HONMA Hideo 本間英夫

Researcher Number	00064105
Other IDs
Affiliation *help	2018 : 関東学院大学, 総合研究推進機構, 教授 2016 – 2017 : 関東学院大学, 材料・表面工学研究所, 名誉教授 2002 – 2004 : 関東学院大学, 工学部, 教授 1996 – 1997 : 関東学院大学, 工学部, 教授
Review Section/Research Field	Principal Investigator Material processing/treatments
Keywords	Principal Investigator DMAB / Electroless Nickel Plating / 微細銅パターン / ビアホール / ビルドアップ / Initial Deposition / 環境 / めっき / build up / 無電解金めっき … More

Research Projects
(2results)
Research Products
(5results)

Preparation of functional properties on the substrate for electronics by environmentally friendly surface modification.Principal Investigator
- Principal Investigator
  
  HONMA Hideo
- Project Period (FY)
  2002 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Kanto Gakuin University
Fabrication of Micro Bump Using Electroless PlatingPrincipal Investigator
- Principal Investigator
  
  HONMA Hideo
- Project Period (FY)
  1996 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Kanto Gakuin University

All 2005 2004 Other

All Journal Article

[Journal Article] TiO_2及びUVを適用したクロムフリーABS樹脂めっき方法2005
- Author(s)
  田代雄彦, 杉本将治, 渡邉健治, 別所毅, 本間英夫
- Journal Title
  
  エレクトロニクス実装学会誌 8・2
  
  Pages : 133-139
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-14550712
[Journal Article] TiO_2及びUVを適用したクロムフリーABS樹脂めっき方法2005
- Author(s)
  田代雄彦, 杉本将治, 渡邉健治, 別所毅, 本間英夫
- Journal Title
  
  エレクトロニクス実装学会誌 8・2
  
  Pages : 133-139
- Data Source
  KAKENHI-PROJECT-14550712
[Journal Article] TiO_2光触媒を用いたビルドアップ絶縁樹脂材料の表面改質とめっき法への応用2004
- Author(s)
  渡邉健治, 藤村翼, 西脇泰二, 田代雄彦, 本間英夫
- Journal Title
  
  エレクトロニクス実装学会誌 7・2
  
  Pages : 136-140
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-14550712
[Journal Article] New Chromium Free Pretreatment Method for Plating on ABS Resin Using TiO_2 under UV Light Irradiation.
- Author(s)
  Katsuhiko TASHIRO
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging 8, 2
  
  Pages : 133-139
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-14550712
[Journal Article] Surface Modification of Insulation Resin for Build-up Process Using TiO2 as a Photcatalyst and Its Application to the Metallization
- Author(s)
  Kenji WATANABE
- Journal Title
  
  Journal of Japan Institute of Electronics Packaging 7, 2
  
  Pages : 136-140
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-14550712

HONMA Hideo 本間 英夫

Research Projects

Research Products

Preparation of functional properties on the substrate for electronics by environmentally friendly surface modification.Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Fabrication of Micro Bump Using Electroless PlatingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] TiO_2及びUVを適用したクロムフリーABS樹脂めっき方法2005

Author(s)

Journal Title

Description

Data Source

[Journal Article] TiO_2及びUVを適用したクロムフリーABS樹脂めっき方法2005

Author(s)

Journal Title

Data Source

[Journal Article] TiO_2光触媒を用いたビルドアップ絶縁樹脂材料の表面改質とめっき法への応用2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] New Chromium Free Pretreatment Method for Plating on ABS Resin Using TiO_2 under UV Light Irradiation.

Author(s)

Journal Title

Description

Data Source

[Journal Article] Surface Modification of Insulation Resin for Build-up Process Using TiO2 as a Photcatalyst and Its Application to the Metallization

Author(s)

Journal Title

Description

Data Source

HONMA Hideo 本間英夫