三浦 英生  Miura Hideo

Mechanics of Solids, Structures and Fluids

巻: 11

10.1115/imece2023-112200

Proc. ASME IMECE2022

巻: 12

10.1115/imece2022-94282

International Journal of Fatigue

巻: 175 ページ: 107798-107798

10.1016/j.ijfatigue.2023.107798

Proc. ASME IMECE2022

巻: 12

10.1115/imece2022-95307

Materials Characterization

巻: 204 ページ: 113209-113209

10.1016/j.matchar.2023.113209

Proc. ASME IMECE2022

巻: 14

10.1115/imece2022-94273

Reliability Engineering and System Safety

巻: 240 ページ: 109550-109550

10.1016/j.ress.2023.109550

Proc. ASME IMECE2022

巻: 12

10.1115/imece2022-94701

ournal of Fatigue & Fracture of Engineering Materials & Structures

巻: 46 号: 8 ページ: 14013-14013

10.1111/ffe.14013

Journal of Manufacturing Processes

巻: 77 ページ: 412-425

10.1016/j.jmapro.2022.03.026

Fatigue & Fracture of Engineering Materials & Structures

巻: 45 号: 10 ページ: 3086-3101

10.1111/ffe.13794

Micro- and Nano-Systems Engineering and Packaging

巻: 12

10.1115/imece2021-70172

Royal Society of Chemistry (RSC) Advances

巻: 12 号: 34 ページ: 21770-21779

10.1039/d2ra03292a

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2021-70108

130008093349

International Journal of Fatigue

巻: 154 ページ: 106522-106522

10.1016/j.ijfatigue.2021.106522

J. of Materials Research and Technology

巻: 23 ページ: 114-130

10.1016/j.jmrt.2022.12.094

Reliability Engineering & System Safety

巻: 225 ページ: 108523-108523

10.1016/j.ress.2022.108523

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2021-70628

Journal of Physics: Condensed Matter

巻: 34 号: 50 ページ: 505301-505301

10.1088/1361-648x/ac9c3e

Proc. of International Conference on Electronic Packaging

巻: - ページ: 81-82

10.23919/icep55381.2022.9795457

Journal of Fatigue

巻: 166 ページ: 103337-103337

10.1016/j.ijfatigue.2022.107277

Mechanics of Solids, Structures, and Fluids

巻: 12 ページ: 1-7

10.1115/imece2021-68489

Mechanics of Solids, Structures, and Fluids

巻: 12

10.1115/imece2020-23354

International Mechanical Engineering Congress & Exposition (IMECE 2021), Proceedings,

巻: IMECE2021 ページ: 1-6

10.1115/imece2021-69917

Engineering Fracture Mechanics

巻: 253 ページ: 107859-107859

10.1016/j.engfracmech.2021.107859

Proc. of 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

巻: 2021 ページ: 171-174

10.1109/sispad54002.2021.9592548

Nanomaterials

巻: 11 号: 7 ページ: 1701-1701

10.3390/nano11071701

International Journal of Fatigue

巻: 143 ページ: 106031-106031

10.1016/j.ijfatigue.2020.106031

International Journal of Mechanical Sciences

巻: 206 ページ: 106628-106628

10.1016/j.ijmecsci.2021.106628

International Journal of Fatigue

巻: 149 ページ: 106227-106227

10.1016/j.ijfatigue.2021.106227

International Conference on Theoretical, Applied and Experimental Mechanics, proceeding

巻: NO. IMECE2020 ページ: 325-331

10.1007/978-3-030-47883-4_58

Corrosion Science

巻: 163 ページ: 108251-108251

10.1016/j.corsci.2019.108251

International Conference on Theoretical, Applied and Experimental Mechanics, proceeding

巻: NO. IMECE2020-24473 ページ: 1-6

10.1115/imece2020-24473

International Conference on Theoretical, Applied and Experimental Mechanics, proceeding

巻: NO. IMECE2020-23738 ページ: 1-6

10.1115/imece2020-23738

Mechanics of Solids, Structures, and Fluids

巻: 10

10.1115/imece2019-11210

2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

巻: 2019 ページ: 141-144

10.1109/sispad.2019.8870398

Japanese Journal of Applied Physics

巻: 58 号: SB ページ: SBBC04-SBBC04

10.7567/1347-4065/ab00f4

210000135441

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11106

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11107

Mechanics of Solids, Structures, and Fluids

巻: 9

10.1115/imece2019-11186

Micro- and Nano-Systems Engineering and Packaging

巻: 10

10.1115/imece2019-11076

Journal of Alloys and Compounds

巻: 746 ページ: 482-489

10.1016/j.jallcom.2018.02.297

Materials Science and Engineering: A

巻: 733 ページ: 108-116

10.1016/j.msea.2018.07.006

Materials: Genetics to Structures

巻: 12

10.1115/imece2018-87278

Materials Characterization

巻: 142 ページ: 195-202

10.1016/j.matchar.2018.05.034

Simulation of Semiconductor Processes and Devices

巻: 2018 ページ: 88-91

10.1109/sispad.2018.8551672

Key Engineering Materials

巻: 774 ページ: 31-35

10.4028/www.scientific.net/kem.774.31

Mechanics of Solids, Structures, and Fluids

巻: 9

10.1115/imece2018-87264

Mechanics of Solids, Structures, and Fluids

巻: 9

10.1115/imece2018-87368

Structural Integrity

巻: 5 ページ: 227-232

10.1007/978-3-319-91989-8_49

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 9

10.1115/imece2017-70494

130006726909

Advances in Fracture and Damage Mechanics

巻: XVI ページ: 31-34

10.4028/www.scientific.net/kem.754.31

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 9

10.1115/imece2017-70302

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

10.1115/imece2017-70318

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: I

10.1115/imece2017-72139

Key Engineering Materials

巻: 754 ページ: 31-34

Journal of Electronic Packaging

巻: 139(2) 号: 2

10.1115/1.4036442

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

ASME 2017 International Mechanical Engineering Congress and Exposition

巻: 10

10.1115/imece2017-70388

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

Applied Surface Science

巻: 366 ページ: 219-226

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

Structural Integrity Procedia

巻: 2 ページ: 1383-1390

10.1016/j.prostr.2016.06.176

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

Japanese Journal of Applied Physics

巻: 55 号: 4S ページ: 1-9

10.7567/jjap.55.04ep05

210000146412

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

ASME2016 International Mechanical Engineering Congress and Exposition IMECE2016, Proceedings

巻: IMECE2016

AIP Advances

巻: 5

Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS

巻: 査読有 ページ: 864-865

Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

巻: No. 73149 ページ: 1-6

Proc. of IEEE SISPAD 2013

ページ: 396-399

Proc. of IEEE 62^<nd> Electronic Components and Technology Conference

ページ: 1153-1158

Proc. of ASME2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

巻: 12 ページ: 1-6

Proc. of IEEE 63rd ECTC

巻: Vol.63 ページ: 635-640

10.1109/ectc.2013.6575640

Japanese Journal of Applied Physics

巻: vol. 52

210000141977

JAPANESE JOURNAL OF APPLIED PHYSICS

巻: 52

Proc. of 18th International Conference on Simulation of Semiconductor Processes and Devices

巻: 18 ページ: 264-267

Proc. of 2013 Inter Conference on SOLID STATE DEVICES AND MATERIALS

巻: G7 ページ: 864-865

Proc. of IEEE the 63rd Eelectronic Components and Technology Conference

巻: 63 ページ: 635-640

Proc. of ASME IMECE2013

巻: 2013-73150

Proc. of IEEE ECTC2013

ページ: 635-640

電子情報通信学会論文誌C

巻: J96-C ページ: 400-408

Proc. of the 18^<th> International Conference on Simulation of Semiconductor Processes and Devices

巻: No. P18 ページ: 264-267

Proc. of Nanotech 2012

巻: Vol.1 ページ: 260-263

J. of Electronic Packaging

巻: VOL.134(2) 号: 2

10.1115/1.4006142

Proc. of IEEE 62nd Electronic Components and Technology Conference

巻: - ページ: 1153-1158

10.1109/ectc.2012.6248981

Proc. of ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)

巻: 1

日本機械学会論文集（A編）

巻: 78 ページ: 689-693

130002050294

Proc. of IEEE SISPAD2012

巻: 1 ページ: 396-399

電子情報通信学会論文誌C

巻: J95-C ページ: 351-357

110009543936

Proc. of IEEE Nanotech 2012

巻: 1 ページ: 260-263

日本機械学会論文集(A編)

巻: 78巻 ページ: 689-693

130002050294

Proc. of IEEE 62nd Electronic Components and Technology Conference

巻: 1 ページ: 1153-1158

Proc. of IEEE SISPAD2012

巻: 1 ページ: 86-89

Proc. of ,ASME 2012 International Mechanical Engineering Congress & Exposition, (IMECE2012)

巻: No.87347 ページ: 1-6

Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011

ページ: 508-509

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52062 ページ: 1-6

Proc. of ASME InterPACK2011

巻: No.52064 ページ: 1-6

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52064 ページ: 1-6

Proc.of ASME Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems

巻: IPACK52057 ページ: 1-6

Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: IMECE2010-37277 ページ: 1-6

Proc. of International Conference on Advanced Technology in Experimental Mechanics 2011

巻: No.OS20-3-2 ページ: 1-8

130002050294

日本機械学会論文集(A編)

巻: 77 ページ: 91-95

130000874066

Proc. of ASME InterPACK2011 , Multi Physics Based Reliability

巻: No.52057 ページ: 1-6

日本機械学会論文集(A編)

巻: 77巻 ページ: 91-95

130000874066

Proc.of International Conference on Advanced Technology in Experimental Mechanics

巻: OS20

Proc. of International Conference on Advanced Technology in Experimental Mechanics

巻: No.OS20 ページ: 1-9

Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011

Proc.of International Conference on Advanced Technology in Experimental Mechanics 2011

130002050294

Proc.of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS&EXPOSITION 2011

巻: IMECE2011

Proc. of ASEM INTERNATIONAL MECHANICAL ENGINEERING CONGRESS & EXPOSITION 2011

巻: No.IMECE2011-62411 ページ: 1-6

Proc.of日本機械学会M&M2011

巻: 8 ページ: 1-3

Proc. of日本機械学会M & M2011

巻: Vol.8 ページ: 1-3

Proc.of International Conference on SOLID STATE DEVICES AND MATERIALS 2011

ページ: 504-505

Proc.of 12^<th> International Conference on Electronics Materials and Packaging

ページ: 131-136

Proc.of the 60^<th> Electronic Components and Technology Conference

ページ: 1951-1956

Proc.of the 60^<th> Electronic Components and Technology Conference

ページ: 1951-1956

Proc.of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: IMECE2010-37284

Journal of Solid Mechanics and Materials Engineering

巻: Vol.4 ページ: 1644-1653

130000420993

Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: No.37277 ページ: 1-6

Proc. of 2010 ASME International Mechanical Engineering Congress and Exposition

巻: No.IMECE2011-37284 ページ: 1-6

Proc.of IMPACT Conference 2010

巻: AS015 ページ: 1-4

Proc. of 2010 MATERIALS RESEARCH SOCIETY SPRING MEETING

巻: Vol.Y6 ページ: 1-6

Proc.of 11th International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems

ページ: 641-646

Journal of Solid Mechanics and Materials Engineering

巻: 4 ページ: 1644-1653

130000420993

Journal of Solid Mechanics and Materials Engine Bring

巻: 4 ページ: 1644-1653

130000420993

2010MATERIALS RESEARCH SOCIETY SPRING MEETING

巻: Y6

Proc.of 11tn International conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro/Nanoelectronics and Systems

ページ: 641-646

Proc.of 12^<th> International Conference on Electronics Materials and Packaging

ページ: 117-123

日本機械学会論文集(A編) 75

ページ: 831-838

Transaction of the Japan Institute of Electronics Packaging 2

ページ: 91-97

130000254840

IEEE Journal of Selected Topics in Quantum Electronics Vol.15

NDT & E International 42

ページ: 188-192

Proceedings of the ASME 2009 Inter PACK Conference

巻: No.89146 ページ: 1-6

NDT&E International 42巻

ページ: 188-192

エレクトロニクス実装学会誌 12

ページ: 519-525

110007339289

エレクトロニクス実装学会誌 12

ページ: 623-628

110007465806

Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials E8-5

ページ: 1126-1127

J. of Solid Mechanics and Materials Engineering 3

ページ: 487-497

130000106326

Key Engineering Materials 417-418

ページ: 261-264

NDT&E International 42巻

ページ: 188-192

Extended Abstracts of the 2009 International Conference on Solid State Devices and Materials

ページ: 1126-1127

NDT & E International 42

ページ: 188-192

Proc.of the ASME 2009 Inter PACK Conference IP09-89145

ページ: 1-6

Proc.of the ASME 2009 Inter PACK Conference IP09-89146

ページ: 1-6

J. of Solid Mechanics and Materials Engineering 3

ページ: 498-506

130000106327

Proc.of 2009 IEEE International Reliability Physics Symposium 4A. 6

ページ: 376-381

120002070092

Journal of Optics A : Pure and Applied Optics Vol.10

Journal of Optics A 10

(社)電子情報通信学会 信学技報 CPM2006-140

ページ: 67-72

110006202417

(社)電子情報通信学会 信学技報 CPM2006-140

ページ: 67-72

IEICE Technical Report Vol.CPM2006-140

ページ: 67-72

110006202417

エレクトロニクス実装学会誌 9・3

ページ: 152-156

110004724977

Right holder : Tohoku Technoarch Co., Ltd Application number: 2006-132395

日本機械学会論文集 72・717A

ページ: 595-601

110004731569

Asian Pacific Conference on Fracture and Strength of Materials (CDROM)

ページ: 1-4

日本機械学会論文集A編 72・717

ページ: 595-601

110004731569

Transactions of the Japan Society of Mechanical Engineers Vol.72, No.717A

ページ: 595-601

Proceeding of The 4th International Symposium on Nanotechnology

ページ: 130-131

Journal of Japan Institute of Electronics Packaging Vol.9, No.3

ページ: 152-156

110004724977

電子情報通信学会論文誌 Vol.J88-C, No.11

ページ: 859-865

2005 International Symposium on Electronics Materials and Packaging

ページ: 220-225

Proceedings of 2004 ASME International Mechanical Engineering Congress and RD&D Expo (CD-ROM)

Proceedings of 2004 ASME International Mechanical Engineering Congress and RD＆D Expo IMECE-6250(CDROM)

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Proceedings of 2004 ASME International Mechanical Engineering Congress and RD＆D Expo No.IMECE-62500(CDROM)

ページ: 1-6