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Sato Chiaki  佐藤 千明

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SATO Chiaki  佐藤 千明

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Researcher Number 80235366
Other IDs
External Links
Affiliation (Current) 2025: 東京科学大学, 総合研究院, 教授
Affiliation (based on the past Project Information) *help 2016: 東京工業大学, 科学技術創成研究院, 准教授
2009 – 2015: Tokyo Institute of Technology, 精密工学研究所, 准教授
1998 – 2001: Associate Professor, Precision and Intelligence Laboratory, TOKYO INSTITUTE OF T, 精密工学研究所, 助教授
1999: 東工大, 精密工学研究所, 助教授
1998: 東京工業大学, 精密光学研究所, 助教授
1994 – 1997: 東京工業大学, 精密工学研究所, 助手
1995: 東京工業大学, 精密工業研究所, 助手
Review Section/Research Field
Principal Investigator
Materials/Mechanics of materials / Materials/Mechanics of materials
Except Principal Investigator
Materials/Mechanics of materials / 機械工作・生産工学 / 設計工学・機械要素・トライボロジー
Keywords
Principal Investigator
リサイクル / 接着 / エポキシ樹脂 / 打ち抜き試験 / Traction-Separation rul / 混合モード / DCB試験 / Traction-Separation rule / キャビテーション / Traction-Separation Rule … More / 結合力モデル / DCB試験 / 破壊じん性 / 多層粘着剤 / 熱膨張性マイクロカプセル / 解体性設計 / 膨張黒鉛 / 熱膨張マイクロカプセル / 発泡剤 / 接着剤 / 位相変調 / ピエゾミラー / 画像処理 / 微細部品 / 変形計測 / スペックル / 顕微鏡 / 光学 / 接着長さ / 強度クライテリオン / 2軸引張 / 接着接合 / 膜構造 / ポリイミド / 風船構造 … More
Except Principal Investigator
温度変化 / 粘弾性特性 / 内部応力 / 熱硬化性樹脂 / ステンレス鋼 / 低温 / 繰り返し変形 / 予変形 / 体積変化 / 硬化過程 / 相変化 / Curing process / Viscoelastic deformation / Internal stress / Constitutive relations / Phase transition / Thermosetting resin / 測定法 / 硬化条件 / 粘弾性変形 / 構成式 / Stainless steel / Prestrain / Cyclic deformation / Material testing / Liquid nitrogen / Low temperature / Plasticity / 材料試験 / 液体窒素 / 塑性 / 吸水性樹脂 / 光触媒 / 機械加工 / 微細部品 / チャック / 固定法 / 分離 / 接着 / 温度依存性 / 樹脂モデル / 収縮 / 硬化挙動 / 複合負荷 / 塑性変形 / 一体化微小マニピュレータ / マイクロ接着 / パンタグラフ機構 / マイクロハンドリングシステム / 弾性ヒンジ / 極微機械要素 / ロボット工学 / 機械運動学 Less
  • Research Projects

    (13 results)
  • Research Products

    (21 results)
  • Co-Researchers

    (4 People)
  •  Improvement of impact strength of joints bonded with multi-layered property-graded pressure sensitive adhesivePrincipal Investigator

    • Principal Investigator
      SATO CHIAKI
    • Project Period (FY)
      2014 – 2016
    • Research Category
      Grant-in-Aid for Challenging Exploratory Research
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  Application of Time Limited Adhesion by Electrically Dismantlable Adheisves for Separetable laminatesPrincipal Investigator

    • Principal Investigator
      SATO CHIAKI
    • Project Period (FY)
      2011 – 2013
    • Research Category
      Grant-in-Aid for Challenging Exploratory Research
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  Improvement of Interfacial Fracture Characteristics of Dismantlable Adhesive for Adherend Recycling by Controlling TackinessPrincipal Investigator

    • Principal Investigator
      SATO Chiaki
    • Project Period (FY)
      2009 – 2011
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  分離性接着剤を用いた超微細部品固定用治具に関する研究

    • Principal Investigator
      和田 選
    • Project Period (FY)
      2000 – 2001
    • Research Category
      Grant-in-Aid for Exploratory Research
    • Research Field
      機械工作・生産工学
    • Research Institution
      Tokyo Institute of Technology
  •  マイクロマテリアルの面内ひずみ計測用レーザースペックル顕微鏡の開発Principal Investigator

    • Principal Investigator
      佐藤 千明
    • Project Period (FY)
      2000 – 2001
    • Research Category
      Grant-in-Aid for Encouragement of Young Scientists (A)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  マイクロマテリアルの面内ひずみ計測用レーザスペックル顕微鏡の開発Principal Investigator

    • Principal Investigator
      佐藤 千明
    • Project Period (FY)
      1999
    • Research Category
      Grant-in-Aid for Encouragement of Young Scientists (A)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  Constitutive relations of thermosetting resin during curing process and their applications of estimating internal stresses

    • Principal Investigator
      IKEGAMI Kozo
    • Project Period (FY)
      1999 – 2000
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Denki University
      Tokyo Institute of Technology
  •  巨大風船構造の自動生成に関する研究Principal Investigator

    • Principal Investigator
      佐藤 千明
    • Project Period (FY)
      1997 – 1998
    • Research Category
      Grant-in-Aid for Encouragement of Young Scientists (A)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  Constitutive relations of cyclic plasticity at low temperature

    • Principal Investigator
      IKEGAMI Kozo
    • Project Period (FY)
      1997 – 1998
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      TOKYO INSTITUTE OF TECHNOLOGY
  •  樹脂硬化時の構成式の確立のプラスチックパッケージ健全性評価への応用

    • Principal Investigator
      池上 皓三
    • Project Period (FY)
      1996
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  極微機械要素ハンドリングシステムの試作研究

    • Principal Investigator
      堀江 三喜男
    • Project Period (FY)
      1995
    • Research Category
      Grant-in-Aid for Developmental Scientific Research (B)
    • Research Field
      設計工学・機械要素・トライボロジー
    • Research Institution
      Tokyo Institute of Technology
  •  低温繰返し塑性構成関係の実験的評価と構成式の提案

    • Principal Investigator
      池上 皓三
    • Project Period (FY)
      1995
    • Research Category
      Grant-in-Aid for General Scientific Research (C)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology
  •  電子デバイスのプラスチックパッケージ健全性評価法の確立

    • Principal Investigator
      IKEGAMI Kozo
    • Project Period (FY)
      1994
    • Research Category
      Grant-in-Aid for General Scientific Research (C)
    • Research Field
      Materials/Mechanics of materials
    • Research Institution
      Tokyo Institute of Technology

All 2015 2013 2012 2011 2010 2009 Other

All Journal Article Presentation Book

  • [Book] 工業材料2010

    • Author(s)
      佐藤千明, 他
    • Publisher
      日刊工業新聞社
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Book] 接着技術教本日本接着学会編2009

    • Author(s)
      佐藤千明, 他
    • Publisher
      日刊工業新聞社
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Journal Article]2010

    • Author(s)
      佐藤千明, 他
    • Journal Title

      工業材料 Vol.58, No.2(日刊工業新聞社) (分担)

      Pages: 33-36

    • Data Source
      KAKENHI-PROJECT-21360049
  • [Journal Article]2009

    • Author(s)
      佐藤千明, 他
    • Journal Title

      接着技術教本 日本接着学会 編(日刊工業新聞社) (分担)

      Pages: 227-283

    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Impact strength evaluation of joints bonded with multilayered pressure sensitive adhesives2015

    • Author(s)
      Chiaki Sato and Yu Sekiguchi
    • Organizer
      Brazil MRS Meeting 2015
    • Place of Presentation
      SulAmerica, Rio De Janeiro, Brazil
    • Year and Date
      2015-09-29
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-26630006
  • [Presentation] Separation Properties of joints bonded with electrically dismantlable adhesive2013

    • Author(s)
      C. Sato
    • Organizer
      2nd International Conference on Structural Adhesive Bonding
    • Place of Presentation
      Porto University, Porto, Portugal
    • Year and Date
      2013-07-04
    • Data Source
      KAKENHI-PROJECT-23656079
  • [Presentation] Separation Properties of joints bonded with electrically dismantlable adhesive2013

    • Author(s)
      Chiaki Sato
    • Organizer
      2nd International Conference on Structural Adhesive Bonding
    • Place of Presentation
      Porto, Portugal
    • Data Source
      KAKENHI-PROJECT-23656079
  • [Presentation] Properties of Resins for Adhesive in Hot-wet conditions2012

    • Author(s)
      Y. Kurata, C. Sato, K. Wakabayashi, S. Kondo and T. Aoki
    • Organizer
      ASMP 2012
    • Place of Presentation
      IIT Madoras, Chennai, India
    • Year and Date
      2012-08-20
    • Data Source
      KAKENHI-PROJECT-23656079
  • [Presentation] Mechanical Separation Properties of Electrically Dismantlable Adhesives2011

    • Author(s)
      C. Sato, H HSiote and M. Ohe
    • Organizer
      Adhesion 11
    • Place of Presentation
      York University, York, UK
    • Year and Date
      2011-09-08
    • Data Source
      KAKENHI-PROJECT-23656079
  • [Presentation] Finite Element Analysis of Stress Distribution in Cured Dismantlable Adhesive Including Thermally Expandable Microcapsules2011

    • Author(s)
      Yoshiaki Uratani, Tatsuya Obuchi and Chiaki Sato
    • Organizer
      AB2011 International Conference on Structural Adhesive Joining
    • Place of Presentation
      Porto/Portugal
    • Year and Date
      2011-07-07
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Mechanical and Separation Properties of Electrically Dismantlable Adhesives2011

    • Author(s)
      Chiaki Sato, Hidenao SHIOTE, Manabu OHE
    • Organizer
      Adhesion'11
    • Place of Presentation
      National Science Learning Centre, University of York, York, UK
    • Data Source
      KAKENHI-PROJECT-23656079
  • [Presentation] Stress Distribution in Dismantlable Adhesives Including Thermally Expandable Microcapsules2010

    • Author(s)
      Yoshiaki Uratani, Chiaki Sato
    • Organizer
      ACE-X 2010
    • Place of Presentation
      Paris/France
    • Year and Date
      2010-07-09
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Stress Distribution in Dismantlable Adhesives Including Thermally Expandable Microcapsules2010

    • Author(s)
      Yoshiaki Uratani, Chiaki Sato
    • Organizer
      ACE-X 2010
    • Place of Presentation
      Paris, France
    • Year and Date
      2010-07-09
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] DEBONDING PROCESS OF DISMANTLABLEADHESIVE INCLUDING THERMALLYEXPANDABLE MICROCAPSULES2010

    • Author(s)
      Chiaki Sato, Yoshiaki Uratani
    • Organizer
      WCARP IV
    • Place of Presentation
      Arcachon/France
    • Year and Date
      2010-09-29
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] 熱膨張性マイクロカプセル混入接着剤に生じる残留応力の有限要素解析2010

    • Author(s)
      浦谷佳明,佐藤千明
    • Organizer
      日本機械学会2010年度年次大会
    • Place of Presentation
      名古屋工業大学
    • Year and Date
      2010-09-07
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] DEBONDING PROCESS OF DISMANTLABLE ADHESIVE INCLUDING THERMALLY EXPANDABLE MICROCAPSULES2010

    • Author(s)
      Chiaki Sato, Yoshiaki Uratani
    • Organizer
      WCARP IV
    • Place of Presentation
      Arcachon, France
    • Year and Date
      2010-09-29
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Creep Strength Prediction of CFRP Lap Joints Bonded Adhesively2009

    • Author(s)
      Chiaki Sato
    • Organizer
      ACE-X 2009
    • Place of Presentation
      Rome, Italy
    • Year and Date
      2009-06-22
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Creep Strength Prediction of CFRP Lap Joints Bonded Adhesively2009

    • Author(s)
      Chiaki Sato
    • Organizer
      ACE-X 2009
    • Place of Presentation
      Rome/Italy
    • Year and Date
      2009-06-22
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Recent Progress of Dismantlable Adhesives2009

    • Author(s)
      Chiaki Sato
    • Organizer
      The 3^<rd> Asian Conference on Adhesion (招待)
    • Place of Presentation
      Hamamatsu, Japan
    • Year and Date
      2009-06-08
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Recent Progress of Dismantlable Adhesives2009

    • Author(s)
      Chiaki Sato
    • Organizer
      The 3^<rd> Asian Conference on Adhesion
    • Place of Presentation
      Hamamatsu/Japan
    • Year and Date
      2009-06-08
    • Data Source
      KAKENHI-PROJECT-21360049
  • [Presentation] Properties of Resins for Adhesive in Hot-wet conditions

    • Author(s)
      Y. Kurata, C. Sato, K. Wakabayashi, S. Kondo, T. Aoki
    • Organizer
      ASMP 2012
    • Place of Presentation
      IIT Madoras, Chennai, India
    • Data Source
      KAKENHI-PROJECT-23656079
  • 1.  IKEGAMI Kozo (40016788)
    # of Collaborated Projects: 6 results
    # of Collaborated Products: 0 results
  • 2.  HORIE Mikio (00126327)
    # of Collaborated Projects: 5 results
    # of Collaborated Products: 0 results
  • 3.  和田 選 (90301176)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 4.  北條 春夫 (40108238)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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