  Applied Physics Express Vol.2, No.5
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Modified Diffusion Bonding of Chemical Mechanical Polishing(CMP)-Cu at 150℃ at Ambient Pressure2009
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Journal Title
  
  Applied Physics Explress 2
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21760269
[Journal Article] Room Temperature Wafer Bonding of Si and SiN by Nano-Adhesion Layer Method
- Author(s)
  R.Kondou, C.Wang, A.Shigetou, T.Suga
- Journal Title
  
  アクセプト済み, Scripta Materialia.
- Data Source
  KAKENHI-PROJECT-21760269
[Patent] 積層体の製造方法、積層体、及び、暖房便座装置2019
- Inventor(s)
  重藤暁津，楊弘偉
- Industrial Property Rights Holder
  国立研究開発法人物質・材料研究機構
- Industrial Property Rights Type
  特許
- Filing Date
  2019
- Overseas
- Data Source
  KAKENHI-PROJECT-17H01275
[Patent] 接合方法2017
- Inventor(s)
  重藤暁津，水野潤，庄子習一
- Industrial Property Rights Holder
  物質・材料研究機構　早稲田大学
- Industrial Property Rights Type
  特許
- Filing Date
  2017
- Acquisition Date
  2017
- Data Source
  KAKENHI-PROJECT-17H01275
[Patent] 金属材の拡散接合方法および金属材の拡散接合装置2013
- Inventor(s)
  重藤暁津
- Industrial Property Rights Holder
  独立行政法人物質・材料研究機構
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2013-184450
- Filing Date
  2013-09-05
- Data Source
  KAKENHI-PLANNED-24120005
[Patent] 金属材の拡散接合方法および金属材の拡散接合装置2013
- Inventor(s)
  重藤暁津，水野潤，庄子習一
- Industrial Property Rights Holder
  独立行政法人物質材料研究機構，早稲田大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-05
- Data Source
  KAKENHI-PROJECT-23686057
[Patent] 金属材の拡散接合方法および金属材の拡散接合装置2013
- Inventor(s)
  重藤暁津，水野潤，岡田愛姫子，仁村将次，庄子習一
- Industrial Property Rights Holder
  独立行政法人物質・材料研究機構，学校法人早稲田大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-03-26
- Data Source
  KAKENHI-PROJECT-23686057
[Patent] 接合装置と接合方法2013
- Inventor(s)
  重藤暁津,水野潤,庄子習一
- Industrial Property Rights Holder
  独立行政法人物質材料研究機構,早稲田大学
- Industrial Property Rights Type
  特許
- Filing Date
  2013-09-05
- Overseas
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Hybrid Bonding Without Vacuum and High Temperature for Cross-Cutting Applications2021
- Author(s)
  SHIGETOU Akitsu
- Organizer
  IEEE EPS/JIEP International Conference on Electronics Packaging
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Metasurface Quantum Well Photodetectors with Broadened Photoresponse Using Patchwork of Cavities within a Subwavelength Period2020
- Author(s)
  HAINEY JR., Mel Forrest, MANO, Takaaki, KASAYA, Takeshi, 神馬洋司, 宮嵜博司, OCHIAI, Tetsuyuki, OOSATO, Hirotaka, 渡邉一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, ARAI, Yukinaga, SHIGETOU, Akitsu, MIYAZAKI, Hideki
- Organizer
  Metamaterials'2020 - The 14th International Congress on Artificial Materials for Novel Wave Phenomena
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 機能複合化手法としての低温大気圧異種材料接合2020
- Author(s)
  重藤暁津
- Organizer
  スマートプロセス学会
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 位相同調アンテナを用いたメタ表面量子井戸赤外検出器2020
- Author(s)
  宮崎英樹, 間野高明, 笠谷岳士, 大里啓孝, 渡邉一弘, 杉本喜正, 川津琢也, 新井志大, 重藤暁津, 落合哲行, 神馬洋司, 宮嵜博司, ヘネジュニアメルフォレスト
- Organizer
  2020年第67回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Dual-band Metasurface Quantum Well Infrared Photodetectors for NO2 Sensing2020
- Author(s)
  HAINEY JR., Mel Forrest, MANO, Takaaki, KASAYA, Takeshi, OCHIAI, Tetsuyuki, OOSATO, Hirotaka, 渡邉一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, ARAI, Yukinaga, SHIGETOU, Akitsu, MIYAZAKI, Hideki
- Organizer
  2020年第81回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Morphology considerations for optimizing metasurface quantum well photodetector performance2020
- Author(s)
  HAINEY JR., Mel Forrest, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, 渡邉一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, ARAI, Yukinaga, SHIGETOU, Akitsu, OCHIAI, Tetsuyuki, 神馬洋司, 宮嵜博司, MIYAZAKI, Hideki
- Organizer
  2020年第67回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Hybrid Bonding in Ambient Atmosphere for Cross-Cutting Applications2020
- Author(s)
  SHIGETOU Akitsu
- Organizer
  2020 21st International Conference on Electronic Packaging Technology
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Printing of Flexible Electronics for Wearable Applications2019
- Author(s)
  MINARI, Takeo, LIU, Xu-Ying, SUN, Qingqing, LI, Wanli, SHIGETOU, Akitsu, 金原正幸
- Organizer
  2019 IEEE/JIEP International Conference on Electronics Packaging
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] IoTに向けた軽量ハイブリッドかつスマートな構造材料のための接合技術2019
- Author(s)
  重藤暁津
- Organizer
  (社)エレクトロニクス実装学会2019修善寺ワークショップ
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] A Single Process for Homogeneous and Heterogeneous Bonding in Flexible Electronics Ethanol-Assisted Vacuum Ultraviolet (E-VUV) Irradiation Process2019
- Author(s)
  T. H. Yang, C. Y. Yang, C. R. Kao, A. Shigetou
- Organizer
  2019 International Conference on Electronics Packaging (ICEP)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Hybrid Bonding in Ambient Atmosphere for 3D Integration2019
- Author(s)
  Akitsu Shigetou, Tilo Hong-Wei. Yang, Robert Kao
- Organizer
  The IEEE International 3D Systems Integration Conference (3DIC)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Low Temperature and Fluxless Bonding Process of Cu-In through VUV2019
- Author(s)
  Yu-Shan Chiu, SHIGETOU, Akitsu, Robert Kao
- Organizer
  2019 Taiwan-Japan Workshop on Electronic Interconnection
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Metasurface Quantum-well Infrared Photodetectors2019
- Author(s)
  MIYAZAKI, Hideki, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, 渡邉一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, OCHIAI, Tetsuyuki, ARAI, Yukinaga, SHIGETOU, Akitsu
- Organizer
  The Fourth A3 Metamaterials Forum
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 低温大気圧有機無機ハイブリッド接合に必要な極薄架橋構造の設計2019
- Author(s)
  重藤暁津, 楊弘偉, 高振宏
- Organizer
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Metamaterial quantum well infrared photodetectors based on plasmon-enhanced intersubband transition2019
- Author(s)
  MIYAZAKI, Hideki, MANO, Takaaki, KASAYA, Takeshi, OOSATO, Hirotaka, 渡邉一弘, SUGIMOTO, Yoshimasa, KAWAZU, Takuya, OCHIAI, Tetsuyuki, ARAI, Yukinaga, SHIGETOU, Akitsu
- Organizer
  The 7th International Workshop on Epitaxial Growth and Fundamental Properties of Semiconductor Nanostructures (SemiconNano2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 軽量ハイブリッドかつスマートな構造材料創製のための低温大気圧接合技術2019
- Author(s)
  重藤暁津
- Organizer
  （社）エレクトロニクス実装学会実装フェスタ関西
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Lead-free and Fluxless Indium Solder Bonding Process in Low Temperature through Vacuum ultraviolet (VUV)2019
- Author(s)
  Yu-Shan Chiu, Robert Kao, Akitsu Shigetou
- Organizer
  11th International Symposium on Environmentally Conscious Design and Inverse Manufacturing
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Inorganic-Organic Low Temperature Hybrid Bonding with Anti-Hydrolysis Interface2019
- Author(s)
  SHIGETOU, Akitsu
- Organizer
  The 20th International Conference on Electronic Packaging Technology (ICEPT)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] メタ表面量子井戸赤外線検出器2018
- Author(s)
  宮崎英樹ら計9名，重藤暁津は最終著者
- Organizer
  2018年第65回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] Low Temperature and Non-Vacuum Surface Modification for Robust Hybrid Bonding2018
- Author(s)
  SHIGETOU, Akitsu, Hongwei Yang, Robert Kao
- Organizer
  Solid State Devices and Materials
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 機能性材料創製のための低温大気圧接合技術 - 要素技術と将来展望 -2018
- Author(s)
  重藤暁津
- Organizer
  日本学術振興会153委員会プラズマ材料科学スクール
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] 高信頼性低温大気圧有機無機ハイブリッド接合2018
- Author(s)
  重藤暁津, 楊弘偉, Robert Kao
- Organizer
  マイクロエレクトロニクスシンポジウム（MES)
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] A New Hybrid Bonding Method for 3D Integration2017
- Author(s)
  Akitsu Shigetou
- Organizer
  日仏三次元集積回路の課題と今後の展開に関するワークショップ
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] A new hybrid bonding for 3D integration2017
- Author(s)
  A. Shigetou
- Organizer
  日仏工業会第2回日仏三次元集積回路の課題と今後の展開に関するワークショップ
- Place of Presentation
  日仏会館，東京
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 新しい機能性材料創製の”道具”としてのハイブリッド接合2017
- Author(s)
  重藤暁津
- Organizer
  東レ専門自主講座
- Invited
- Data Source
  KAKENHI-PROJECT-17H01275
[Presentation] ハイブリッド界面創製のための低温大気圧表面改質技術2016
- Author(s)
  重藤暁津
- Organizer
  日本溶接学会はんだ・微細接合部会シンポジウム
- Place of Presentation
  溶接会館，東京
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Low Temperature Bonding between Polyether Ether Ketone (PEEK) and Pt through Vapor Assisted VUV Surface Modification2016
- Author(s)
  W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
- Organizer
  IEEE Electronics components and technology conference (ECTC)
- Place of Presentation
  Elara Las Vegas, US
- Year and Date
  2016-05-31
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Low temperature direct bonding of PEEK and Pt through VUV/FAB surface treatments2016
- Author(s)
  W. Fu, A. Shigetou, S. Shoji , and J. Mizuno
- Organizer
  2016 International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  札幌市教育文化会館，札幌
- Year and Date
  2016-04-20
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 軽量スマート構造材料を指向したハイブリッド接合技術2016
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会機能性ハイブリッド材料公開研究会
- Place of Presentation
  回路会館，東京
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Low temperature direct bonding of polyether ether ketone (PEEK) and Pt2016
- Author(s)
  W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
- Organizer
  IEEE CPMT IMPACT 2016
- Place of Presentation
  南岸国際展示場，台湾
- Year and Date
  2016-10-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 高機能なハイブリッド界面創製のための低温大気圧表面改質技術2016
- Author(s)
  重藤暁津
- Organizer
  スマートプロセス学会　第13回電子デバイス実装研究会
- Place of Presentation
  日本橋ライフサイエンスビル，東京
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Non-vacuum low temperature hybrid bonding for lightweight and flexible electronics2016
- Author(s)
  A. Shigetou
- Organizer
  IEEE CPMT IMPACT 2016
- Place of Presentation
  南岸国際展示場，台湾
- Year and Date
  2016-10-26
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 生体親和性エレクトロニクス実装のための低温大気圧接合技術2016
- Author(s)
  重藤暁津，水野潤，庄子習一
- Organizer
  JIEP マイクロエレクトロニクスシンポジウム（MES）
- Place of Presentation
  中京大学，名古屋
- Year and Date
  2016-09-08
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 低温大気圧による有機無機材料ハイブリッド化2016
- Author(s)
  重藤暁津
- Organizer
  日本機械学会研究協力事業委員会所属分科会高密度エレクトロニクス実装技術委員会講演会
- Place of Presentation
  東京
- Year and Date
  2016-01-29
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] 低温大気圧による有機無機材料ハイブリッド化2016
- Author(s)
  重藤暁津
- Organizer
  日本機械学会研究協力事業委員会所属分科会高密度エレクトロニクス実装技術委員会講演会
- Place of Presentation
  東京理科大学，東京
- Year and Date
  2016-01-29
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch2015
- Author(s)
  M. Ohyama, M. Niura, J. Mizuno, S. Shoji, M. Tamura, and A. Shigetou
- Organizer
  Proc. IEEE Electronic Component and Technology Conference (ECTC)
- Place of Presentation
  San Diego, CA, USA
- Year and Date
  2015-05-27
- Int'l Joint Research
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Low temperature hybrid bonding at atmospheric pressure by using vacuum ultraviolet and vapor-assisted method2015
- Author(s)
  Akitsu Shigetou
- Organizer
  2015 National Taiwan University - National Institute for Materials Science Joint Workshop
- Place of Presentation
  National Taiwan University, Taipei, Taiwan
- Year and Date
  2015-09-10
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015
- Author(s)
  A. Shigetou, J. Mizuno, and S. Shoji
- Organizer
  IEEE Electronic Component and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego, San Diego, CA, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015
- Author(s)
  A. Shigetou, J. Mizuno, and S. Shoji
- Organizer
  EEE/CPMT International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  京都テルサ，京都
- Year and Date
  2015-04-14
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Low Temperature Direct Bonding of Polyether Ether Ketone (PEEK) and Pt2015
- Author(s)
  W. Fu, A. Shigetou, S. Shoji, and J. Mizuno
- Organizer
  10th International Microsystems, Packaging, Assembly and Circuits Technology Conference
- Place of Presentation
  Taipei World Trade Center, Taipei, Taiwan
- Year and Date
  2015-10-21
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Hybrid Bonding of Cu/Sn Microbump and Adhesive with Silica Filler for 3D Interconnection of Single Micron Pitch2015
- Author(s)
  M. Ohyama, M. Niura, J. Mizuno, S. Shoji, M. Tamura, and A. Shigetou
- Organizer
  IEEE Electronic Component and Technology Conference (ECTC)
- Place of Presentation
  Sheraton San Diego, San Diego, CA, USA
- Year and Date
  2015-05-26
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] パワーエレクトロニクス材料の低温大気圧ハイブリッド接合2015
- Author(s)
  重藤暁津
- Organizer
  NIMSフォーラム
- Place of Presentation
  東京国際フォーラム，東京
- Year and Date
  2015-10-07
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 低温大気圧接合による材料ハイブリッド化手法および装置2015
- Author(s)
  重藤暁津
- Organizer
  物質・材料研究機構　新技術説明会
- Place of Presentation
  JST東京本館別館,東京
- Year and Date
  2015-09-03
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015
- Author(s)
  A. Shigetou, J. Mizuno, and S. Shoji
- Organizer
  Proc. IEEE/CPMT International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  京都
- Year and Date
  2015-04-19
- Int'l Joint Research
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Vacuum Ultraviolet (VUV) and Vapor-Combined Surface Modification for Hybrid Bonding of SiC, GaN, and Si Substrates at Low Temperature2015
- Author(s)
  A. Shigetou, J. Mizuno, and S. Shoji
- Organizer
  Proc. IEEE Electronic Component and Technology Conference (ECTC)
- Place of Presentation
  San Diego, CA, USA
- Year and Date
  2015-05-28
- Int'l Joint Research
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] ハイブリッド材料創製のための低温大気圧接合手法2014
- Author(s)
  重藤暁津
- Organizer
  第二回NIMS-DENKA講演会
- Place of Presentation
  神奈川
- Year and Date
  2014-06-02
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Bonding technology in ambient air: For hybridization of electronic devices2014
- Author(s)
  重藤暁津
- Organizer
  機械学会　ワイドバンドギャップ半導体デバイスに関わる超精密加工プロセス研究会
- Place of Presentation
  ダブルツリーヒルトン沖縄，沖縄
- Year and Date
  2014-10-24
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] ハイブリッド材料創製のための低温大気圧接合手法2014
- Author(s)
  重藤暁津
- Organizer
  第二回 NIMS-DENKA講演会
- Place of Presentation
  デンカイノベーションセンター町田，神奈川
- Year and Date
  2014-06-02
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 水和物架橋低温接合技術の開発2014
- Author(s)
  重藤暁津
- Organizer
  革新的構造材料等技術開発プロジェクト
- Place of Presentation
  軽井沢，長野
- Year and Date
  2014-06-16
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 材料ハイブリッド化のツールとしての低温大気圧接合技術2014
- Author(s)
  重藤暁津
- Organizer
  応用物理学会　2014年度第5回TSV応用研究会
- Place of Presentation
  福岡システムＬＳＩ総合開発センター，福岡
- Year and Date
  2014-12-17
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 大気圧低温接合技術による異種材料ハイブリッド化の展望2013
- Author(s)
  重藤暁津
- Organizer
  独）日本学術振興会システムデザイン・インテグレーション第177委員会第28回研究会
- Place of Presentation
  学術振興会館，東京，日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure2013
- Author(s)
  A. Shigetou, A. Mano, and J. Mizuno
- Organizer
  IEEE CPMT International Conference on Electronics Packaging
- Place of Presentation
  大阪国際会議場，大阪，日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials2013
- Author(s)
  A. Shigetou
- Organizer
  IZM Workshop on Nanotechnology and Environmental Engineering
- Place of Presentation
  Berlin, Germany
- Year and Date
  2013-05-24
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 真空紫外光照射を利用した金属，樹脂基板の大気圧混載接合2013
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会春期講演大会
- Place of Presentation
  東北大学
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 大気圧低温接合技術による異種材料ハイブリッド化の展望2013
- Author(s)
  重藤暁津
- Organizer
  (独)日本学術振興会システムデザイン・インテグレーション第177委員会第28回研究会
- Place of Presentation
  東京
- Year and Date
  2013-06-18
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Graphene-graphene room temperature direct bonding by using VUV/vapor-assisted at atmospheric pressure2013
- Author(s)
  A. Mano, A. Shigetou, J. Mizuno, and S. Shoji
- Organizer
  IEEE WaferBond 2013
- Place of Presentation
  ストックホルム国立大学，Stockholm, Sweden
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合2013
- Author(s)
  重藤暁津
- Organizer
  社)エレクトロニクス実装学会2013ワークショップ
- Place of Presentation
  静岡
- Year and Date
  2013-10-18
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 有機・無機材料ハイブリッド化のための大気圧低温接合手法2013
- Author(s)
  重藤暁津
- Organizer
  日立研究所有機材料研究会
- Place of Presentation
  日立，茨城，日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 有機・無機材料ハイブリッド化のための大気圧低温接合手法2013
- Author(s)
  重藤暁津
- Organizer
  日立研究所有機材料研究会
- Place of Presentation
  東京
- Year and Date
  2013-09-27
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Room Temperature Bonding of Polymer/Polymer and Polymer/Glass using modified Surface Activation Bonding Method2013
- Author(s)
  T. Matsumae, M. Fujino, A. Shigetou et. al.
- Organizer
  IEEE CPMT ICEP 2013
- Place of Presentation
  大阪国際会議場，大阪，日本
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Hybrid Au-Au Bonding Technology using Planar Adhesive Structure for 3D Integration2013
- Author(s)
  M. Nimura, J. Mizuno, A. Shigetou et. al.
- Organizer
  IEEE CPMT ICEP 2013
- Place of Presentation
  大阪国際会議場，大阪，日本
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure2013
- Author(s)
  A. Shigetou, A Mano, J. Mizuno
- Organizer
  IEEE CPMT Symposium Japan
- Place of Presentation
  京都大学，京都，日本
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 大気圧低温で実行可能な異種材料混載接合手法2013
- Author(s)
  重藤暁津
- Organizer
  (社)エレクトロニクス実装学会第4回公開研究会部品内蔵基板の最新技術
- Place of Presentation
  東京
- Year and Date
  2013-02-14
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 大気圧低温で実行可能な異種材料混載接合手法2013
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会第４回公開研究会部品内蔵基板の最新技術
- Place of Presentation
  回路会館，東京
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 低温大気圧で実行可能な有機・無機混載材料創製のためのハイブリッド接合技術2013
- Author(s)
  重藤暁津
- Organizer
  科学研究費補助金新学術領域生物規範高額合同研究会
- Place of Presentation
  沖縄
- Year and Date
  2013-07-02
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合2013
- Author(s)
  重藤暁津
- Organizer
  社）エレクトロニクス実装学会2013ワークショップ
- Place of Presentation
  ラフォーレ修善寺，静岡，日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure2013
- Author(s)
  A. Shigetou
- Organizer
  IEEE CPMT International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  Tokyo, Japan
- Year and Date
  2013-04-13
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials2013
- Author(s)
  A. Shigetou
- Organizer
  IZM Workshop on Nanotechnology and Environmental Engineering
- Place of Presentation
  IZM Berlin, Germany
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] UV/Vapor-Assisted表面改質による透明有機/無機基板の低温大気圧接合2012
- Author(s)
  重藤暁津
- Organizer
  第196回有機エレクトロニクス材料研究会
- Place of Presentation
  早稲田大学
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure2012
- Author(s)
  Akitsu Shigetou
- Organizer
  45th International Symposium on Microelectronics
- Place of Presentation
  Town & Country Resort & Convention Center,San DIego,USA
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] UV/Vapor-Assisted Hybrid Bonding Technology as a Tool for Future Nanopackaging2012
- Author(s)
  Akitsu Shigetou
- Organizer
  IEEE NANO
- Place of Presentation
  International Convention Center,BIrmingham,UK
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Hybrid Bonding of Organic/Inorganic Substrates in Ambient Air for Eco-Friendly 3D Integration of Microelectronics2012
- Author(s)
  Akitsu Shigetou
- Organizer
  Electronics Goes Green 2012
- Place of Presentation
  Seminaris Dahlem Cube,Berlin,Germany
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero-integration2012
- Author(s)
  Akitsu Shigetou
- Organizer
  3rd IEEE International Workshop on LTB-3D
- Place of Presentation
  東京大学
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Vapor-Assisted Hybrid Bonding of Inorganic/Organic Substrates for 3D Hetero-Integration2012
- Author(s)
  A. Shigetou and T. Suga
- Organizer
  Proceedings of IEEE/CPMT 3^<rd> International Workshop on LTB-3D
- Place of Presentation
  Tokyo, Japan
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure2012
- Author(s)
  A. Shigetou
- Organizer
  Proceedings of IMAPS 45^<th> International Symposium on Microelectronics
- Place of Presentation
  San Diego, USA
- Year and Date
  2012-09-12
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Hybrid bonding in ambient air – a feasible tool for mixed integrations2012
- Author(s)
  Akitsu Shigetou
- Organizer
  IEEE CPMT Society Evening Meeting
- Place of Presentation
  東京工業大学
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Hybrid Bonding in Ambient Air–A Feasible Tool for Mixed Integrations2012
- Author(s)
  A. Shigetou
- Organizer
  IEEE/CPMT Society Evening Meeting, IEEE CPMT Japan Chapter
- Place of Presentation
  Tokyo, Japan
- Year and Date
  2012-10-12
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] UV/Vapor-Assisted表面改質による透明有機/無機基板の低温大気圧接合2012
- Author(s)
  重藤暁津
- Organizer
  第196回有機エレクトロニクス材料研究会,社団法人有機エレクトロニクス材料研究会
- Place of Presentation
  東京
- Year and Date
  2012-10-05
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 有機・無機基板混載のための接合技術2011
- Author(s)
  重藤暁津
- Organizer
  社団法人有機エレクトロニクス研究会,190回研究会3次元実装技術の最新情報～トレンド・最新技術・応用
- Place of Presentation
  東京
- Year and Date
  2011-10-14
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low Temperatures Hybrid Bonding in Ambient Air for Homo/Heterogeneous 3D Integration2011
- Author(s)
  A. Shigetou
- Organizer
  1st Fraunhofer IZM & NIMS workshop
- Place of Presentation
  Ibaraki, Japan
- Year and Date
  2011-11-15
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low-Temperature Homo/Hetero - geneous Bonding in Ambient Air for Future 3D-TSV2011
- Author(s)
  A. Shigetou
- Organizer
  SEMATECH Symposium Japan and ISMI Regional Meeting Series
- Place of Presentation
  Tokyo, Japan
- Year and Date
  2011-06-23
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low Temperatures Hybrid Bonding in Ambient Air for Homo/Heterogeneous 3D Integration2011
- Author(s)
  A. Shigetou
- Organizer
  1st LRSM–NIMS Materials Workshop
- Place of Presentation
  Ibaraki, Japan
- Year and Date
  2011-12-21
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 大気圧低温接合技術の系譜,原理,技術動向2011
- Author(s)
  重藤暁津
- Organizer
  東京エレクトロン九州合同研究会
- Place of Presentation
  熊本
- Year and Date
  2011-11-11
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Vapor-Assisted Surface Activation Bonding for Low-Temperature Hetero Integration in Ambient Air2011
- Author(s)
  Akitsu Shigetou
- Organizer
  2011 CMOS Emerging Technology Meeting
- Place of Presentation
  Hilton Resort,Whistler, British Colombia,Canada
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Vapor-Assisted Surface Activation Bonding for Low-Temperature Hetero Integration in Ambient Air2011
- Author(s)
  A. Shigetou
- Organizer
  CRC Press 2011 CMOS Emerging Technology Meeting
- Place of Presentation
  British Colombia, CA
- Year and Date
  2011-06-17
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Low-Temperature Homo/Heterogeneous Bonding in Ambient Air for Future 3D-TSV2011
- Author(s)
  Akitsu Shigetou
- Organizer
  SEMATECH Symposium Japan and ISMI Regional Meeting Series
- Place of Presentation
  東京コンファレンスセンター品川,東京,日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] 有機/無機基板混載のための接合技術2011
- Author(s)
  重藤暁津
- Organizer
  有機エレクトロニクス材料研究会
- Place of Presentation
  早稲田大学　研究開発センター,東京,日本
- Invited
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Homo/Heterogeneous Bonding of Cu, SiO2, and Polyimide by Low Temperature Vapor- Assisted Surface Activation Method2011
- Author(s)
  Akitsu Shigetou
- Organizer
  61st Electronic Components and Technology Conference (ECTC)
- Place of Presentation
  Walt Disney World Swan and Dolphin Resort,Lake Buena Vista, Florida,USA
- Data Source
  KAKENHI-PROJECT-23686057
[Presentation] Modified Diffusion Bonding for Both Cu and SiO2 at 150C in Ambient Air2010
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Organizer
  Proc.IEEE the 60th Electronic Components and Technology Conference (ECTC) 365-369
- Place of Presentation
  USA
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Modified Diffusion Bonding for Both Cu and SiO2 at 150C in Ambient Air for Bumpless Interconnect2010
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Organizer
  Proc.IEEE Electronics System Integration Technology Conferences (ESTC) 232-235
- Place of Presentation
  Germany
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Modified Diffusion Bonding for Both Cu and SiO2 at 150 C in Ambient Air2010
- Author(s)
  A.Shigetou, T.Suga
- Organizer
  IEEE 60^<th> Electronic Components and Technology conference (ECTC)
- Place of Presentation
  Las Vegas, USA
- Year and Date
  2010-06-03
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] ビーム照射に基づいた架橋形成による金属・絶縁体の低温大気圧一括接合2010
- Author(s)
  重藤暁津
- Organizer
  低温接合による3D集積化研究会 IEEE CPMT
- Place of Presentation
  東京
- Year and Date
  2010-09-06
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Low Temperature Bonding Technology in Ambient Air for 3D Hetero Integration of Mixed Substrates2010
- Author(s)
  A.Shigetou
- Organizer
  3rd Empa-WUT-NIMS Workshop
- Place of Presentation
  Zurich (Switzerland)
- Year and Date
  2010-09-08
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Modified Diffusion Bonding for Both Cu and SiO2 at 150C in Ambient Air for Bumpless Interconnect2010
- Author(s)
  A.Shigetou, T.Suga
- Organizer
  IEEE Electronics System Integration Technology Conferences (ESTC)
- Place of Presentation
  Berlin (Germany)
- Year and Date
  2010-09-14
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] ビーム照射に基づいた架橋形成による金属・絶縁体の低温大気圧一括接合2010
- Author(s)
  重藤暁津
- Organizer
  IEEE CPMTヘテロウエハ接合による3D集積化研究会
- Place of Presentation
  東京大学山上会館(東京)
- Year and Date
  2010-09-06
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Low Temperature Bonding Technology in Ambient Air for 3D Hetero Integration of Mixed Substrates2010
- Author(s)
  A.Shigetou
- Organizer
  3rd Empa-WUT-NIMS Workshop
- Place of Presentation
  Switzerland
- Year and Date
  2010-09-10
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Modified Diffusion Bond Process for Chemical Mechanical Polishing(CMP)-Cu at 150℃ in Ambient Air2009
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Organizer
  IEEE Electronic Components and Technology Conference(ECTC)
- Place of Presentation
  San Diego, CA, USA
- Year and Date
  2009-05-29
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Direct Interconnection of Chemical Mechanical Polishing(CMP)-Cu Thin Films at 150℃ in Ambient Air2009
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Organizer
  Europian Microelectronics and Packaging Conference(EMPC)2009
- Place of Presentation
  Rimini, Italy
- Year and Date
  2009-06-18
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Direct interconnection of chemical mechanical polishing (CMP)-Cu thin films at 150C in ambient air2009
- Author(s)
  Akitsu Shigetou, T.Suga
- Organizer
  Proc.IMAPS European Microelectronics and Packaging Conference 2009 Proceedings (EMPC) 1-5
- Place of Presentation
  Italy
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Modified Diffusion Bond Process for Chemical Mechanical Polishing (CMP)-Cu at 150C in Ambient Air2009
- Author(s)
  Akitsu Shigetou, Tadatomo Suga
- Organizer
  Proc. IEEE the ^<59th> Electronic Components and Technology Conference (ECTC) 365-369
- Place of Presentation
  USA
- Data Source
  KAKENHI-PROJECT-21760269
[Presentation] Room-Temperature Direct Bonding of Graphene Films by Means of Vacuum Ultraviolet (VUV) / Vapor-Assisted Method
- Author(s)
  Ajayan Mano, Akitsu Shigetou, Jun Mizuno, and Shuichi Shoji
- Organizer
  International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  富山国際会議場，富山
- Year and Date
  2014-04-23 – 2014-04-26
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Hybrid Bonding of Organic/Inorganic Substrates in Ambient Air for Eco-Friendly 3D Integration of Microelectronics
- Author(s)
  A.Shigetou
- Organizer
  Electronics Goes Green 2012
- Place of Presentation
  Dahlem Cube Seminaris Hotel, Berlin, Germany
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Vacuum Ultraviolet (VUV) / Vapor-Assisted Bonding for Organic / Inorganic Hybrid Integration
- Author(s)
  Akitsu Shigetou, Ajayan Mano, Jun Mizuno and Shoji Shuichi
- Organizer
  応用物理学会　Solid State Devices and Materials (SSDM)
- Place of Presentation
  つくばエポカル，茨城
- Year and Date
  2014-09-08 – 2014-09-10
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 大気圧低温で実行可能な異種材料混載接合手法
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会第４回公開研究会、部品内蔵基板の最新技術・招待講演
- Place of Presentation
  回路会館
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure
- Author(s)
  A. Shigetou
- Organizer
  IEEE CPMT International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Vapor-assisted bonding method as a tool for materials hybridization in future 3D integration
- Author(s)
  Akitsu Shigetou, Ajayan Mano, Jun Mizuno and Shoji Shuichi
- Organizer
  IUMRS-ICEM 2014
- Place of Presentation
  台湾国立大学，台湾
- Year and Date
  2014-06-11 – 2014-06-13
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] UV/Vapor-Assisted Hybrid Bonding Technology as a Tool for Future Nanopackaging
- Author(s)
  A.Shigetou
- Organizer
  IEEE NANO
- Place of Presentation
  International Convention Centre (ICC), Birmingham, UK
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] 気圧低温で実行可能な異種材料混載接合手法
- Author(s)
  重藤　暁津
- Organizer
  社）エレクトロニクス実装学会第4回公開研究会部品内蔵基板の最新技術
- Place of Presentation
  東京
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Hybrid bonding in ambient air – a feasible tool for mixed integrations
- Author(s)
  A.Shigetou
- Organizer
  Proc. IEEE CPMT Society Evening Meeting・招待講演
- Place of Presentation
  日本工業大学
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] SiCならびにGaNの低温大気圧
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会春季講演大会
- Place of Presentation
  東京大学，東京
- Year and Date
  2015-03-16 – 2015-03-18
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合
- Author(s)
  重藤　暁津
- Organizer
  社）エレクトロニクス実装学会2013ワークショップ
- Place of Presentation
  静岡
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] 大気圧低温接合技術による異種材料ハイブリッド化の展望
- Author(s)
  重藤　暁津
- Organizer
  （独）日本学術振興会システムデザイン・インテグレーション第177委員会第28回研究会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] 真空紫外光照射を利用した金属，樹脂基板の大気圧混載接合
- Author(s)
  重藤暁津
- Organizer
  エレクトロニクス実装学会春期講演大会
- Place of Presentation
  東北大学
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] UV/Vapor-Assisted表面改質による透明有機/無機基板の低温大気圧接合
- Author(s)
  重藤暁津
- Organizer
  第196回有機エレクトロニクス材料研究会
- Place of Presentation
  早稲田大学
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Fine-Pitch Hybrid Bonding with Cu/Sn Microbumps and Adhesive for High Density 3D Integration
- Author(s)
  Masaki Ohyama, Jun Mizuno, Syuichi Shoji, Masatsugu Nimura, Toshihisa Nonaka, Yoichi Shinba, and Akitsu Shigetou
- Organizer
  International Conference on Electronics Packaging (ICEP)
- Place of Presentation
  富山国際会議場，富山
- Year and Date
  2014-04-23 – 2014-04-26
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] 有機・無機材料ハイブリッド化のための大気圧低温接合手法
- Author(s)
  重藤　暁津
- Organizer
  日立研究所有機材料研究会
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials,
- Author(s)
  A.Shigetou
- Organizer
  IZM Workshop on Nanotechnology and Environmental Engineering
- Place of Presentation
  Berlin, Germany
- Invited
- Data Source
  KAKENHI-PLANNED-24120005
[Presentation] Low Temperature Hybrid Bonding at Atmospheric Pressure by Using Vacuum Ultraviolet (VUV) / Vapor-Assisted Method / Low Temperature Hybrid Bonding at Atmospheric Pressure by Using Vacuum Ultraviolet (VUV) / Vapor-Assisted Method
- Author(s)
  重藤暁津，細田奈麻絵，水野潤，庄子習一
- Organizer
  日本化学会第95春季年会
- Place of Presentation
  日本大学船橋，千葉
- Year and Date
  2015-03-26 – 2015-03-29
- Invited
- Data Source
  KAKENHI-PROJECT-26289112
[Presentation] Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure
- Author(s)
  A.Shigetou
- Organizer
  45th International Symposium on Microelectronics・招待講演
- Place of Presentation
  City Conference Center, San Diego, USA
- Invited
- Data Source
  KAKENHI-PLANNED-24120005

1. 水野潤 (60386737)

# of Collaborated Projects: 2 results

# of Collaborated Products: 20 results
2. Hosoda Naoe (50280954)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 前田浩孝 (20431538)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 穂積篤 (40357950)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. 浦田千尋 (40612180)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 松尾保孝 (90374652)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 和田健彦 (20220957)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. 北島博 (70353662)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. 居城邦治 (90221762)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
10. 庄子習一

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

SHIGETOU Akitsu 重藤 暁津

SHIGETO Akitsu 重藤 暁津

Research Projects

Research Products

Co-Researchers

Lightweight and Smart Hybrid Materials by Low Temperature Ambient BondingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Low Temperature and Non-Vacuum Bonding of Wide Bandgap Semiconductor Materials by VUV/Vapor-Assisted MethodPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Dynamics of biomimetic hierarchical structure

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Vapor-assisted hybrid bonding of organic/inorganic substrates at low temperature and atmospheric pressurePrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Development of Low Temperature Bonding Technology for Glass and Polymer Substrates in Ambient Air for Future Three-Dimensional MEMS PackagingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

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Research Institution

[Book] 溶接接合教室－特論編－「異種材料の低温大気圧接合」2020

Author(s)

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Data Source

[Book] 超親水・親油性表面の技術（第4章）2018

Author(s)

Total Pages

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ISBN

Data Source

[Book] 真空紫外光照射と極薄架橋形成による有機・無機材料の低温大気圧混載接合の要素技術（第４章 親水性表面の応用展開・活用事例）. 超親水・親油性表面の技術2018

Author(s)

Total Pages

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ISBN

Data Source

[Book] エレクトロニクス実装学会誌（特集記事：研究室訪問 国立研究開発法人物質・材料研究機構機能性材料研究拠点光機能分野プラズモニ クスグループ）2017

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Total Pages

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Data Source

[Book] ハイブリッド材料創製のツールとしての接合技術,"PEN NEWS LETTER 9月号web版2013

Author(s)

Data Source

[Book] ハイブリッド材料創製のツールとしての接合技術2013

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[Book] 3次元システムインパッケージと材料技術2012

Author(s)

Total Pages

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Data Source

[Book] 3次元SiPのためのバンプレスインタコネクト,"16章, 3次元システムインパッケージと材料技術2012

Author(s)

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Data Source

[Book] 3D Integration for VLSI Systems, in Chapter 10 "Surface modification bodning at low temperature for three-dimensional hetero integration(ISDN : 978-981-4303-82-8)2011

Author(s)

Total Pages

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Data Source

[Book] 3D Integration for VLSI Systems, Chapter 10 "SURFACE MODIFICATION BONDING AT LOW TEMPERATURE FOR THREE-DIMENSIONAL HETERO-INTEGRATION"2011

Author(s)

SHIGETOU Akitsu 重藤暁津

SHIGETO Akitsu 重藤暁津

[Book] 真空紫外光照射と極薄架橋形成による有機・無機材料の低温大気圧混載接合の要素技術（第４章親水性表面の応用展開・活用事例）. 超親水・親油性表面の技術2018

[Book] エレクトロニクス実装学会誌（特集記事：研究室訪問　国立研究開発法人物質・材料研究機構機能性材料研究拠点光機能分野プラズモニクスグループ）2017