鈴木 研  Suzuki Ken

Proc. ASME IMECE2022

巻: 12

10.1115/imece2022-95307

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2021-70108

130008093349

Proc. of International Conference on Electronic Packaging

巻: - ページ: 81-82

10.23919/icep55381.2022.9795457

Proc. ASME 2022 International Mechanical Engineering Congress and Exposition

巻: 9 ページ: 1-7

10.1115/imece2022-94892

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2021-70628

Mechanics of Solids, Structures, and Fluids

巻: 12 ページ: 1-7

10.1115/imece2021-68489

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2020-23354

International Mechanical Engineering Congress & Exposition (IMECE 2021), Proceedings,

巻: IMECE2021

10.1115/imece2021-70930

International Mechanical Engineering Congress & Exposition (IMECE 2021), Proceedings,

巻: IMECE2021 ページ: 1-6

10.1115/imece2021-69917

Nanomaterials

巻: 11 号: 7 ページ: 1701-1701

10.3390/nano11071701

International Conference on Theoretical, Applied and Experimental Mechanics, proceeding

巻: NO. IMECE2020 ページ: 325-331

10.1007/978-3-030-47883-4_58

International Conference on Theoretical, Applied and Experimental Mechanics, proceeding

巻: NO. IMECE2020-24473 ページ: 1-6

10.1115/imece2020-24473

International Mechanical Engineering Congress & Exposition (IMECE) 2020, Proceedings

巻: 13 ページ: 1-7

10.1115/imece2020-23782

International Mechanical Engineering Congress & Exposition (IMECE) 2020, Proceedings

巻: 3 ページ: 1-7

10.1115/imece2020-23581

130008003892

2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

巻: 2019 ページ: 141-144

10.1109/sispad.2019.8870398

Japanese Journal of Applied Physics

巻: 58 号: SB ページ: SBBC04-SBBC04

10.7567/1347-4065/ab00f4

210000135441

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11106

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11107

Mechanics of Solids, Structures, and Fluids

巻: 9

10.1115/imece2019-11186

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11076

Mechanics of Solids, Structures, and Fluids

巻: 10

10.1115/imece2019-11210

Key Engineering Materials

巻: 774 ページ: 31-35

10.4028/www.scientific.net/kem.774.31

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2018-87277

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2018-87275

Structural Integrity

巻: 5 ページ: 227-232

10.1007/978-3-319-91989-8_49

Simulation of Semiconductor Processes and Devices

巻: 2018 ページ: 88-91

10.1109/sispad.2018.8551672

Journal of Electronic Packaging

巻: 139(2) 号: 2

10.1115/1.4036442

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

10.1115/imece2017-70318

Key Engineering Materials

巻: 754 ページ: 31-34

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 9

10.1115/imece2017-70494

130006726909

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 9

10.1115/imece2017-70302

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

10.1115/imece2017-70388

Applied Surface Science

巻: 366 ページ: 219-226

Japanese Journal of Applied Physics

巻: 55 号: 4S ページ: 1-9

10.7567/jjap.55.04ep05

210000146412

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

Structural Integrity Procedia

巻: 2 ページ: 1383-1390

10.1016/j.prostr.2016.06.176

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

Proceedings of International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

巻: IPACK2015-48197 ページ: 1-6

10.1115/ipack2015-48197

AIP Advances

巻: 5

Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

巻: No. 73149 ページ: 1-6

Proc. of IEEE SISPAD 2013

ページ: 396-399

Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS

巻: 査読有 ページ: 864-865

Proc. of 18th International Conference on Simulation of Semiconductor Processes and Devices

巻: 18 ページ: 264-267

Proc. of IEEE 62^<nd> Electronic Components and Technology Conference

ページ: 1153-1158

Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS

巻: G7 ページ: 864-865

Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

巻: 12 ページ: 1-6

Proc. of IEEE the 63rd Eelectronic Components and Technology Conference

巻: 63 ページ: 635-640

Proc. of IEEE ECTC2013

ページ: 635-640

Japanese Journal of Applied Physics

巻: vol. 52

210000141977

JAPANESE JOURNAL OF APPLIED PHYSICS

巻: 52

Proc. of the 18^<th> International Conference on Simulation of Semiconductor Processes and Devices

巻: No. P18 ページ: 264-267

Proc. of Nanotech 2012

巻: Vol.1 ページ: 260-263

Proc. of IEEE SISPAD2012

巻: 1 ページ: 86-89

Proc. of ,ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)

巻: No.87347 ページ: 1-6

Proc. of IEEE Nanotech 2012

巻: 1 ページ: 260-263

日本機械学会論文集(A編)

巻: 78巻 ページ: 689-693

130002050294

Proc. of IEEE 62nd Electronic Components and Technology Conference

巻: 1 ページ: 1153-1158

Proc. of ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)

巻: 1

日本機械学会論文集（A編）

巻: 78 ページ: 689-693

130002050294

Proc. of IEEE SISPAD2012

巻: 1 ページ: 396-399

Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011

ページ: 508-509

日本機械学会論文集(A編)

巻: 77巻 ページ: 91-95

130000874066

Proc. of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS & EXPOSITION 2011

巻: No.IMECE2011-62411 ページ: 1-6

Proc. of International Conference on Advanced Technology in Experimental Mechanics 2011

巻: No.OS20-3-2 ページ: 1-8

130002050294

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52062 ページ: 1-6

Proc.of International Conference on Advanced Technology in Experimental Mechanics

巻: OS20

Proc. of International Conference on Advanced Technology in Experimental Mechanics

巻: No.OS20 ページ: 1-9

Proc. of ASME InterPACK2011

巻: No.52064 ページ: 1-6

Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52064 ページ: 1-6

Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011

130002050294

日本機械学会論文集(A編)

巻: 77 ページ: 91-95

130000874066

Proc.of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS&EXPOSITION 2011

巻: IMECE2011

Proc. of ASME InterPACK2011 , Multi Physics Based Reliability

巻: No.52057 ページ: 1-6

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52057 ページ: 1-6

Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011

ページ: 504-505

Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: IMECE2010-37277 ページ: 1-6

Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: IMECE2010-37284

Journal of Solid Mechanics and Materials Engineering

巻: Vol.4 ページ: 1644-1653

130000420993

Proc.of 11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems

ページ: 641-646

Proc.of 12^<th> International Conference on Electronics Materials and Packaging

ページ: 131-136

Journal of Solid Mechanics and Materials Engineering

巻: 4 ページ: 1644-1653

130000420993

Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: No.37277 ページ: 1-6

Proc.of the 60^<th> Electronic Components and Technology Conference

ページ: 1951-1956

Journal of Solid Mechanics and Materials Engine Bring

巻: 4 ページ: 1644-1653

130000420993

2010MATERIALS RESEARCH SOCIETY SPRING MEETING

巻: Y6

Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: No.IMECE2011-37284 ページ: 1-6

Proc.of 12^<th> International Conference on Electronics Materials and Packaging

ページ: 117-123

Proc.of IMPACT Conference 2010

巻: AS015 ページ: 1-4

Proc. of 2010 MATERIALS RESEARCH SOCIETY SPRING MEETING

巻: Vol.Y6 ページ: 1-6

Journal of Solid Mechanics and Materials Engineering 3

ページ: 487-497

130000106326

Proceedings of the ASME 2009 Inter PACK Conference

巻: No.89146 ページ: 1-6

Corrosion Science 51

ページ: 908-913

Journal of Solid Mechanics and Materials Engineering 3

ページ: 487-497

130000106326

Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials

ページ: 1126-1127

Proc.of 2009 IEEE International Reliability Physics Symposium 4A. 6

ページ: 376-381

120002070092

Corrosion Science 50(6)

ページ: 1701-1706

Proceeding of The 4th International Symposium on Nano technology

ページ: 130-131