Nishikawa Hiroshi 西川宏

… Alternative Names

NISHIKAWA Hiroshi 西川宏

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Researcher Number	90346180
Other IDs	https://orcid.org/0009-0007-5658-5983
External Links
Affiliation (Current)	2025: 大阪大学, 接合科学研究所, 教授
Affiliation (based on the past Project Information) *help	2016 – 2021: 大阪大学, 接合科学研究所, 教授 2010 – 2015: 大阪大学, 接合科学研究所, 准教授 2006: Osaka University, Joining and Welding Research Inst., Assoc. Prof., 接合科学研究所, 助教授 2004 – 2005: 大阪大学, 接合科学研究所, 助手
Review Section/Research Field	Principal Investigator Composite materials/Surface and interface engineering / Basic Section 26030:Composite materials and interfaces-related / Material processing/treatments / Recycling engineering Except Principal Investigator Material processing/treatments / Environmental technology/Environmental materials
Keywords	Principal Investigator 焼結型接合 / エレクトロニクス実装 / 高温はんだ代替接合 / 界面反応 / 接合 / ナノポーラス構造 / ナノポーラス材料 / 低温 / ナノ構造 / 固相接合 … More / 高耐熱高信頼性 / 3次元ナノ構造 / 高耐熱 / Cu/Cu接合 / 選択溶解 / 表面活性化技術 / 電析 / 低温焼結型接合 / 鉛フリー接合 / 高信頼性 / 耐衝撃性 / はんだ付け / 界面反応層 / 高速せん断試験 / レーザ加熱 / 鉛フリーはんだ / 微細化 / 微細接合 / エレクトニクス実装 / 分離・分別技術 / アルミニウム合金ストラップ / アルミニウム分別技術 / 自動化 / レーザ / 固相分別 / アルミニウム合金 / リサイクル … More Except Principal Investigator Content / Emitter materials / In-situ measurement / Laser system / Work function / Thermionic cathode / Tungsten electrode / Arc / 光電効果 / その場測定 / 添加量 / 電子エミッター / その場観察 / レーザ計測 / 仕事関数 / 熱陰極 / タングステン電極 / アーク / YP複合培地 / 金 / クロモバクテリウムビオラセウム / 酸素 / リサイクル / プリント配線板 / バクテリアリーチング Less

Low-temperature bonding using nanostructure on material surfacePrincipal Investigator
- Principal Investigator
  
  Nishikawa Hiroshi
- Project Period (FY)
  2019 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Osaka University
Bonding process for sintered layer with high thermostability using a nanoporous structurePrincipal Investigator
- Principal Investigator
  
  Nishikawa Hiroshi
- Project Period (FY)
  2016 – 2018
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University
Microjoining technology using sintering process of 3D nanoporous structurePrincipal Investigator
- Principal Investigator
  
  Hiroshi Nishikawa
- Project Period (FY)
  2013 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Composite materials/Surface and interface engineering
- Research Institution
  Osaka University
Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the jointPrincipal Investigator
- Principal Investigator
  
  NISHIKAWA Hiroshi
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
酸素吹き込みによる微生物活性化のバイオリーチングへの適用性
- Principal Investigator
  
  竹本正
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Exploratory Research
- Research Field
  
  Environmental technology/Environmental materials
- Research Institution
  Osaka University
レーザを利用したアルミニウム合金スクラップの固相分別技術に関する研究Principal Investigator
- Principal Investigator
  
  西川宏
- Project Period (FY)
  2004 – 2005
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Recycling engineering
- Research Institution
  Osaka University
Analysis of arc-cathode system from in-situ diagnostics of tungsten electrode during operation
- Principal Investigator
  
  TANAKA Manabu
- Project Period (FY)
  2004 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University

[Book] Novel Structured Metallic and Inorganic Materials2019
- Author(s)
  T. Kaneda, H. Shinohara, A. Okada, K .Matsunaga, S. Shoji, M. Saito, H.Nishikawa and J. Mizuno
- Total Pages
  16
- Publisher
  Springer
- ISBN
  9789811376108
- Data Source
  KAKENHI-PROJECT-19H02444
[Journal Article] Microstructure, Morphology and Magnetic Property of (001)-Textured MnAlGe Films on Si/SiO<sub>2</sub> Substrate2021
- Author(s)
  Umetsu Rie Y.、Semboshi Satoshi、Mitsui Yoshifuru、Katsui Hirokazu、Nozaki Yoshito、Yuitoo Isamu、Takeuchi Teruaki、Saito Mikiko、Kawarada Hiroshi
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 62 Issue: 5 Pages: 680-687
- DOI
  10.2320/matertrans.MT-M2020309
- NAID
  130008029687
- ISSN
  1345-9678, 1347-5320
- Year and Date
  2021-05-01
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02444, KAKENHI-PROJECT-18H01743
[Journal Article] Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled Mn-Cu alloy2021
- Author(s)
  Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
- Journal Title
  
  Journal of porous materials
  
  Volume: 28 Issue: 6 Pages: 1823-1836
- DOI
  10.1007/s10934-021-01128-7
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02444
[Journal Article] Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications2020
- Author(s)
  S. Koga, H. Nishikawa, M. Saito, J. Mizuno
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 49 Issue: 3 Pages: 2151-2158
- DOI
  10.1007/s11664-019-07916-x
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H01278, KAKENHI-PROJECT-19H02444
[Journal Article] Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs2020
- Author(s)
  Saito Mikiko、Kuwae Hiroyuki、Mizuno Jun、Norimatsu Wataru、Kusunoki Michiko、Nishikawae Hiroshi
- Journal Title
  
  Proceeding of 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC 2020)
  
  Volume: 8 Pages: 43-47
- DOI
  10.1109/estc48849.2020.9229813
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02444
[Journal Article] Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment2018
- Author(s)
  Fu Weixin、Kaneda Tatsushi、Okada Akiko、Matsunaga Kaori、Shoji Shuichi、Saito Mikiko、Nishikawa Hiroshi、Mizuno Jun
- Journal Title
  
  Journal of Electronic Materials
  
  Volume: 47 Issue: 10 Pages: 5952-5958
- DOI
  10.1007/s11664-018-6462-8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17H01278, KAKENHI-PROJECT-16H04508
[Journal Article] Influence of ENIG defects on shear strength of pressureless Ag nanoparticle sintered joint under isothermal aging2017
- Author(s)
  M-S. Kim、H. Nishikawa
- Journal Title
  
  Microelectronics Reliability
  
  Volume: 76-77 Pages: 420-425
- DOI
  10.1016/j.microrel.2017.06.083
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-16H04508
[Journal Article] Effects of Bonding Temperature on Microstructure, Fracture Behavior and Joint Strength of Ag Nanoporous Bonding for High Temperature Die Attach2015
- Author(s)
  M.-S. Kim and H. Nishikawa
- Journal Title
  
  Mater. Sci. Eng. A.
  
  Volume: 645 Pages: 264-272
- DOI
  10.1016/j.msea.2015.08.015
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-25289241
[Journal Article] Low-Temperature Au–Au Bonding Using Nanoporous Au–Ag Sheets2013
- Author(s)
  H. Mimatsu, J. Mizuno, T. Kasahara, M. Saito, H. Nishikawa, S. Shoji
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 52 Pages: 50204-50204
- NAID
  210000142150
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-25289241
[Journal Article] Application of Nd:YAG Laser to Aluminum Alloy Sorting2005
- Author(s)
  Hiroshi Nishikawa
- Journal Title
  
  Materials Transactions Vol.46,No.12
  
  Pages: 2641-2646
- NAID
  10017149376
- Data Source
  KAKENHI-PROJECT-16760667
[Patent] 金属材の接合方法2014
- Inventor(s)
  西川宏，齋藤美紀子，水野潤
- Industrial Property Rights Holder
  大阪大学、早稲田大学
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2014-245757
- Filing Date
  2014-12-04
- Data Source
  KAKENHI-PROJECT-25289241
[Patent] 銅材の接合方法2013
- Inventor(s)
  西川　宏、齋藤美紀子、水野　潤
- Industrial Property Rights Holder
  大阪大学、早稲田大学
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2013-248205
- Filing Date
  2013-11-29
- Data Source
  KAKENHI-PROJECT-25289241
[Patent] シアン生成及び分解細菌を用いた低環境負荷型金属回収方法2006
- Inventor(s)
  竹本正, 西川宏, 北義人
- Industrial Property Rights Holder
  国立大学法人大阪大学
- Industrial Property Number
  2006-139108
- Filing Date
  2006-05-18
- Data Source
  KAKENHI-PROJECT-17651046
[Presentation] Cu-Zn合金の腐食を利用したCu微細構造による接合プロセスの検討2021
- Author(s)
  綿谷一駿，朴炳浩，西川　宏
- Organizer
  第27回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] The effect of formic acid on the bonding strength of solid-state nanoporous Cu bonding for power device2021
- Author(s)
  Byungho Park, Duy Le Han, Mikiko Saito, Jun Mizuno, Hiroshi Nishikawa
- Organizer
  International Conference on Electronics Packaging (ICEP) 2021
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] 電析とデアロイを用いたAu-Agナノポーラス構造の作製と評価2021
- Author(s)
  齋藤美紀子、水野　潤、西川　宏
- Organizer
  一般社団法人スマートプロセス学会エレクトロニクス生産科学部会第35回電子デバイス実装研究委員会
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] パワーサイクル試験におけるダイボンド部の劣化挙動2020
- Author(s)
  金黒秀平，佐々木喜七，西川宏
- Organizer
  第26回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] Metal deposition using solutions on high-density and well-aligned CNTs2020
- Author(s)
  M. Saito J. Mizuno, W. Norimatsu, M. Kusunoki, H. Nishikawa
- Organizer
  2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] Cuナノポーラスシートを用いた接合部の劣化挙動の解明2019
- Author(s)
  古賀俊一，齋藤美紀子，水野潤，西川　宏
- Organizer
  第25回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled Mn70Cu30 alloy2019
- Author(s)
  B. Park, M. Saito, J. Mizuno, H. Nishikawa
- Organizer
  The 4th International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development(iLIM-4)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] Bonding Process Using a Nanoporous Sheet for High Temperature Electronics2019
- Author(s)
  H. Nishikawa
- Organizer
  1st JWRI-IMS Collaboration Seminar on Joining and Materials Science
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Auナノポーラスシートを用いた接合部のパワーサイクル試験における長期信頼性評価2019
- Author(s)
  金黒秀平，佐々木喜七，西川宏
- Organizer
  第29回マイクロエレクトロニクスシンポジウム
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] An Investigation of the Corrosion Behavior of Dealloyed Au-Ag Electrodeposited Films2019
- Author(s)
  M. Saito, J. Mizuno, H. Nishikawa
- Organizer
  The 4th International Symposium on Creation of Life Innovation Materials for Interdisciplinary and International Researcher Development(iLIM-4)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02444
[Presentation] Long-term Reliability of Joint Using Ag Nanoporous Sheet without Solvent2018
- Author(s)
  H. Nishikawa and M.-S. Kim
- Organizer
  The 71st IIW ANNUAL ASSEMBLY & INTERNATIONAL CONFERENCE
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 異種金属を用いたナノポーラス構造による界面形成現象の比較2018
- Author(s)
  古賀俊一，齋藤美紀子，水野潤，西川　宏
- Organizer
  第28回マイクロエレクトロニクスシンポジウム論文集
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 電析とデアロイを用いたナノポーラス電極形成検討2018
- Author(s)
  齋藤美紀子，古賀俊一, 水野　潤，西川　宏, 楠　美智子
- Organizer
  国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクト公開討論会
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Cu-Mg合金から作製したCuナノポーラスシートを用いた接合部の高温放置試験2018
- Author(s)
  古賀俊一、キムミンス、齋藤美紀子、水野潤、西川宏
- Organizer
  第24回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 三次元ナノ構造を利用した高耐熱・高放熱新奇接合技術2018
- Author(s)
  西川　宏，Omid Mokhtari，水野潤，齋藤美紀子，乗松航，楠　美智子
- Organizer
  国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクト公開討論会
- Invited
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Nanoporous Electrode Formed by Electrodeposition and Dealloying on Aligned CNT Films2017
- Author(s)
  M. Saito, J. Mizuno, H. Nishikawa, M. Kusunoki
- Organizer
  ICMaSS 2017
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 高密度・高配向　CNTへのAu-Ag電析膜形成2017
- Author(s)
  齋藤美紀子，水野　潤，西川　宏，楠　美智子
- Organizer
  学際・国際的高度人材育成ライフイノベーションマテリアル創製共同研究プロジェクトキックオフ公開討論会
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] ナノポーラス金接合に向けた真空紫外光による表面前処理2017
- Author(s)
  金田達志，岡田愛姫子，付偉欣，庄子習一，齋藤美紀子，西川宏，水野潤
- Organizer
  第23回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 電析と選択溶解を用いたAu-Agナノポーラス構造制御2017
- Author(s)
  齋藤美紀子，古賀俊一, 水野　潤，西川　宏
- Organizer
  2017年電気化学　秋季大会
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Cu-Mg合金のデアロングによるCuナノポーラス構造の作製と接合への応用2017
- Author(s)
  古賀俊一、キムミンス、齋藤美紀子、水野潤、西川宏
- Organizer
  第27回マイクロエレクトロニクスシンポジウム
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Reliability of Die Attach Using Ag Nanoporous Sheet for High Temperature Electronics2016
- Author(s)
  M.-S. Kim and H. Nishikawa
- Organizer
  TMS2016
- Place of Presentation
  Nashville, USA
- Year and Date
  2016-02-14
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Effect of isothermal aging at 250 C on shear strength of joints using Au nanoporous bonding for die attach2016
- Author(s)
  H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
- Organizer
  International Conference on High Temperature Electronics (HiTEC 2016)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Properties of Nanoporous Structures Obtained by Electrodeposition and Dealloying for Low-Temperature Bonding2016
- Author(s)
  M. Saito, K. Matsunaga, J. Mizuno and H. Nishikawa
- Organizer
  The 6th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials(AMDI-6)
- Place of Presentation
  東京
- Year and Date
  2016-06-09
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Bonding process using a nanoporous gold sheet for high temperature electronics2016
- Author(s)
  H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
- Organizer
  International Symposium on Micro-Nano Science and Technology 2016
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Microstructure of Cu-to-Cu Joint Using Nanoporous Bonding2016
- Author(s)
  K. Matsunaga, M.-S. Kim, H. Nishikawa, M. Saito and J. Mizuno
- Organizer
  The 6th Int. Symp. on Adv. Materials Development and Integration of Novel Structured Metallic and Inorganic Materials(AMDI-6)
- Place of Presentation
  東京
- Year and Date
  2016-06-09
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Formation of Nanoporous Electrode on Aligned CNT Films using Dealloying2016
- Author(s)
  M. Saito, J. Mizuno, M. Kusunoki, H. Nishikawa
- Organizer
  230th Meeting of the Electrochem. Soc.
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] 銀ナノポーラス材料を用いた接合部の高温放置試験による微細組織変化2016
- Author(s)
  M.-S. Kim and H. Nishikawa
- Organizer
  第22回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Place of Presentation
  横浜
- Year and Date
  2016-02-02
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] 定電位電解したAuナノポーラスシートによるCu/Cu接合の検討2016
- Author(s)
  松永香織, M.-S. Kim, 西川宏, 斎藤美紀子, 水野潤
- Organizer
  第22回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Place of Presentation
  横浜
- Year and Date
  2016-02-02
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Bonding process using Au nanoporous metal sheet for die attach2016
- Author(s)
  H. Nishikawa, K. Matsunaga, M-S. Kim, M. Saito, J. Mizuno
- Organizer
  69th IIW Annual Assembly & International Conference
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-16H04508
[Presentation] Bonding Process Using Nanomaterials for Electronics Packaging2015
- Author(s)
  H. Nishikawa
- Organizer
  The second workshop on welding and Joining (WWJ2015)
- Place of Presentation
  Hanoi, Vietnam
- Year and Date
  2015-08-19
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Bonding Process Using Ag Nanoporous Metal for High-Temperature Application2015
- Author(s)
  H. Nishikawa
- Organizer
  Workshop on Joining and Welding Technology
- Place of Presentation
  Singapore
- Year and Date
  2015-12-10
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Improved Low Temperature Gold-Gold Bonding Using Nanoporous Powder Bump Using Vacuum Ultraviolet Irradiation Pre-treatment2015
- Author(s)
  T. Kaneda, J. Mizuno, A. Okada, K. Matsunaga, S. Shoji, M. Saito and H. Nishikawa
- Organizer
  Int. Conf. on Electronics Packaging and IMAPS ALL Asia Conf.
- Place of Presentation
  京都
- Year and Date
  2015-04-14
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Effect of Isothermal Aging on Microstructure and Joint Strength of Ag Nanoporous Bonding for High Temperature Die Attach2015
- Author(s)
  M.-S. Kim and H. Nishikawa
- Organizer
  10th Int. Microsystems, Packaging, Assembly and Circuits Technology Conf.
- Place of Presentation
  Taipe, Taiwan
- Year and Date
  2015-10-21
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Effect of Au Nanoporous Structure on Bonding Strength2015
- Author(s)
  K. Matsunaga, M.-S. Kim, H. Nishikawa, M. Saito and J. Mizuno
- Organizer
  Int. Conf. on Electronics Packaging and IMAPS ALL Asia Conf.
- Place of Presentation
  京都
- Year and Date
  2015-04-14
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Au ナノポーラスシートを用いた接合合体の高温信頼性2015
- Author(s)
  松永香織, M.-S. Kim, 西川宏, 齋藤美紀子, 水野潤
- Organizer
  第25回マイクロエレクトロニクスシンポジウム
- Place of Presentation
  大阪
- Year and Date
  2015-09-03
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Au・Ag系ナノポーラス粉末を接着層として用いるAu-Auの低温接合に関する研究2014
- Author(s)
  三松隼太、水野潤、庄子習一、齋藤美紀子、梅津理恵、西川宏
- Organizer
  第20回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
- Place of Presentation
  横浜
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Shear strength of Cu/Cu joints using Au nanoporous sheet for high-temperature application2014
- Author(s)
  K. Matsunaga, M.-S. Kim, H. Nishikawa, M. Saito, J. Mizuno
- Organizer
  The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5)
- Place of Presentation
  東京
- Year and Date
  2014-11-09
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Nano-porous Structure Control under Electrodeposition and Dealloying Conditions2014
- Author(s)
  M. Saito, K. Matsunaga, J. Mizuno, H. Nishikawa
- Organizer
  The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5)
- Place of Presentation
  東京
- Year and Date
  2014-11-09
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Pressure-assisted bonding using nanomaterials for electronics packaging2014
- Author(s)
  H. Nishikawa, K. Matsunaga, M.-S. Kim, M. Saito, J. Mizuno
- Organizer
  The 5th International Symposium on Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-5)
- Place of Presentation
  東京
- Year and Date
  2014-11-09
- Invited
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] レーザはんだ付したはんだバンプ衝撃強度に及ぼす微細化の影響2013
- Author(s)
  宇治野真、西川宏
- Organizer
  スマートプロセス学会春季総合学術講演会
- Place of Presentation
  大阪大学
- Year and Date
  2013-05-22
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Intermetallic Compound Formation and Growth at the lead-free solder/Cu interface during laser reflow soldering and during isothermal aging2012
- Author(s)
  Hiroshi Nishikawa
- Organizer
  141st Annual Meeting & Exhibition (TMS 2012)
- Place of Presentation
  フロリダ(米国)
- Year and Date
  2012-03-14
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Intermetallic Compound Formation andGrowth at the Lead-Free Solder/CuInterface during Laser Reflow Solderingand during Isothermal Aging2012
- Author(s)
  H. Nishikawa, N. Iwata and T. Takemoto
- Organizer
  141st AnnualMeeting &Exhibition (TMS2012)
- Place of Presentation
  Florida, USA
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Effect of isothermal Aging on Sn-Ag-Cu solder joints on electroless Ni-P/Au plating by laser reflow soldering2012
- Author(s)
  Hiroshi Nishikawa
- Organizer
  International Brazing and Soldering Conference (IBSC 2012)
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Effect of isothermal Aging on Sn-Ag-Cusolder joints on electroless Ni-P/Auplating by laser reflow soldering2012
- Author(s)
  H. Nishikawa, N. Iwata, T. Takemoto
- Organizer
  5th International Brazing and SolderingConference (IBSC 2012)
- Place of Presentation
  Las Vegas, USA
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Impact reliability of micro-joints soldered with Sn-Ag-Cu solder using laser process2011
- Author(s)
  Hiroshi Nishikawa
- Organizer
  Sino-Japanese Workshop on Welding Thermo-Physics
- Place of Presentation
  済南(中国)(招待講演)
- Year and Date
  2011-11-09
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Impact reliability ofmicro-joints soldered with Sn-Ag-Cusolder using laser process2011
- Author(s)
  H. Nishikawa
- Organizer
  Sino-JapaneseWorkshop on Welding Thermo-Physics(招待講演)
- Place of Presentation
  済南(中国)
- Year and Date
  2011-11-09
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] 低融点はんだ/Cu 継手の耐落下衝撃性評価2011
- Author(s)
  山本晃将、西川宏
- Organizer
  日本金属学会2011年秋期大会
- Place of Presentation
  沖縄コンベンションセンター
- Year and Date
  2011-11-07
- Data Source
  KAKENHI-PROJECT-22560721
[Presentation] Effect of Joining Conditions on the Joint Strength of Ag Nanoporous Bonding
- Author(s)
  M-S. Kim, H. Nishikawa
- Organizer
  2014 International Conference on Electronics Packaging (ICEP2014)
- Place of Presentation
  富山
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] LOW-TEMPERATURE GOLD-GOLD BONDING USING SELECTIVE FORMATION OF NANOPOROUS POWDERS FOR BUMP INTERCONNECTS
- Author(s)
  . Mimatsu, J. Mizuno, T. Kasahara, M. Saito, S. Shoji, H. Nishikawa
- Organizer
  The 27th IEEE International Conference on MEMS2014
- Place of Presentation
  Sanfrancisco, USA
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Thermal stability of electroless nickel / immersion gold surface finish for direct bond copper
- Author(s)
  M-S. Kim, H. Nishikawa
- Organizer
  5th Electronics System-Integration Technology Conference (ESTC 2014)
- Place of Presentation
  Helsinki, Finland
- Year and Date
  2014-09-16 – 2014-09-18
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Microstructural change of Ag nanoporous bonding joint and interdiffusion of Cu / Ag during thermal aging
- Author(s)
  M-S. Kim, H. Nishikawa
- Organizer
  4th International IEEE Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2014)
- Place of Presentation
  東京
- Year and Date
  2014-07-25 – 2014-07-26
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Nano-Porous Au-Ag Joint Layer for Low-Temperature Au-Au Bonding
- Author(s)
  J.Mizuno, H.Mimatsu, T.Kasahara, M.Saito, H.Nishikawa, S.Shoji
- Organizer
  Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials (AMDI-4)
- Place of Presentation
  Nagoya,Japan
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Au ナノポーラス接合の接合材表面構造と接合強度の関係
- Author(s)
  松永　香織, Min-Su Kim, 西川　宏, 齋藤　美紀子, 水野　潤
- Organizer
  第24回マイクロエレクトロニクスシンポジウム(MES2014)
- Place of Presentation
  大阪
- Year and Date
  2014-09-04 – 2014-09-05
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Nano-porous Structure Control under Electrodeposition and Dealloying Conditions for Low-temperature Bonding
- Author(s)
  M. Saito, K. Matsunaga, J. Mizuno, H. Nishikawa
- Organizer
  5th Electronics System-Integration Technology Conference (ESTC 2014)
- Place of Presentation
  Helsinki, Finland
- Year and Date
  2014-09-16 – 2014-09-18
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Relationship between bonding conditions and strength for joints using a Au nanoporous sheet
- Author(s)
  K. Matsunaga, M-S. Kim, H. Nishikawa, M. Saito and J. Mizuno
- Organizer
  5th Electronics System-Integration Technology Conference (ESTC 2014)
- Place of Presentation
  Helsinki, Finland
- Year and Date
  2014-09-16 – 2014-09-18
- Data Source
  KAKENHI-PROJECT-25289241
[Presentation] Interfacial Reaction and Joint Strength of Ag Nanoporous Bonding with Electroless Nickel/Immersion Gold Substrate
- Author(s)
  M-S. Kim, H. Nishikawa
- Organizer
  The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW 2014)
- Place of Presentation
  大阪
- Year and Date
  2014-11-26 – 2014-11-28
- Data Source
  KAKENHI-PROJECT-25289241

1. SAITO Mikiko (80386739)

# of Collaborated Projects: 3 results

# of Collaborated Products: 40 results
2. MIZUNO Jun (60386737)

# of Collaborated Projects: 3 results

# of Collaborated Products: 38 results
3. SERIZAWA Hisashi (20294134)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. TANAKA Manabu (20243272)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. 竹本正 (60093431)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 桑江博之 (40801212)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Nishikawa Hiroshi 西川 宏

NISHIKAWA Hiroshi 西川 宏

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Low-temperature bonding using nanostructure on material surfacePrincipal Investigator

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Bonding process for sintered layer with high thermostability using a nanoporous structurePrincipal Investigator

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Microjoining technology using sintering process of 3D nanoporous structurePrincipal Investigator

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Effect of miniaturization of solder joint for electronics packagingon interfacial reaction between solder and substrate and impact reliability of the jointPrincipal Investigator

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酸素吹き込みによる微生物活性化のバイオリーチングへの適用性

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レーザを利用したアルミニウム合金スクラップの固相分別技術に関する研究Principal Investigator

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Analysis of arc-cathode system from in-situ diagnostics of tungsten electrode during operation

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[Book] Novel Structured Metallic and Inorganic Materials2019

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[Journal Article] Microstructure, Morphology and Magnetic Property of (001)-Textured MnAlGe Films on Si/SiO<sub>2</sub> Substrate2021

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[Journal Article] Fabrication and characterization of nanoporous copper through chemical dealloying of cold-rolled Mn-Cu alloy2021

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[Journal Article] Fabrication of Nanoporous Cu Sheet and Application to Bonding for High-Temperature Applications2020

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[Journal Article] Metal Deposition Using Solutions on High-Density and Well-Aligned CNTs2020

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[Journal Article] Low Temperature Flip Chip Bonding Using Squeegee-Embedded Au Nanoporous Bump Activated by VUV/O3 Treatment2018

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Nishikawa Hiroshi 西川宏

NISHIKAWA Hiroshi 西川宏