LEE KANGWOOK 李康旭

Researcher Number	90534503
Affiliation (based on the past Project Information) *help	2012 – 2013: 東北大学, 未来科学技術共同研究センター, 教授 2011: 東北大学, 未来科学技術共同研究センター, 准教授
Review Section/Research Field	Principal Investigator Electron device/Electronic equipment
Keywords	Principal Investigator 複合ウェハ / ヘテロCMOSトランジスタ / セルフアセンブリー張り合わせる / 複合Ｓｉウェハ / セルフアセンブリー張り合わせ / ヘテロＣＭＯＳトランジスタ / 複合Siウェハ

High Performance, Low Power Hetero-CMOS Device using Compound Si WaferPrincipal Investigator
- Principal Investigator
  
  LEE KANGWOOK
- Project Period (FY)
  2011 – 2013
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Tohoku University

All 2013 2012 2011

All Journal Article Presentation

[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013
- Author(s)
  Kang-Wook Lee, Yuki Ohara, Kouji Kiyoyama, Ji-Cheol Bea, Mariappan Murugesan,Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.60, NO.11 Issue: 11 Pages: 3842-3848
- DOI
  10.1109/ted.2013.2280273
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146, KAKENHI-PROJECT-24246060
[Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI2012
- Author(s)
  Akihiro Noriki, Kangwook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE ELECTRON DEVICES LETTERS
  
  Volume: Vol.33 Issue: 2 Pages: 221-223
- DOI
  10.1109/led.2011.2174608
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON ELECTRON DEVICES
  
  Volume: VOL.59(11) Issue: 11 Pages: 2956-2963
- DOI
  10.1109/ted.2012.2212709
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011
- Author(s)
  Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  Micromachins
  
  Volume: vol.2 Issue: 1 Pages: 49-68
- DOI
  10.3390/mi2010049
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-23360146
[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011
- Author(s)
  Takafumi Fukushima, Eiji Iwata, Yuki Ohara, Mariappan Murugesan, Jichoel Bea, Kangwook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Journal Title
  
  IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY
  
  Volume: VOL.1 Issue: 12 Pages: 1873-1884
- DOI
  10.1109/tcpmt.2011.2160266
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21226009, KAKENHI-PROJECT-23360146
[Presentation] 三次元LSI とヘテロインテグレーション2013
- Author(s)
  李康旭, 福島誉史, 田中徹, 小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京工業大学, Japan
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 三次元LSIとヘテロインテグレーション2013
- Author(s)
  李康旭、福島誉史、田中徹、小柳光正
- Organizer
  第77回半導体集積回路シンポジウム
- Place of Presentation
  東京
- Invited
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013
- Author(s)
  T. Fukushima, K-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  IEEE Electrical Components Technology Conference (ECTC)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM) 2012
- Place of Presentation
  San Francisco (UAS)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of 3D Integration Technologies and Recent Challenges2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  ADMETA Plus 2012 Advanced Metallization Conference 2012
- Place of Presentation
  東京
- Year and Date
  2012-10-23
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012
- Author(s)
  Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference (3DIC) 2011
- Place of Presentation
  大阪
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012
- Author(s)
  Yuka Ito, Takafumi Fukushima, Kang-Wook Lee, Koji Choki, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  2012 International Conference on Solid State Devices and Materials (SSDM 2012)
- Place of Presentation
  京都
- Year and Date
  2012-09-26
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012
- Author(s)
  Akihiro Noriki, Kang-Wook Lee, Jicheol Bea, Takafumi Fukushima, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  IEEE International 3D System Integration Conference
- Place of Presentation
  Osaka
- Year and Date
  2012-02-01
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012
- Author(s)
  T. Fukushima, H. Hashiguchi, J. Bea, Y. Ohara, M. Murugesan, K-W. Lee, T. Tanaka and M. Koyanagi
- Organizer
  IEEE International Electron Devices Meeting (IEDM)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Self-Assembly-Based 3D Integration Technologies2012
- Author(s)
  T. Fukushima, J. Bea, M. Murugesan, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
- Place of Presentation
  東京
- Year and Date
  2012-05-22
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C Bea, T. Tanaka, and M. Koyanagi
- Organizer
  222nd ECS Meeting: PRiME (Pacific Rim Meeting) 2012
- Place of Presentation
  Hawaii (USA)
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] 3D Integration Technologies Based on Surface-Tension Driven Multi-Chip Self-Assembly Techniques2012
- Author(s)
  T. Fukushima, K-W. Lee, J-C. Bea, T. Tanaka, and M. Koyanagi
- Organizer
  the Electro Chemical Society (ESC) Meeting
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Wafer-Level 3D Integration Technology Using Self-Assembly2012
- Author(s)
  Takafumi Fukushima, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi
- Organizer
  MSPNEX (International Micro System Packaging Forum)2012
- Place of Presentation
  韓国
- Year and Date
  2012-04-12
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T.Fukushima, K.-W.Lee, T.Tanaka, M.Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  Taipei (Taiwan)
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146
[Presentation] Development of Wafer-Level 3D System Integration Technologies2011
- Author(s)
  T. Fukushima, K.-W. Lee, T. Tanaka, and M. Koyanagi
- Organizer
  International Union of Materials Research Societies-International Conference in Asia (IUMRS-ICA)
- Place of Presentation
  台湾
- Year and Date
  2011-09-20
- Data Source
  KAKENHI-PROJECT-23360146

1. FUKUSHIMA Takafumi (10374969)

# of Collaborated Projects: 1 results

# of Collaborated Products: 20 results
2. TANAKA Tetsu (40417382)

# of Collaborated Projects: 1 results

# of Collaborated Products: 20 results
3. BEA Jichel (40509874)

# of Collaborated Projects: 1 results

# of Collaborated Products: 8 results
4. MURUGESAN Mariappan (10509699)

# of Collaborated Projects: 1 results

# of Collaborated Products: 5 results
5. KOYANAGI Mitsumasa (60205531)

# of Collaborated Projects: 1 results

# of Collaborated Products: 20 results
6. 裴艶麗 (70451622)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. KIYOYAMA Koji

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

LEE KANGWOOK 李 康旭

Research Projects

Research Products

Co-Researchers

High Performance, Low Power Hetero-CMOS Device using Compound Si WaferPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Die-Level 3-D Integration Technology for Rapid Prototyping of High -Performance Multifunctionality Hetero-Integrated Systems2013

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Through-Silicon Photonic Via and Unidirectional- Coupler for High-Speed Data Transmission in Optoelectronic Three- Dimensional LSI2012

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Multichip-to-Wafer Three-Dimensional Integration Technology Using Chip Self-Assembly With Excimer Lamp Irradiation2012

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Self-Assembly of Chip-Size Components with Cavity Structures : High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration2011

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Multichip Self-Assembly Technology for Advanced Die-to-Wafer 3-D Integration to Precisely Align Known Good Dies in Batch Processing2011

Author(s)

Journal Title

DOI

Data Source

[Presentation] 三次元LSI とヘテロインテグレーション2013

Author(s)

Organizer

Place of Presentation

Data Source

[Presentation] 三次元LSIとヘテロインテグレーション2013

Author(s)

Organizer

Place of Presentation

Data Source

[Presentation] 3D Integration Based on Self-Assembly with Electrostatic Temporary Multichip Bonding2013

Author(s)

Organizer

Data Source

[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012

Author(s)

Organizer

Place of Presentation

Data Source

[Presentation] Development of 3D Integration Technologies and Recent Challenges2012

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Optoelectronic Heterogeneous Integration Technology, Using Reductant-Assisited Self-Assembly with Cu/Sn Microbump2012

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Fabrication Tolerance Evaluation of High Efficient Unidirectional Optical Coupler for Though Silicon Photonic Via in Optoelectronic 3D-LSI2012

Author(s)

Organizer

Place of Presentation

Year and Date

Data Source

[Presentation] Chip-to-Wafer 3D Integration Technology Using Hybrid Self-Assembly and Electrostatic Temporary Bonding2012

Author(s)

LEE KANGWOOK 李康旭