橋爪 正樹  hashizume masaki

Proc. of 12th IEEE CPMT Symposium Japan (ICSJ2023)

巻: - ページ: 113-116

IEEE Transactions on Components, Packaging and Manufacturing Technology

巻: 11 号: 6 ページ: 931-943

10.1109/tcpmt.2021.3079159

Proc. of 2021 International Conference on Electronics Packaging (ICEP)

巻: -

Proc. of The 35th International Technical Conference on Circuits/Systems, Computers and Communications

巻: - ページ: 141-144

IEEE Transactions on Components, Packaging and Manufacturing Technology

巻: 10 号: 5 ページ: 895-907

10.1109/tcpmt.2020.2973182

Proc. of The IEEE 2019 International 3D Systems Integration Conference

巻: 1 ページ: 1-5

10.1109/3dic48104.2019.9058777

Proc. of IEEE CPMT Symposium Japan 2018

巻: 1 ページ: 189-192

10.1109/icsj.2018.8602560

IEICE Transactions on Information and Systems

巻: E101.D 号: 8 ページ: 2053-2063

10.1587/transinf.2018EDP7093

130007429462

Proc. of IEEE CPMT Symposium Japan 2016

巻: － ページ: 139-140

Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2016

巻: － ページ: 291-294

Proc. of International Technical Conference on Circuits/Systems, Computers and Communications 2015

巻: _ ページ: 653-656

Proc. of　IEEE 3D System Integration Conference 2015

巻: _ ページ: TS8.19.1-TS8.19.6

10.1109/3dic.2015.7334588

Proc. of International Conference on Design & Concurrent Engineering 2014

巻: (to appear)

Proc. of IEEE CPMT Symposium Japan(ICSJ2013)

ページ: 247-250

Proc. of 2012 International Technical Conference on Circuits/Systems, Computers and Communications

Proc.RISP International Workshop on Nonlinear Circuit and Signal Processing

ページ: 13-16

Proc.of IEEE 11th International Symposium on Communications and Information Technologies

ページ: 58-63

RISP International Workshop on Nonlinear Circuit and Signal Processing

ページ: 13-16

Proc. of 2011 International Technical Conference on Circuits/ Systems, Computers and Communications

ページ: 1015-1018

Proc. of IEEE 11th International Symposium on Communications and Information Technologies

ページ: 58-63

10.1109/iscit.2011.6092183

Proc. of International Conference on ElectronicsPackaging 2009

ページ: 434-439

エレクトロニクス実装学会誌 Vol.12, No.2

ページ: 137-143

Proc. of 2008 International Technical Conference on Circuits/Systems, Computers and Communications

ページ: 241-244

Proc. of International Conference on Electronics Packaging 2008

ページ: 457-462

Proc. of 2008 International Technical Conference on Circuits/Systems, Computers and Communications

ページ: 1533-1536

Proc. of International Conference on Electronics Packaging

ページ: 359-364

エレクトロニクス実装学会誌 Vol.8, No.3

ページ: 219-228

110006249330

Proc. of 16th Asian Test Symposium

ページ: 399-403

Proc. of IEEE International Workshop on Current and Defect Based Testing

ページ: 25-29

Proc. of IEEE International Workshop on Current and Defect Based Testing

ページ: 25-29

IEEE 6-th International Board Test Workshop

http://www.molesystems.com/BTW/material/BTW07//Papers/BTW07-Paper%202.3.pdf,

Proc. of IEEE 16th Asian Test Symposium

ページ: 399-403

the IEEE European Board Test Workshop

http://www.molesystems.com/BTW/material/EBTW06//EBTW06%20Papers/EBTW06-4-1-Hashizume.pdf

Proc. of IEEE 7th Workshop on RTL and High Level Testing

ページ: 123-127

IEEE European Board Test Workshop 2006

Proc. of International Conference on Electronics Packaging (to appear)

Proc. of the 2006 International Conference on Electronics Packaging (to appear)

Proc. of International Conference on Electronics Packaging

ページ: 147-152

Proc. of IEEE International Workshop on Current and Defect Based Testing

ページ: 39-42

Proceedings of International Conference on Electronics Packaging 2006

ページ: 147-152

Proc.of International Conference on Electronics Packaging (to appear)

Proc.of IEEE International Symposium on Circuits and Systems

ページ: 2995-2998

Proc.of IEEE International Symposium on Circuits and Systems (to appear)

Proc.of International Conference on Electronics Packaging

ページ: 391-396

Proc. of IEEE International Symposium on Circuits and Systems

ページ: 2995-2998

Proc. of the 2005 International Conference on Electronics Packaging

ページ: 391-396

Proc. of International Conference on Electronics Packaging

ページ: 391-396

Proc. of the IEEE International Symposium on Circuits and Systems

ページ: 2995-2998

Proc.of International Conference on Electronics Packaging (to appear)

Proc of IEEE International Workshop on Electronic Design, Test and Applications

ページ: 197-200

Proc.of IEEE International Workshop on Electronic Design, Test and Applications

ページ: 197-200

Proc. of the IEEE International Workshop on Electronic Design, Test and Applications

ページ: 197-200

IEICE Transaction on Information and Systems E87-D・3

ページ: 571-579

110003213913

Proc.of the IEEE 2^<nd> International Workshop on Electronic Design, Test & Application

ページ: 183-188

Proc.of the 13-th IEEE Asian Test Symposium

ページ: 112-117

Proc. of the IEEE 47-th Midwest Symposium on Circuits and Systems

ページ: 1557-1560

Proc. of the 13-th IEEE Asian Test Symposium

ページ: 112-117

Proc.of the IEEE 47-th Midwest Symposium on Circuits and Systems

ページ: 1557-1560

Proc.of the second IEEE International Workshop on Electronic Design, Test, and Applications

ページ: 183-188

Proc.of the 13-th IEEE Asian Test Symposium

ページ: 112-117

IEICE Transactions on Information and Systems Vol.E87-D, No.3

ページ: 571-579

110003213913

Proc. of the second IEEE International Workshop on Electronic Design, Test, and Applications

ページ: 183-188

Proc.of the 12-th IEEE Asian Test Symposium

ページ: 390-395

Proc.of the 2003 International Technical Conference on Circuits/Systems, Computers and Communications

ページ: 836-839

Proc.of the 2003 International Conference on Electronics Packaging

ページ: 75-80

Proc. of the 2003 International Conference on Electronics Packaging

ページ: 75-80

Proc. of the 2003 International Technical Conference on Circuits/Systems, Computers and Communications

ページ: 836-839

Journal of Japan Institute of Electronics Packaging Vol.6, No.7

ページ: 564-572

10013959093

エレクトロニクス実装学会誌 6・7

ページ: 564-572

10013959093

Proc. of the 12-th IEEE Asian Test Symposium

ページ: 390-395