兼本 大輔  KANEMOTO Daisuke

Japanese Journal of Applied Physics

巻: 63 号: 3 ページ: 03SP33-03SP33

10.35848/1347-4065/ad1f0e

Japanese Journall of Appled Physics

巻: 63 号: 2 ページ: 02SP96-02SP96

10.35848/1347-4065/ad202e

Japanese Journal of Applied Physics

巻: 63 号: 3 ページ: 03SP54-03SP54

10.35848/1347-4065/ad264f

Japanese Journal of Applied Physics

巻: 63 号: 3 ページ: 03SP87-03SP87

10.35848/1347-4065/ad29ea

Solid State Devices and Materials (SSDM) 2023

巻: -

10.7567/ssdm.2023.ps-12-04

2023 IEEE International Symposium on Circuits and Systems (ISCAS)

巻: - ページ: 1-5

10.1109/iscas46773.2023.10182130

Japanese Journal of Applied Physics

巻: 62 号: SC ページ: SC1082-SC1082

10.35848/1347-4065/acba22

Japanese Journal of Applied Physics

巻: 62 号: SC ページ: SC1071-SC1071

10.35848/1347-4065/acb77e

Solid State Devices and Materials (SSDM) 2023

巻: -

10.7567/ssdm.2023.ps-12-03

光学

巻: 52 ページ: 439-441

Proceedings of ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC)

巻: - ページ: 325-328

10.1109/esscirc59616.2023.10268819

IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences

巻: E105.A 号: 10 ページ: 1429-1433

10.1587/transfun.2021EAL2099

IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences

巻: (in press)

130007948373

Proceedings of the IEEE Vehicular Technology Conference Spring 2015

巻: 5 ページ: 1-5

10.1109/vtcspring.2015.7145796

International Symposium on Consumer Electronics 2014

巻: 2014-06 ページ: 1-2

10.1109/isce.2014.6884368

IEEE Symposium on Low-Power and High-Speed Chips (COOL Chips XVII)

巻: 2014-04 ページ: 1-1