Kurokawa Atsushi 黒川敦

Researcher Number	80610592
Other IDs
Affiliation (Current)	2025: 弘前大学, 理工学研究科, 教授
Affiliation (based on the past Project Information) *help	2022 – 2024: 弘前大学, 理工学研究科, 教授 2014 – 2019: 弘前大学, 理工学研究科, 教授
Review Section/Research Field	Principal Investigator Computer system / Basic Section 21010:Power engineering-related
Keywords	Principal Investigator 電源分配 / 熱解析 / クロック分配 / 貫通シリコンビア / 三次元集積回路 / AI / 小型電子機器 / 無線給電 / 低消費電力・高エネルギー密度 / 熱工学 … More / 冷却技術 / ウェアラブルデバイス / 配線容量 / 電源設計 / 熱設計 / 容量抽出 Less

AIを活用した小型電子機器の近傍界無線給電技術の開発Principal Investigator
- Principal Investigator
  
  黒川敦
- Project Period (FY)
  2022 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21010:Power engineering-related
- Research Institution
  Hirosaki University
Development of thermal design techniques for 2.5D and 3D integrated circuitsPrincipal Investigator
- Principal Investigator
  
  Kurokawa Atsushi
- Project Period (FY)
  2017 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Computer system
- Research Institution
  Hirosaki University
A Study on Physical Interconnect Design in 3D ICs Using Through Silicon ViasPrincipal Investigator
- Principal Investigator
  
  Kurokawa Atsushi
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Computer system
- Research Institution
  Hirosaki University

All 2024 2023 2022 2020 2019 2018 2017 2016 2015 2014

All Journal Article Presentation

[Journal Article] Compensation capacitance tunings of wireless power transfer systems using artificial neural network2024
- Author(s)
  Sato Kai、Hachiya Koutaro、Kanamoto Toshiki、Kurokawa Atsushi
- Journal Title
  
  IEICE Communications Express
  
  Volume: 13 Issue: 3 Pages: 88-92
- DOI
  10.23919/comex.2023XBL0165
- ISSN
  2187-0136
- Year and Date
  2024-03-01
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K22730
[Journal Article] A parabolic spiral coil transmitter with uniform magnetic field for smart devices2023
- Author(s)
  Kudo Ryotaro、Hachiya Koutaro、Kanamoto Toshiki、Kurokawa Atsushi
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 20 Issue: 1 Pages: 20220492-20220492
- DOI
  10.1587/elex.19.20220492
- ISSN
  1349-2543
- Year and Date
  2023-01-10
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K22730
[Journal Article] Bayesian neural network based inductance calculations of wireless power transfer systems2023
- Author(s)
  Sato Kai、Kanamoto Toshiki、Kudo Ryotaro、Hachiya Koutaro、Kurokawa Atsushi
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 20 Issue: 5 Pages: 20230030-20230030
- DOI
  10.1587/elex.20.20230030
- ISSN
  1349-2543
- Year and Date
  2023-03-10
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K22730
[Journal Article] A bernoulli spiral coil transmitter for charging various small electronic devices2022
- Author(s)
  Kudo Ryotaro、Hachiya Koutaro、Kanamoto Toshiki、Kurokawa Atsushi
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 19 Issue: 23 Pages: 20220419-20220419
- DOI
  10.1587/elex.19.20220419
- ISSN
  1349-2543
- Year and Date
  2022-12-10
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K22730
[Journal Article] Thermal placement on PCB of components including 3D ICs2020
- Author(s)
  Yuuta Satomi, Koutaro Hachiya, Toshiki Kanamoto, Ryosuke Watanabe, and Atsushi Kurokawa
- Journal Title
  
  IEICE Electron. Express
  
  Volume: 17 Issue: 3 Pages: 20190737-20190737
- DOI
  10.1587/elex.17.20190737
- NAID
  130007796215
- ISSN
  1349-2543
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17K00070
[Journal Article] Thermal model and countermeasures for future smart glasses2020
- Author(s)
  Kodai Matsuhashi, Toshiki Kanamoto, and Atsushi Kurokawa
- Journal Title
  
  Sensors
  
  Volume: 20 Issue: 5 Pages: 1-20
- DOI
  10.3390/s20051446
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K00070
[Journal Article] Signal Propagation Delay Model in Vertically Stacked Chips2015
- Author(s)
  Nanako Niioka, Masayuki Watanabe, Masaaki Fukase, Masashi Imai, and Atsushi Kurokawa
- Journal Title
  
  IEICE Trans. Fundamentals
  
  Volume: E98.A Issue: 12 Pages: 2614-2624
- DOI
  10.1587/transfun.E98.A.2614
- NAID
  130005111976
- ISSN
  0916-8508, 1745-1337
- Language
  English
- Peer Reviewed / Acknowledgement Compliant / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26330057
[Journal Article] インダクタンス逆行列を用いた三次元集積回路の貫通シリコンビア間結合容量抽出2015
- Author(s)
  小林徹哉, 新岡七奈子, 深瀬政秋, 黒川敦
- Journal Title
  
  電気学会論文誌C
  
  Volume: ?
- NAID
  130005086250
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] 電流制限抵抗を用いたワイヤレス給電コイルの発熱の抑制2024
- Author(s)
  一戸啓治, 黒川敦
- Organizer
  電子情報通信学会総合大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] Transmitting coil for uniform magnetic flux density2024
- Author(s)
  Tatsumu Mitsuhashi, Toshiki Kanamoto, Koutaro Hachiya, Atsushi Kurokawa
- Organizer
  the Workshop on Synthesis And System Integration of Mixed Information technologies (SASIMI)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] Optimal inner diameter of single-layer planar spiral coils2024
- Author(s)
  Kotaro Terada, Koutaro Hachiya, Toshiki Kanamoto, Atsushi Kurokawa
- Organizer
  the Workshop on Synthesis And System Integration of Mixed Information technologies (SASIMI)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] 小型電子機器のワイヤレス充電用受電コイルの薄型化に関する検討2024
- Author(s)
  三ツ橋多紡, 黒川敦
- Organizer
  電子情報通信学会総合大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] 電界結合型電力伝送システムにおける各カプラ構造による特性2024
- Author(s)
  山本周, 黒川敦
- Organizer
  電子情報通信学会総合大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] 均一磁場を備えた放物螺旋コイルの送電機2023
- Author(s)
  工藤遼太朗, 佐藤快, 黒川敦
- Organizer
  情報処理学会東北支部研究会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] ワイヤレス充電用送電コイルの磁束密度均一化2023
- Author(s)
  三ツ橋多紡，黒川敦
- Organizer
  電気関係学会東北支部連合大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] 位置ずれを考慮したワイヤレス給電用の送電コイル径の検討2023
- Author(s)
  小芝宏樹，黒川敦
- Organizer
  電気学会電子・情報・システム部門大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] BNNに基づいたWPTシステムのインダクタンス計算2023
- Author(s)
  佐藤快, 工藤遼太朗, 黒川敦
- Organizer
  情報処理学会東北支部研究会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] ワイヤレス充電における受電側コイルセンサーを用いた位置検知2023
- Author(s)
  大亦生悟，黒川敦
- Organizer
  電気関係学会東北支部連合大会
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] Deep neural network based inductance calculations of wireless power transfer systems2022
- Author(s)
  Kai Sato, Toshiki Kanamoto, Ryotaro Kudo, Koutaro Hachiya, Atsushi Kurokawa
- Organizer
  the IEEE Global Conference on Consumer Electronics (GCCE)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] A parabolic spiral coil transmitter for charging multiple receivers2022
- Author(s)
  Ryotaro Kudo, Koutaro Hachiya, Toshiki Kanamoto, Atsushi Kurokawa
- Organizer
  the IEEE Global Conference on Consumer Electronics (GCCE)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] Heating of foreign object in inductive wireless charging2022
- Author(s)
  Issei Sato, Ryotaro Kudo, Toshiki Kanamoto, Koutaro Hachiya, Shinsuke Kashiwazaki, and Atsushi Kurokawa
- Organizer
  the Workshop on Synthesis And System Integration of Mixed Information technologies (SASIMI)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K22730
[Presentation] 機械学習を用いたLSIオンチップ配線容量抽出2019
- Author(s)
  葛西亮介, 黒川敦
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] メガネ型ウェアラブルデバイスの熱解析2019
- Author(s)
  松橋功大, 黒川敦
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Thermal placement optimization of packages with stacked chips2019
- Author(s)
  Yuuta Satomi, Koutaro Hachiya, and Atsushi Kurokawa
- Organizer
  TJCAS
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Thermal countermeasures of glass wearable devices2019
- Author(s)
  Kodai Matsuhashi and Atsushi Kurokawa
- Organizer
  IEEE International Conference on Consumer Electronics - Taiwan
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Thermal resistance model and analysis for future smart glasses2019
- Author(s)
  Kodai Matsuhashi, Toshiki Kanamoto, and Atsushi Kurokawa
- Organizer
  IEEE IMPACT
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Neural network-based 3D IC interconnect capacitance extraction2019
- Author(s)
  Ryosuke Kasai, Koutaro Hachiya, Toshiki Kanamoto, Masashi Imai, and Atsushi Kurokawa
- Organizer
  International Conference on Communication Engineering and Technology
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] リストウェアラブルデバイスのベルト放熱効果2019
- Author(s)
  岡本慎太郎, 松橋功大, 今井雅, 金本俊幾, 黒川敦
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Thermal modeling and simulation of a smart wrist-worn wearable device2019
- Author(s)
  Kodai Matsuhashi, Koutaro Hachiya, Toshiki Kanamoto, Masashi Imai, and Atsushi Kurokawa
- Organizer
  SASIMI
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] モバイル機器向け３D-ICの放熱促進方法2018
- Author(s)
  松橋功大，古見薫，今井雅，岡本慎太郎，金本俊幾，里見優太，黒川敦
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Impact of distributing 3D stacked ICs on maximum temperature reduction2018
- Author(s)
  Kaoru Furumi, Shintaro Okamoto, Toshiki Kanamoto, Masashi Imai, and Atsushi Kurokawa
- Organizer
  the Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Optimization of full-chip power distribution networks in 3D ICs2018
- Author(s)
  Yuuta Satomi, Koutaro Hachiya, Toshiki Kanamoto, and Atsushi Kurokawa
- Organizer
  International Conference on Integrated Circuits and Microsystems
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Power delivery network optimization of 3D ICs using multi-objective genetic algorithm2018
- Author(s)
  Yuuta Satomi, Koutaro Hachiya, Masashi Imai, Toshiki Kanamoto, Kaoru Furumi, and Atsushi Kurokawa
- Organizer
  the Workshop on Synthesis And System Integration of Mixed Information Technologies (SASIMI)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Thermal management for future wrist wearable devices2018
- Author(s)
  Koudai Matsuhashi and Atsushi Kurokawa
- Organizer
  International Conference on Integrated Circuits and Microsystems
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] 数百層積層メモリにおける各パラメータの温度への影響2017
- Author(s)
  岡本慎太郎, 黒川敦
- Organizer
  情報処理学会東北支部研究会
- Place of Presentation
  弘前大学
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Thermal-aware tile-based block placement for 3D ICs2017
- Author(s)
  Ryosuke Hatsuta, Masashi Imai, Toshiki Kanamoto, Shintaro Okamoto, and Atsushi Kurokawa
- Organizer
  Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Reducing temperature by relocating 3D IC structures2017
- Author(s)
  Kaoru Furumi, Shintaro Okamoto, Toshiki Kanamoto, Masashi Imai, and Atsushi Kurokawa
- Organizer
  Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Cooling architectures using thermal sidewalls, interchip plates, and bottom plate for 3D ICs2017
- Author(s)
  Kaoru Furumi, Masashi Imai, and Atsushi Kurokawa
- Organizer
  Proc. of the International Symposium on Quality Electronic Design
- Place of Presentation
  Santa Clara Convention Center, CA, USA
- Year and Date
  2017-03-14
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Optimizing power distribution network using multi-objective genetic algorithm2017
- Author(s)
  Yuuta Satomi, Masashi Imai, Toshiki Kanamoto, Kaoru Furumi, and Atsushi Kurokawa
- Organizer
  Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Modeling and analysis for predicting clock skew of stacked chips2017
- Author(s)
  Seira Kamiie, Toshiki Kanamoto, Masashi Imai, Shintaro Okamoto, and Atsushi Kurokawa
- Organizer
  Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] Method for mitigating heat of 3D stacked memory for small electronic devices2017
- Author(s)
  Shintaro Okamoto, Kaoru Furumi, Masashi Imai, Toshiki Kanamoto, and Atsushi Kurokawa
- Organizer
  Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Data Source
  KAKENHI-PROJECT-17K00070
[Presentation] TSVベース3D-ICの垂直方向配線間結合容量の効率的な抽出方法2016
- Author(s)
  小林徹哉, 新岡七奈子, 古見薫, 黒川敦
- Organizer
  情報処理学会東北支部研究会
- Place of Presentation
  青森県弘前市（弘前大学）
- Year and Date
  2016-02-19
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] チップ外周熱伝導壁による三次元集積回路の温度低減2016
- Author(s)
  古見薫, 新岡七奈子, 岡本慎太郎, 今井雅, 黒川敦
- Organizer
  電子情報通信学会ソサエティ大会
- Place of Presentation
  北海道大学
- Year and Date
  2016-09-20
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] 積層チップの電源分配のモデリングと電圧降下の解析2016
- Author(s)
  古見薫, 深瀬政秋, 新岡七奈子, 黒川敦
- Organizer
  電子情報通信学会総合大会
- Place of Presentation
  福岡県福岡市（九州大学伊都キャンパス）
- Year and Date
  2016-03-16
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] マルチソースバッファを用いた積層チップのクロック分配方法2016
- Author(s)
  新岡七奈子, 今井雅, 古見薫, 黒川敦
- Organizer
  電子情報通信学会 VLSI設計技術研究会
- Place of Presentation
  青森県弘前市（弘前市立観光館）
- Year and Date
  2016-06-16
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] 三次元集積回路の熱解析2016
- Author(s)
  古見薫, 今井雅, 新岡七奈子, 黒川敦
- Organizer
  電子情報通信学会 VLSI設計技術研究会
- Place of Presentation
  青森県弘前市（弘前市立観光館）
- Year and Date
  2016-06-16
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] 3次元積層チップの熱解析と温度上昇抑制方法2016
- Author(s)
  古見薫, 新岡七奈子, 黒川敦
- Organizer
  情報処理学会東北支部研究会
- Place of Presentation
  青森県弘前市（弘前大学）
- Year and Date
  2016-02-19
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] ウィンドウベースL 逆行列によるTSV 間容量抽出2015
- Author(s)
  小林徹哉, 今井雅, 深瀬政秋, 新岡七奈子, 黒川敦
- Organizer
  電子情報通信学会総合大会講演論文集
- Place of Presentation
  滋賀県草津市（立命館大学）
- Year and Date
  2015-03-13
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Thermal analysis with varying physical parameters in 3D ICs2015
- Author(s)
  Kaoru Furumi, Masa-aki Fukase, Masashi Imai, Yuuki Miura, Nanako Niioka, and Atsushi Kurokawa
- Organizer
  電気学会電子・情報・システム部門大会
- Place of Presentation
  長崎県長崎市（長崎大学）
- Year and Date
  2015-08-26
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] 三次元集積回路の伝搬遅延とクロストークノイズのモデリング2015
- Author(s)
  新岡七奈子, 深瀬政秋, 今井雅, 古見薫, 三浦祐輝, 黒川敦
- Organizer
  電子情報通信学会回路とシステムワークショップ
- Place of Presentation
  兵庫県淡路市（淡路夢舞台国際会議場）
- Year and Date
  2015-08-03
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] An effective model for evaluating vertical propagation delay in TSV-based 3-D ICs2015
- Author(s)
  Masayuki Watanabe, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, Masa-aki Fukase, Masashi Imai, and Atsushi Kurokawa
- Organizer
  Proc. of the International Symposium on Quality Electronic Design (ISQED)
- Place of Presentation
  サンタクララ、CA、USA
- Year and Date
  2015-03-04
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Clock skew reduction for stacked chips using multiple source buffers2015
- Author(s)
  Nanako Niioka, Masashi Imai, Masa-aki Fukase, Yuuki Miura, Kaoru Furumi, and Atsushi Kurokawa
- Organizer
  IEEE International Symposium on Communications and Information Technologies (ISCIT)
- Place of Presentation
  奈良県奈良市（奈良県新公会堂）
- Year and Date
  2015-10-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Effect of substrate contacts on reducing crosstalk noise between TSVs2014
- Author(s)
  Masayuki Watanabe, Rosely Karel, Nanako Niioka, Tetsuya Kobayashi, Masa-aki Fukase, Masashi Imai, and Atsushi Kurokawa
- Organizer
  Proc. of the IEEE Asia Pacific Conference on Circuit and Systems (APCCAS)
- Place of Presentation
  沖縄県石垣市
- Year and Date
  2014-11-20
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Modeling and analysis of vertical interconnects in 3D ICs2014
- Author(s)
  Nanako Niioka, Masashi Imai, Masa-aki Fukase, Rosely Karel, Tetsuya Kobayashi, and Atsushi Kurokawa
- Organizer
  Proc. Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Place of Presentation
  山形県米沢市(山形大学)
- Year and Date
  2014-08-21
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Impact of on-chip interconnects on vertical signal propagation in 3D ICs2014
- Author(s)
  Nanako Niioka, Masayuki Watanabe, Rosely Karel, Tetsuya Kobayashi, Masashi Imai, Masa-aki Fukase, and Atsushi Kurokawa
- Organizer
  Proc. of the IEEE Asia Pacific Conference on Circuit and Systems (APCCAS)
- Place of Presentation
  沖縄県石垣市
- Year and Date
  2014-11-19
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] インダクタンス逆行列を用いた三次元集積回路の貫通シリコンビア間結合容量抽出2014
- Author(s)
  小林徹哉，新岡七奈子，深瀬政秋，黒川敦
- Organizer
  電気学会電子・情報・システム部門大会講演論文集
- Place of Presentation
  島根県松江市（島根大学）
- Year and Date
  2014-09-03
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Modeling of substrate contacts in TSV-based 3D ICs2014
- Author(s)
  Masayuki Watanabe, Masa-aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, Rosely Karel, and Atsushi Kurokawa
- Organizer
  Proc. of the IEEE International Conference on 3D System Integration (3DIC)
- Place of Presentation
  キンセール、アイルランド
- Year and Date
  2014-12-01
- Data Source
  KAKENHI-PROJECT-26330057
[Presentation] Substrate contact effect on TSV-to-TSV coupling2014
- Author(s)
  Rosely Karel, Masa-aki Fukase, Masashi Imai, Nanako Niioka, Tetsuya Kobayashi, and Atsushi Kurokawa
- Organizer
  Proc. Tohoku-Section Joint Convention of Institutes of Electrical and Information Engineers (IEEE Student Session)
- Place of Presentation
  山形県米沢市(山形大学)
- Year and Date
  2014-08-21
- Data Source
  KAKENHI-PROJECT-26330057

1. 金本俊幾 (30782750)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
2. 蜂屋孝太郎 (40540381)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results

Kurokawa Atsushi 黒川 敦

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AIを活用した小型電子機器の近傍界無線給電技術の開発Principal Investigator

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Development of thermal design techniques for 2.5D and 3D integrated circuitsPrincipal Investigator

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A Study on Physical Interconnect Design in 3D ICs Using Through Silicon ViasPrincipal Investigator

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[Journal Article] Compensation capacitance tunings of wireless power transfer systems using artificial neural network2024

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[Journal Article] A parabolic spiral coil transmitter with uniform magnetic field for smart devices2023

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[Journal Article] Bayesian neural network based inductance calculations of wireless power transfer systems2023

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[Journal Article] A bernoulli spiral coil transmitter for charging various small electronic devices2022

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[Journal Article] Thermal placement on PCB of components including 3D ICs2020

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[Journal Article] Thermal model and countermeasures for future smart glasses2020

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[Journal Article] Signal Propagation Delay Model in Vertically Stacked Chips2015

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[Journal Article] インダクタンス逆行列を用いた三次元集積回路の貫通シリコンビア間結合容量抽出2015

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Kurokawa Atsushi 黒川敦