HIRASAWA Yoshio 平澤良男

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平沢良男

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Researcher Number	80115146
Other IDs
External Links
Affiliation (based on the past Project Information) *help	1997 – 1998: 富山大学, 工学部, 助教授 1986: 富山大学, 工学部, 助手
Review Section/Research Field	Except Principal Investigator Thermal engineering
Keywords	Except Principal Investigator Cu-Mo composite / Heat sink material / Thermal conductivity / Specific heat / Thermal diffusivity / Mechanical property / 熱伝導率 / 非定常熱線法 / 高熱伝導率材料 / 計測の自動化 … More / 測定法 / Termal expansion / Laminated Cu-Mo composite / Heat conductive material / Thermal expansion material / Termal diffusivity / Heat conduction material / Thermal expansioncoefficient / thermal expansion Less

Research Projects
(2 results)
Co-Researchers
(3 People)

The Trial Manufacture of Heat Sink Material Made with Cu-Mo Composite for Semiconductor Chip and A Study on Their Thermophysical Properties
- Principal Investigator
  
  TAKEGOSHI Eisyun
- Project Period (FY)
  1997 – 1998
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Thermal engineering
- Research Institution
  Toyama University
非定常熱線法による高熱伝導材料の熱伝導率測定に関する研究
- Principal Investigator
  
  TAKEGOSHI Eisyun
- Project Period (FY)
  1986
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  Thermal engineering
- Research Institution
  University of Toyama

1. TAKEGOSHI Eisyun (00019184)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
2. 井村定久 (50019147)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. KOSAKA Akio (20242480)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results