赤池 正剛  AKAIKW Masatake

Japanese Journal of Applied Physics 56, 04CC01 (2017)

巻: 56 号: 4S ページ: 04CC01-04CC01

10.7567/jjap.56.04cc01

210000147553

Japanese Journal of Applied Physics

巻: 54 号: 3 ページ: 030217-030217

10.7567/jjap.54.030217

210000144828

IEEE Transactions on Components, Packaging, and Manufacturing Technology

巻: 6 号: 6 ページ: 951-956

10.1109/tcpmt.2014.2315761

Proc. International Conference on Electronics Packaging (in press)

130004589249

Proc. International Conference on Electronics Packaging (印刷中)

130004589249

第22回エレクトロニクス実装学会講演大会講演論文集

ページ: 235-236

Proc. 22^<nd> JIEP Annual Meeting

ページ: 235-236

130004589249

第22回エレクトロニクス実装学会講演大会講演論文集

ページ: 235-236

130004589249

Proceedings of SPIE Vol.6717

Proc. of Electronic Components and Technology Conference

ページ: 1815-1818

Proc. of Electronic Components and Technology Conference

ページ: 1815-1818

Proc. of 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

ページ: 41-44

Proc. of 6th International IEEE Conference on Polymersand Adhesives in Microelectronics and Photonics

ページ: 41-44

Proceedings of SPIE Vol. 6717

Proceedings of SPIE Vol. 6717