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Fujino Masahisaa  藤野 真久

Researcher Number 70532274
Other IDs
  • ORCIDhttps://orcid.org/0000-0001-5281-846X
Affiliation (based on the past Project Information) *help 2023 – 2024: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
2016: 東京大学, 大学院工学系研究科(工学部), 助教
2016: 東京大学, 工学系研究科, 助教
2014 – 2015: 東京大学, 工学(系)研究科(研究院), 助教
Review Section/Research Field
Principal Investigator
Nanomaterials engineering
Except Principal Investigator
Basic Section 26030:Composite materials and interfaces-related / Composite materials/Surface and interface engineering
Keywords
Principal Investigator
カーボン材料 / 自己組織化単分子膜 / 転写 / グラフェン
Except Principal Investigator
ハイブリッド接合 / 原子層堆積 / チップレット / 酸化膜還元 / 銅直接接合 / ナノ密着層 … More / 表面活性化 / 集積化 / 接合 / 水素ラジカル / プラチナ触媒 / ぎ酸 / 実装 / 銅ー銅接合 / 活性化接合 / 還元 / 直接接合 / 接合界面 / 低温接合 / ギ酸 Less
  • Research Projects

    (3 results)
  • Research Products

    (12 results)
  • Co-Researchers

    (4 People)
  •  原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用

    • Principal Investigator
      井上 史大
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Yokohama National University
  •  Transferring Graphene to glass substrate using self-assembled monolayer and nano-adhesion layerPrincipal Investigator

    • Principal Investigator
      Fujino Masahisaa
    • Project Period (FY)
      2014 – 2016
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Nanomaterials engineering
    • Research Institution
      The University of Tokyo
  •  Development of Low Temperature Bonding Method by Formic Acid Treatment using Pt Catalyst

    • Principal Investigator
      Suga Tadatomo
    • Project Period (FY)
      2014 – 2016
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Composite materials/Surface and interface engineering
    • Research Institution
      The University of Tokyo

All 2017 2016 2015 Other

All Journal Article Presentation

  • [Journal Article] Room Temperature Bonding with Polymethylglutarimide using the Surface Activated Bonding method2017

    • Author(s)
      Takashi Matsumae, Masahisa Fujino and Tadatomo Suga
    • Journal Title

      ECS Journal of Solid State Science and Technology

      Volume: 印刷中

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Journal Article] Reduction reaction analysis of nanoparticle copper oxide for copper direct bonding using formic acid2017

    • Author(s)
      Masahisa Fujino, Masatake Akaike, Naoya Matsuoka, and Tadatomo Suga
    • Journal Title

      Japanese Journal of Applied Physics 56, 04CC01 (2017)

      Volume: 56 Issue: 4S Pages: 04CC01-04CC01

    • DOI

      10.7567/jjap.56.04cc01

    • NAID

      210000147553

    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Journal Article] Combined surface-activated bonding technique for low-temperature Cu/SiO2 hybrid bonding2015

    • Author(s)
      R. He, M. Fujino, A. Yamauchi, and T. Suga
    • Journal Title

      ECS Transactions

      Volume: 69 Issue: 6 Pages: 79-88

    • DOI

      10.1149/06906.0079ecst

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] 銅のギ酸還元反応に関する研究2016

    • Author(s)
      藤野真久、松岡直也、赤池正剛、佐藤健太、須賀唯知
    • Organizer
      エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京工業大学(東京都目黒区)
    • Year and Date
      2016-03-22
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] Large area direct transfer technique for graphene onto substrates using self-assembly monolayer2016

    • Author(s)
      Masahisa Fujino, Kentaro Abe, and Tadatomo Suga
    • Organizer
      2016 International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      札幌教育文化ホール, 北海道, 札幌市
    • Year and Date
      2016-04-22
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Presentation] 自己組織化単分子層を用いた透明基板への グラフェン直接転写2016

    • Author(s)
      安部健太郎、須賀唯知、 藤野真久
    • Organizer
      エレクトロニクス実装学会講演大会
    • Place of Presentation
      東京工業大学, 東京都, 目黒区
    • Year and Date
      2016-03-22
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Presentation] Large area direct transfer technique for graphene onto substrates using self-assembly monolayer2016

    • Author(s)
      Masahisa Fujino, Kentaro Abe, and Tadatomo Suga
    • Organizer
      International Conference on Electronics Packaging 2016
    • Place of Presentation
      札幌、札幌コンベンションセンター
    • Year and Date
      2016-04-20
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Presentation] Process parameters for formic acid treatment with Pt catalyst for Cu direct bonding2015

    • Author(s)
      N. Matsuoka, M. Fujino, M. Akaike, and T. Suga
    • Organizer
      ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
    • Place of Presentation
      Taipei(台湾)
    • Year and Date
      2015-10-21
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] ボイドフリー親水化接合のための拡張表面活性化接合プロセス

    • Author(s)
      Ran He, Masahisa Fujino, Akira Yamauch, Tadatomo Suga
    • Organizer
      第24回マイクロエレクトロニクスシンポジウム
    • Place of Presentation
      大阪大学、大阪府
    • Year and Date
      2014-09-04 – 2014-09-05
    • Data Source
      KAKENHI-PROJECT-26289247
  • [Presentation] 自己組織化単分子層を用いた透明基板への グラフェン直接転写に関する研究

    • Author(s)
      安部健太郎、藤野真久、須賀唯知
    • Organizer
      エレクトロニクス実装学会講演大会
    • Place of Presentation
      東京大学, 東京都
    • Year and Date
      2015-03-16 – 2015-03-18
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Presentation] Direct Transfer of Graphene onto Transparent Substrates with Self-Assembly Monolayer

    • Author(s)
      Masahisa Fujino, Kentaro Abe, Tadatomo Suga
    • Organizer
      International Conference on Electronics Packaging and iMAPS All Asia Conference
    • Place of Presentation
      京都テルサ, 京都府
    • Year and Date
      2015-04-14 – 2015-04-17
    • Data Source
      KAKENHI-PROJECT-26870161
  • [Presentation] Plasma Assisted Bonding of Bulk Copper and Silver Substrates

    • Author(s)
      Masahisa Fujino, Kentaro Abe, Tadatomo Suga
    • Organizer
      International Conferenceon Electronics Packaging  (ICEP2014)
    • Place of Presentation
      富山国際会議場、富山県
    • Year and Date
      2014-04-23 – 2014-04-25
    • Data Source
      KAKENHI-PROJECT-26289247
  • 1.  Suga Tadatomo (40175401)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 6 results
  • 2.  AKAIKW Masatake (50150959)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 3 results
  • 3.  井上 史大 (00908303)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 4.  多喜川 良 (80706846)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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