Takigawa Ryo 多喜川良

Researcher Number	80706846
Other IDs
Affiliation (Current)	2025: 九州大学, システム情報科学研究院, 准教授
Affiliation (based on the past Project Information) *help	2020 – 2025: 九州大学, システム情報科学研究院, 准教授 2021: 九州大学, システム情報科学研究科(研究院, 准教授 2016 – 2019: 九州大学, システム情報科学研究院, 助教 2015: 九州大学, システム情報科学研究科(研究院, 助教
Review Section/Research Field	Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Basic Section 21060:Electron device and electronic equipment-related / Electron device/Electronic equipment Except Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields / Basic Section 26030:Composite materials and interfaces-related
Keywords	Principal Investigator 光実装・集積 / ハイブリッドボンディング / 大気低温接合 / 常温接合 / ヘテロジニアス集積・実装 / 計算材料科学 / 光電融合 / 活性透明膜形成 / 活性化薄膜形成 / 低温集積技術 … More / 絶縁接合界面 / ハイブリッド接合 / 高機能接合界面 / 透明接合界面 / LNOI/Si光変調器 / 薄膜LNOI/Si光変調器 / 半導体ウエハ接合 / 大口径LNOI/Siウエハ / 低駆動電圧LNOI/Si光変調器 / LNOI光変調器 / 電気光学デバイス / 集積フォトニクス / 透明性接合界面 / 低温接合 / 大気中常温実装 / 異種材料集積化 / 表面活性化原子拡散接合 / 光素子実装・集積 / 大気開放・局所活性化雰囲気 / 簡便な常温接合 / 金属薄膜接合 / 金属極薄膜接合 / 大気中微細加工・接合 / ナノ切削加工 / 光マイクロシステム / 大気中接合・加工 / 常温移載接合 / ハイブリッド光導波路型デバイス / 強誘電体/半導体融合デバイス / 小型・低消費電力光デバイス / LiNbO3/Si集積化 / 切削導波路加工 / LN/Siフォトニクス / ハイブリッド光導波路 / 光実装 / LNOI/Siハイブリッド構造 / LNOIリング共振器 / LNOI光集積回路 / LN/Siハイブリッド構造 / 異種材料集積 / LNOI / 導波路切削加工 / 異種材料接合 / 光導波路 / 大気中異種材料接合 / 強い光閉じ込め導波路 / 切削加工 / 大気中異種材料低温接合 / ナノ・マイクロ加工 / 低損失光導波路 … More Except Principal Investigator フォトダイオード / フォトミキサ / テラヘルツ波 / 光集積デバイス / 原子層堆積 / チップレット / ハイブリッド接合 Less

低温ナノ接合界面における光電子機能創成と革新的ヘテロ集積デバイス技術基盤への展開Principal Investigator
- Principal Investigator
  
  多喜川良
- Project Period (FY)
  2024 – 2027
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Kyushu University
欧州半導体製造エコシステムとの連携による国際的光電子集積デバイス創出基盤の創成
- Principal Investigator
  
  加藤和利
- Project Period (FY)
  2024 – 2027
- Research Category
  
  Fund for the Promotion of Joint International Research (International Collaborative Research)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Kyushu University
原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用
- Principal Investigator
  
  井上史大
- Project Period (FY)
  2023 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Yokohama National University
次世代高精度ハイブリッド接合を見据えた絶縁接合界面創成Principal Investigator
- Principal Investigator
  
  多喜川良
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Fund for the Promotion of Joint International Research (Fostering Joint International Research (A))
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
Low temperature bonding using activated transparent thin film in airPrincipal Investigator
- Principal Investigator
  
  Takigawa Ryo
- Project Period (FY)
  2021 – 2023
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Kyushu University
Low temperature bonding for integrated photonics applicationPrincipal Investigator
- Principal Investigator
  
  Takigawa Ryo
- Project Period (FY)
  2020 – 2022
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Kyushu University
Room temperature bonding in air for heterogeneous optical integrationPrincipal Investigator
- Principal Investigator
  
  Takigawa Ryo
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  Kyushu University
Heterophotonics fabricated by ultra-precision cutting and room-temperature bondingPrincipal Investigator
- Principal Investigator
  
  Takigawa Ryo
- Project Period (FY)
  2017 – 2019
- Research Category
  
  Grant-in-Aid for Young Scientists (A)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Kyushu University
Fabrication of Lithium Niobate waveguides using ultra-precision ductile-mode cutting methodPrincipal Investigator
- Principal Investigator
  
  Takigawa Ryo
- Project Period (FY)
  2015 – 2016
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Kyushu University

All 2024 2023 2022 2021 2020 2019 2018 2017 2016 2015

All Journal Article Presentation

[Journal Article] Investigation of the interface between LiNbO3 and Si fabricated via room-temperature bonding method using activated Si nano layer2023
- Author(s)
  Murakami Seigo、Watanabe Kaname、Takigawa Ryo
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 62 Issue: SG Pages: SG1041-SG1041
- DOI
  10.35848/1347-4065/acc2cb
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21K18729, KAKENHI-PROJECT-20H02207
[Journal Article] 常温ウエハ接合によりSi上に集積された低駆動電圧型LNOI光変調器2023
- Author(s)
  渡辺要、山口祐也、菅野敦史、多喜川良
- Journal Title
  
  電気学会論文誌E
  
  Volume: 143
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20H02207
[Journal Article] Room-Temperature Bonding of Indium Phosphide Wafers and Their Atomic Structure at the Bond Interface2023
- Author(s)
  Zhang Gufei、Murakami Seigo、Takigawa Ryo
- Journal Title
  
  ACS Applied Electronic Materials
  
  Volume: 5 Issue: 11 Pages: 5995-6002
- DOI
  10.1021/acsaelm.3c00971
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21KK0255, KAKENHI-PROJECT-21K18729
[Journal Article] Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition2023
- Author(s)
  Takakura Ryo、Murakami Seigo、Watanabe Kaname、Takigawa Ryo
- Journal Title
  
  Scientific Reports
  
  Volume: 13 Issue: 1 Pages: 3581-3581
- DOI
  10.1038/s41598-023-30376-7
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-21K18729, KAKENHI-PROJECT-20H02207
[Journal Article] Fabrication of heterogeneous LNOI photonics wafers through room temperature wafer bonding using activated Si atomic layer of LiNbO3, glass, and sapphire2023
- Author(s)
  Watanabe Kaname、Takigawa Ryo
- Journal Title
  
  Applied Surface Science
  
  Volume: 620 Pages: 156666-156666
- DOI
  10.1016/j.apsusc.2023.156666
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21K18729, KAKENHI-PROJECT-20H02207
[Journal Article] Bonding of LiNbO3 and Si wafers at room temperature using Si nanolayers2021
- Author(s)
  Watanabe Kaname、Utsumi Jun、Takigawa Ryo
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 60 Issue: SC Pages: SCCL14-SCCL14
- DOI
  10.35848/1347-4065/abf2d3
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20K14629, KAKENHI-PROJECT-20H02207
[Journal Article] Direct bonding of LiNbO3 and SiC wafers at room temperature2020
- Author(s)
  Takigawa Ryo、Utsumi Jun
- Journal Title
  
  Scripta Materialia
  
  Volume: 174 Pages: 58-61
- DOI
  10.1016/j.scriptamat.2019.08.027
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] 大気中低温接合技術による光導波路集積2020
- Author(s)
  多喜川　良
- Journal Title
  
  レーザー学会第546回研究会報告
  
  Volume: - Pages: 19-22
- Data Source
  KAKENHI-PROJECT-18K18863
[Journal Article] Fabrication of a bonded LNOI waveguide structure on Si substrate using ultra-precision cutting2020
- Author(s)
  Takigawa Ryo、Kamimura Keigo、Asami Kenta、Nakamoto Keiichi、Tomimatsu Toru、Asano Tanemasa
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 59 Issue: SB Pages: SBBD03-SBBD03
- DOI
  10.7567/1347-4065/ab514e
- NAID
  210000157431
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] Demonstration of GaN/LiNbO3 Hybrid Wafer Using Room-Temperature Surface Activated Bonding2020
- Author(s)
  Takigawa Ryo、Matsumae Takashi、Yamamoto Michitaka、Higurashi Eiji、Asano Tanemasa、Kanaya Haruichi
- Journal Title
  
  ECS Journal of Solid State Science and Technology
  
  Volume: 9 Issue: 4 Pages: 045005-045005
- DOI
  10.1149/2162-8777/ab8369
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications2019
- Author(s)
  Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: accepted
- NAID
  210000156854
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K18863
[Journal Article] Residual Stress in Lithium Niobate Film Layer of LNOI/Si Hybrid Wafer Fabricated Using Low-Temperature Bonding Method2019
- Author(s)
  Ryo Takigawa, Toru Tomimatsu, Eiji Higurashi, Tanemasa Asano
- Journal Title
  
  Micromachine
  
  Volume: 10 Issue: 2 Pages: 136-136
- DOI
  10.3390/mi10020136
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-18K18863, KAKENHI-PROJECT-17H04925
[Journal Article] Ultrathin adhesive layer between LiNbO3 and SiO2 for bonded LNOI waveguide applications2019
- Author(s)
  Takigawa Ryo、Higurashi Eiji、Asano Tanemasa
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 58 Issue: SJ Pages: SJJE06-SJJE06
- DOI
  10.7567/1347-4065/ab24b6
- NAID
  210000156854
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K18863
[Journal Article] Surface Activated Bonding of LiNbO3 and GaN at Room Temperature2018
- Author(s)
  Ryo Takigawa, Eiji Higurashi and Tanemasa Asano
- Journal Title
  
  ECS transactions
  
  Volume: 86 Issue: 5 Pages: 207-213
- DOI
  10.1149/08605.0207ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K18863, KAKENHI-PROJECT-17H04925
[Journal Article] Auを用いた大気中低温接合によるLiNbO3光デバイス実装2018
- Author(s)
  多喜川良
- Journal Title
  
  信学技報
  
  Volume: 117 Pages: 7-11
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] Room-temperature wafer bonding of LiNbO3 and SiO2 using a modified surface activated bonding method2018
- Author(s)
  Ryo Takigawa, Eiji Higurashi, and Tanemasa Asano
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 57
- NAID
  210000149187
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] Thin-film lithium niobate-on-insulator waveguides fabricated on silicon wafer by room-temperature bonding method with silicon nanoadhesive layer2018
- Author(s)
  Ryo Takigawa, Tanemasa Asano
- Journal Title
  
  Optics Express
  
  Volume: 26 Issue: 19 Pages: 24413-24421
- DOI
  10.1364/oe.26.024413
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17H04925
[Journal Article] Investigation of the bonding interface of LiNbO3 and Si wafers bonded by laser irradiation2017
- Author(s)
  Ryo Takigawa, Hiroki kawano, Hiroshi Ikenoue, and Tanemasa Asano
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 印刷中
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K18055
[Journal Article] Bonding of lithium niobate to silicon in ambient air using laser irradiation2016
- Author(s)
  Hiroki kawano, Ryo Takigawa, Hiroshi Ikenoue, and Tanemasa Asano
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 8S3 Pages: 08RB09-08RB09
- DOI
  10.7567/jjap.55.08rb09
- NAID
  210000147023
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K18055
[Journal Article] Demonstration of ultraprecision ductile-mode cutting for lithium niobate microring waveguides2016
- Author(s)
  Ryo Takigawa, Eiji Higurashi, Testuya Kawanishi, and Tanemasa Asano
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 55 Issue: 11 Pages: 110304-110304
- DOI
  10.7567/jjap.55.110304
- NAID
  210000147210
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K18055
[Journal Article] 強誘電体材料の切削加工によるリッジ型光導波路2015
- Author(s)
  多喜川　良
- Journal Title
  
  MICROOPTICS NEWS
  
  Volume: 33 Pages: 31-36
- Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-15K18055
[Presentation] InP/InP室温接合界面の原子スケール解析2024
- Author(s)
  Zhang Gufei, Murakami Seigo and Ryo Takigawa
- Organizer
  第38回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21KK0255
[Presentation] 常温ウエハ接合によりSi上に形成された薄膜LNOI 光変調器の特性評価2024
- Author(s)
  村上誠悟,　渡辺要,　山口祐也,　坂本高秀,　多喜川良
- Organizer
  第38回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21KK0255
[Presentation] 表面活性化室温接合法によるInP-on-Insulatorウエハの作製2023
- Author(s)
  章　固非,　村上　誠悟,　渡辺　要,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] 表面活性化室温接合法によるInP-on-Insulatorウエハの作製2023
- Author(s)
  章　固非,　村上　誠悟,　渡辺　要,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] 室温接合法により形成されたLiNbO3/Si接合界面の原子スケール解析2023
- Author(s)
  村上　誠悟,　渡辺　要,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] LiNbO3/SiO2常温接合界面の原子スケール解析とLiNbO3 on Insulator/Si超高速光変調器の実証2023
- Author(s)
  村上誠悟,　森友健留,　山口祐也,　坂本高秀,　多喜川良
- Organizer
  第84回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-21KK0255
[Presentation] Room temperature bonding of InP wafers using an activated Si atomic layer2023
- Author(s)
  Zhang Gufei, Murakami Seigo and Ryo Takigawa
- Organizer
  36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21KK0255
[Presentation] 室温接合法により形成されたLiNbO3/Si接合界面の原子スケール解析2023
- Author(s)
  村上　誠悟,　渡辺　要,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] Surface activated bonding of Lithium Niobate wafers2023
- Author(s)
  Takeru Moritomo and Ryo Takigawa
- Organizer
  36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] Surface-activated wafer bonding of ALD Al2O3 ultrathin films2023
- Author(s)
  Kenji Uno and Ryo Takigawa
- Organizer
  36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] リン化インジウム/シリコンカーバイド常温接合界面の評価2023
- Author(s)
  渡辺　要,　範云翰,　前川　敏輝,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] リン化インジウム/シリコンカーバイド常温接合界面の評価2023
- Author(s)
  渡辺　要,　範云翰,　前川　敏輝,　多喜川　良
- Organizer
  第37回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Investigation of surface activation of Si wafer for room temperature direct bonding2023
- Author(s)
  Seigo Murakami and Ryo Takigawa
- Organizer
  36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] 原子層堆積法で成膜した酸化アルミニウム極薄膜同士の常温接合2022
- Author(s)
  高倉亮,渡辺要,多喜川良
- Organizer
  エレクトロニクス実装学会　第36回春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Fabrication of LNOI/Si optical modulator using room temperature wafer bonding method2022
- Author(s)
  Kaname Watanabe, Ryo Takigawa
- Organizer
  The 13th Japan-China-Korea Joint Conference on MEMS/NEMS
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] Modified surface activated bonding of InP and SiO2 at room temperature2022
- Author(s)
  Zhang Gufei, Kaname Watanabe and Ryo Takigawa
- Organizer
  35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] 常温ウエハ接合により Si 上に集積された低駆動電圧型LNOI 光変調器アレイ2022
- Author(s)
  渡辺　要, 山口　祐也, 菅野　敦史, 多喜川　良
- Organizer
  第39回「センサ・マイクロマシンと応用システム」
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Fabrication of LiTaO3/SiC hybrid wafer using surface activated bonding method2022
- Author(s)
  Seigo Murakami, Ryo Takigawa
- Organizer
  The 13th Japan-China-Korea Joint Conference on MEMS/NEMS
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] Modified surface activated bonding of InP and SiO2 at room temperature2022
- Author(s)
  Zhang Gufei, Kaname Watanabe and Ryo Takigawa,
- Organizer
  35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] 表面活性化によるInPとSiCの室温ウェハ接合2022
- Author(s)
  前川敏輝,範云翰,渡辺要,多喜川良
- Organizer
  エレクトロニクス実装学会　第36回春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Fabrication of LiNbO3/Si bond interface using room temperature direct bonding2022
- Author(s)
  Seigo Murakami, Kaname Watanabe, Ryo Takigawa
- Organizer
  35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] 室温接合により作製されたSi上LN on insulator光変調器2022
- Author(s)
  渡辺要、山口祐也、菅野敦史、多喜川良
- Organizer
  エレクトロニクス実装学会　第36回春季講演大会
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Fabrication of LiNbO3/Si bond interface using room temperature direct bonding2022
- Author(s)
  Seigo Murakami, Kaname Watanabe, Ryo Takigawa
- Organizer
  35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] Fabrication of InP/SiC structure using surface activated direct bonding2021
- Author(s)
  Y Fan, T Maekawa, K Watanabe, R Takigawa,
- Organizer
  7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] Surface activated bonding of Au thin microbumps using ultra-violet treatment2021
- Author(s)
  Toshiki Maeakawa, Kaname Watanabe, Hirofumi Nogami, Yuichiro Kurokawa, Yusuke Tahara, and Ryo Takigawa,
- Organizer
  34th International Microprocesses and Nanotechnology Conference (MNC 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K18729
[Presentation] LNOI photonics fabricated on Si wafer by room temperature bonding2021
- Author(s)
  Kaname Watanabe, Yuya Yamaguchi, Kannno Atsushi, Ryo Takigawa
- Organizer
  7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2021)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] 大気中低温接合技術による光導波路集積2020
- Author(s)
  多喜川　良
- Organizer
  レーザー学会第546回研究会
- Invited
- Data Source
  KAKENHI-PROJECT-18K18863
[Presentation] Room-temperature wafer bonding of LiNbO3 and Si using surface activation process with self-sputtering2020
- Author(s)
  Kaname Watanabe and Ryo Takigawa
- Organizer
  33rd International Microprocesses and Nanotechnology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20H02207
[Presentation] 接合中間層がLNOI光導波路特性に及ぼす影響調査2019
- Author(s)
  多喜川良、日暮栄治、浅野種正
- Organizer
  第33回エレクトロニクス実装学会春季大会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] 常温接合による超高速フォトニクス実装2019
- Author(s)
  多喜川良
- Organizer
  電子情報通信学会 SDM ICD ITE-IST研究会
- Invited
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] ニオブ酸リチウムと炭化シリコンの常温ウエハ接合2019
- Author(s)
  多喜川良、内海淳,
- Organizer
  第29回マイクロエレクトロニクスシンポジウム（MES2019）
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] 超精密切削加工によるLNOI光導波路の作製2019
- Author(s)
  上村啓悟, 多喜川良, 中本圭一
- Organizer
  第66回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Surface activation of Au films using vacuum ultraviolet irradiation for low-temperature bonding in air2019
- Author(s)
  Ryo Takigawa, Haruichi Kanaya
- Organizer
  The 8th Internatinal Conference on BioSensors, BioMedical Devices, Bio MEMS/NEMS & Applications 2019 (Bio4Apps2019)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18863
[Presentation] Lithium niobate-on-insulator waveguide on Si substrate fabricated by room temperature bonding2019
- Author(s)
  Ryo Takigawa, Keigo Kamimura, Keiichi Nakamoto, Tanemasa Asano
- Organizer
  6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Room-temperature direct bonding of LiTaO3 and SiC wafers for future SAW filter2019
- Author(s)
  Ryo Takigawa, Jun Utsumi
- Organizer
  45th International Conference on Micro & Nano Engineering
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] 接合中間層がLNOI光導波路特性に及ぼす影響調査2019
- Author(s)
  多喜川良、日暮栄治、浅野種正
- Organizer
  エレクトロニクス実装学会
- Data Source
  KAKENHI-PROJECT-18K18863
[Presentation] Low-temperature bonding for heterogeneous photonic integration2019
- Author(s)
  Ryo Takigawa
- Organizer
  6th K-J Joint Syposium
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] 紫外線洗浄を利用した大気中Au-Au低温接合の検討2019
- Author(s)
  多喜川良
- Organizer
  The 7th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging Kyushu Branch
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Surface Micromachining Using Ultra-precision Ductile-mode Cutting Method for Strongly Confined Low-loss LiNbO3 Waveguides2018
- Author(s)
  Ryo Takigawa, Tetsuya Kawanishi, Eiji Higurashi, and Tanemasa Asano
- Organizer
  Progress in Electromagnetics Research Symposium(PIERS) 2018
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Siナノ密着層を利用したLiNbO3とSiO2の常温ウエハ接合と低損失LNOI光導波路への応用2018
- Author(s)
  多喜川良、浅野種正
- Organizer
  第７9回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] LN変調器向け小型0.18μm CMOS高速駆動回路2018
- Author(s)
  久保木猛，多喜川良，加藤和利
- Organizer
  第65回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] 切削加工によるSi基板上LNOI光導波路の作製検討2018
- Author(s)
  多喜川良，日暮栄治，川西哲也，浅野種正
- Organizer
  第32回エレクトロニクス実装学会春季講演大会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Room-temperature wafer bonding of LiNbO3 and SiO2 using sub-nanometer Fe films2018
- Author(s)
  Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
- Organizer
  23rd Microoptics Conference (MOC2018)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] イオンビーム活性化接合法による Si上LNOI導波路の作製と光伝搬特性評価2018
- Author(s)
  多喜川良，日暮栄治，浅野種正
- Organizer
  第65回応用物理学会春季学術講演会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Room-temperature wafer bonding of LiNbO3 and SiO2 using sub-nanometer Fe films2018
- Author(s)
  Ryo Takigawa, Eiji Higurashi and Tanemasa Asano
- Organizer
  23rd Microoptics Conference (MOC2018)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18863
[Presentation] Surface activated bonding of LiNbO3 and Si for optical microsystem2018
- Author(s)
  Ryo Takigawa
- Organizer
  31st International Microprocesses and Nanotechnology Conference(MNC)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Surface Activated Bonding of LiNbO3 and GaN at Room Temperature2018
- Author(s)
  Ryo Takigawa, Eiji Higurashi and Tanemasa Asano
- Organizer
  ECS meeting
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-18K18863
[Presentation] Surface activated wafer bonding of LiNbO3 and SiO2/Si for LNOI on Si2017
- Author(s)
  Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
- Organizer
  2017 5th International Workshop on Low Temperature Bonding for 3D Integration LTB-3D 2017
- Place of Presentation
  The University of Tokyo, Tokyo, Japan
- Year and Date
  2017-05-16
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K18055
[Presentation] Auを用いた大気中低温接合によるLiNbO3光デバイス実装2017
- Author(s)
  多喜川良
- Organizer
  電子情報通信学会マイクロ波・ミリ波フォトニクス研究会
- Invited
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Room-temperature bonding of LiNbO3 and SiO2 usingsurface activated bonding2017
- Author(s)
  Ryo Takigawa, Eiji Higurashi, Tanemasa Asano
- Organizer
  30th International of Microprocesses and Nanotechnology Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] Demonstration of strongly confined optical waveguides using ultra-precision ductile-mode cutting2017
- Author(s)
  Ryo Takigawa
- Organizer
  The 5th Joint Conference of Research Center for Advanced Biomechanics & Japan Institute of Electronics Packaging Kyushu Branch
- Place of Presentation
  Kyushu University, Fukuoka, Japan
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K18055
[Presentation] 表面活性化と低温熱処理を併用したLiNbO3ウェハと SiO2/Si ウェハの直接接合2017
- Author(s)
  多喜川良，日暮栄治，浅野種正
- Organizer
  第78回応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-17H04925
[Presentation] LiNbO3/Si hybrid wafer bonded in ambient air using laser irradiation2016
- Author(s)
  Ryo Takigawa, Hiroki Kawano, Hiroshi Ikenoue, and Tanemasa Asano
- Organizer
  29th International Microprocesses and Nanotechnology Conference
- Place of Presentation
  ANA Crowne Plaza Kyoto, Kyoto, Japan
- Year and Date
  2016-11-08
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K18055
[Presentation] 強誘電体材料の切削加工によるリッジ型光導波路2015
- Author(s)
  多喜川　良
- Organizer
  応用物理学会微小光学研究会「材料を創る・活かす-適材適所の微小光学-」
- Place of Presentation
  東京
- Year and Date
  2015-05-26
- Invited
- Data Source
  KAKENHI-PROJECT-15K18055
[Presentation] Bonding of LiNbO3 thin film on Si substrate using laser irradiation2015
- Author(s)
  Hiroki Kawano, Ryo Takigawa, Hiroshi Ikenoue, and Tanemasa Asano
- Organizer
  THE TWENTIETH MICROOPTICS CONFERENCE
- Place of Presentation
  Fukuoka、Japan
- Year and Date
  2015-10-25
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-15K18055

1. 山口祐也 (30754791)

# of Collaborated Projects: 2 results

# of Collaborated Products: 4 results
2. 坂本高秀 (70392727)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. 小川貴史 (90515561)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 井上史大 (00908303)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. 藤野真久 (70532274)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 加藤和利 (10563827)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 三上裕也 (80943662)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Takigawa Ryo 多喜川 良

Research Projects

Research Products

Co-Researchers

低温ナノ接合界面における光電子機能創成と革新的ヘテロ集積デバイス技術基盤への展開Principal Investigator

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欧州半導体製造エコシステムとの連携による国際的光電子集積デバイス創出基盤の創成

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原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用

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次世代高精度ハイブリッド接合を見据えた絶縁接合界面創成Principal Investigator

Principal Investigator

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Low temperature bonding using activated transparent thin film in airPrincipal Investigator

Principal Investigator

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Low temperature bonding for integrated photonics applicationPrincipal Investigator

Principal Investigator

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Room temperature bonding in air for heterogeneous optical integrationPrincipal Investigator

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Heterophotonics fabricated by ultra-precision cutting and room-temperature bondingPrincipal Investigator

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Fabrication of Lithium Niobate waveguides using ultra-precision ductile-mode cutting methodPrincipal Investigator

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[Journal Article] Investigation of the interface between LiNbO3 and Si fabricated via room-temperature bonding method using activated Si nano layer2023

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[Journal Article] 常温ウエハ接合によりSi上に集積された低駆動電圧型LNOI光変調器2023

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[Journal Article] Room-Temperature Bonding of Indium Phosphide Wafers and Their Atomic Structure at the Bond Interface2023

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[Journal Article] Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition2023

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[Journal Article] Fabrication of heterogeneous LNOI photonics wafers through room temperature wafer bonding using activated Si atomic layer of LiNbO3, glass, and sapphire2023

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Takigawa Ryo 多喜川良