HARA Tohru 原徹

… Alternative Names

原徹ハラトオル

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Researcher Number	00147886
Affiliation (based on the past Project Information) *help	2000 – 2004: 法政大学, 工学部, 教授 1994 – 1997: 法政大学, 工学部, 教授 1989 – 1991: 法政大学, 工学部, 教授 1987: Dipartment of Electrical Engineering. Professor, 工学部, 教授 1986: 法政大, 工学部, 教授
Review Section/Research Field	Principal Investigator Electronic materials/Electric materials / 電子材料工学 / Electronic materials/Electric materials
Keywords	Principal Investigator LSI / 高速化 / CMP / 銅配線 / 配線層 / Delamination / イオン注入 / 薄膜 / Ohmic contact / シリコン … More / Interconnection / Gate / Ion implantation / Silicide / フジュンブツブンプ / イオンチュウニュウ / デンキョク / 不純物プロファイル / 配線 / ゲート電極 / タングステン / シリサイド / Copper-hexafluoro-silicate electrolytic solution / Low resistivity Cu layer / Electroplating / High speed logic LSI / Cu interconnection layer / LSI's / 比抵抗 / 銅メッキ / 超LSI / 核生成制御 / 比抵抗低減 / メッキ膜 / ケイフッ化銅メッキ液 / 低比抵抗銅膜 / メッキ / 銅配線層 / planarizatrion / Adhesion strength / Thermal stability / Cu interconnection / Low ε interlayer / LSI層間絶縁膜 / 定着力向上 / 耐熱性向上 / 多層配線層 / 超LSI高速化 / 耐熱性 / 低誘電率膜 / 平坦化 / 密着力 / 界面反応 / 高速LSI / 低誘電率層間膜 / Thin layr / Sol / Si / H / Ion Implantation / ハクマク / はく離 / デラミネーション / SOI / 水素イオン / Conformality / Ta / Target / Beam distribution / Collimation / Sputtering / カクドブンプ / マクシツ / チタン / コリメータ / ビーム角 / メタル膜 / オーミックコンタクト / コンフオマリティ / チタンマク / ターゲット / コリメーション / スパッタ / 自然酸化膜除去法 / 自然酸化膜評価法 / VLSIプロセス技術 / シリコン表面 / シリコン酸化膜 / ハンドウタイプロセス / ヒョウメンブツリ / ミゼンサンカマク / ヒョウメン / ECRブラズマエッチング / 反応性イオンエッチング / 酸化膜窓開け / エッチングダメ-ジ / エッチング / 自然酸化膜 Less

An Electroplating of Low Resistivity Copper Interconnection LinesPrincipal Investigator
- Principal Investigator
  
  HARA Tohru
- Project Period (FY)
  2003 – 2004
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Hosei University
Thermally stable low dielectric constant interlayers for high speed MOS LSI'sPrincipal Investigator
- Principal Investigator
  
  HARA Tohru
- Project Period (FY)
  2000 – 2002
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Hosei University
Fundamental Research of the Delamination by H^+ ImplantationPrincipal Investigator
- Principal Investigator
  
  HARA Tohru
- Project Period (FY)
  1996 – 1997
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Hosei Univ.
Fundamental Study on The Collimation SputteringPrincipal Investigator
- Principal Investigator
  
  HARA Tohru
- Project Period (FY)
  1994 – 1995
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  Electronic materials/Electric materials
- Research Institution
  Hosei University
シリコン結晶書面に形成される薄い自然酸化膜に関する研究Principal Investigator
- Principal Investigator
  
  原徹
- Project Period (FY)
  1989 – 1991
- Research Category
  
  Grant-in-Aid for General Scientific Research (C)
- Research Field
  
  電子材料工学
- Research Institution
  Hosei University
Ion Implantation in Sillicides and MetalsPrincipal Investigator
- Principal Investigator
  
  HARA Tohru
- Project Period (FY)
  1986 – 1987
- Research Category
  
  Grant-in-Aid for General Scientific Research (B)
- Research Field
  
  電子材料工学
- Research Institution
  Hosei University

All 2005 2004

All Journal Article

[Journal Article] Resistivity in Thin Copper Interconnection Layers2005
- Author(s)
  T.Hara, Y.Shimura, K.Namiki
- Journal Title
  
  Japan J Appl.Phys. 44,13(未定)
- NAID
  10015474077
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Resistivity in Thin Copper Interconnection Layers2005
- Author(s)
  T.Hara, Y.Shimura, K.Namiki
- Journal Title
  
  Japan J Appl.Phys. 44,13
  
  Pages: 408-411
- NAID
  10015474077
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Resistivity of Thin Copper Interconnection Layers2005
- Author(s)
  T.Hara, Y.Shimura, K.Namiki
- Journal Title
  
  Japan J.of Appl.Phys. Vol.44, No.13
- NAID
  10015474077
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers2004
- Author(s)
  Balakumar, T.Hara, M.Uchida
- Journal Title
  
  Electrochem. Solid-State Lett 7
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of TaSiN Barrier Layer Composition on Resistivity of Electroplated Copper Interconnection Layers2004
- Author(s)
  T.Hara, K.Namiki
- Journal Title
  
  Electrochem.Solid-State Lett. 7
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Peeling and Delamination in Cu/Silk process during Cu-CMP2004
- Author(s)
  S.Balakumar, R.Kumar, T.Hara, F.Shimura
- Journal Title
  
  Thin Solid Films 462-463
  
  Pages: 192-198
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers2004
- Author(s)
  Balakumar, T.Hara, M.Uchida
- Journal Title
  
  Electrochem.Solid-State Lett 7
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Peeling and Delamination in Cu/Silk process during Cu-CMP2004
- Author(s)
  S.Balakumar, X.T.Chen, Y.W.Chen, T.Selvaraj, B.F.Lin, R.Kumar, T.Hara, M.Fujimoto, F.Shimura
- Journal Title
  
  Thin Solid Films Vol.462-463
  
  Pages: 161-167
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Peeling and Delamination in Cu/Silk process during Cu-CMP"2004
- Author(s)
  S.Balakumar, R.Kumar, T.Hara, F.Shimura
- Journal Title
  
  Thin Solid Films 462-463
  
  Pages: 192-198
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of Stress on the Properties of Copper Lines in Cu Interconnects2004
- Author(s)
  S.Balakumar, R.Kumar, Y.Shimura, K.Namiki, M.Fujimoto, H.Toida, M.Uchida, T.Hara
- Journal Title
  
  Electrochem.Solid-State Lett. 7
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Adhesion strength of Cu layer"2004
- Author(s)
  S.Balakumar, T.Hara, W.J.Yoo
- Journal Title
  
  Microelectronic.Eng. 75
  
  Pages: 183-193
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of Stress on the Properties of Copper Lines in Cu Interconnects2004
- Author(s)
  Balakumar, R.Kumar, T.Hara
- Journal Title
  
  Electrochem.Solid-State Lett 7
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Investigation of copper contamination into interlayer dielectrics by copper process"2004
- Author(s)
  I.Kobayashi, T.Miyazawa, M.Fujimoto, H.Kawaguchi, T.Hara
- Journal Title
  
  Thin Solid Films 462-463
  
  Pages: 231-234
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects2004
- Author(s)
  S.Balakumar, T.Hara
- Journal Title
  
  J.Vac.Sci.Technol. B22
  
  Pages: 2384-2389
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects2004
- Author(s)
  S.Balakumar, T.Hara
- Journal Title
  
  J.Vac.Sci.Technol.B 22
  
  Pages: 2384-2384
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of TaSiN Barrier Layer Composition on Resistivity of Electroplated Copper Interconnection Layers2004
- Author(s)
  T.Hara, K.Namiki
- Journal Title
  
  Electrochem. Solid-State Lett 7
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Chemical mechanical polishing of copper layer employing MnO2 slurry2004
- Author(s)
  T.Hara, M.Fujimoto, Y.Shimura
- Journal Title
  
  Thin Solid Films Vol.462-463
  
  Pages: 186-191
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Measurement of Adhesion Strength in Copper Interconnection Layers2004
- Author(s)
  T.Hara, M.Uchida, N.Babu
- Journal Title
  
  Electrochem.Solid-State Lett.
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers2004
- Author(s)
  S.Balakumar, T.Hara, R.Kumar, T.Wakabayashi, M.Uchida
- Journal Title
  
  Electrochem.Solid-State Lett. 7
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Measurement of Adhesion Strength in Copper Interconnection Layers2004
- Author(s)
  T.Hara, M.Uchida, N.Babu
- Journal Title
  
  Electrochem. Solid-State Lett.
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Chemical mechanical polishing of copper layer employing MnO2 slurry2004
- Author(s)
  T.Hara, M.Fujimoto, Y.Shimura
- Journal Title
  
  Thin Solid Films 462-463
  
  Pages: 186-191
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Investigation of copper contamination into interlayer dielectrics by copper process2004
- Author(s)
  I.Kobayashi, T.Miyazawa, M.Fujimoto, H.Kawaguchi, T.Hara
- Journal Title
  
  Thin Solid Films 462-463
  
  Pages: 231-234
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Adhesion strength of Cu layer2004
- Author(s)
  S.Balakumar, T.Hara, W.J.Yoo
- Journal Title
  
  Microelectronic.Eng. 75
  
  Pages: 183-193
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of Stress on the Properties of Copper Lines in Cu Interconnects2004
- Author(s)
  Balakumar, R.Kumar, T.Hara
- Journal Title
  
  Electrochem. Solid-State Left 7
- Description
  「研究成果報告書概要(和文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Investigation of copper contamination into interlayer dielectrics by copper process2004
- Author(s)
  I.Kobayashi, T.Miyazawa, M.Fujimoto, H.Kawaguchi, T.Hara
- Journal Title
  
  Thin Solid Films Vol.462-463
  
  Pages: 231-234
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Adhesion strength of Cu layer2004
- Author(s)
  S.Balakumar, G.Wong, C.F.Tsang, T.Hara, W.J.Yoo
- Journal Title
  
  Microelectronic Engineering 75
  
  Pages: 183-193
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Effect of TaSiN Barrier Layer Composition on Resistivity of Electroplated Copper Interconnection Layers2004
- Author(s)
  T.Hara, K.Namiki
- Journal Title
  
  Electrochem.Solid-State Lett 7
- Data Source
  KAKENHI-PROJECT-15560281
[Journal Article] Measurement of Adhesion Strength in Copper Interconnection Layers2004
- Author(s)
  T.Hara, M.Uchida, M.Fujimoto, T.K.Doy, S.Balakumar, N.Babu
- Journal Title
  
  Electrochem.Solid-State Lett. 7
- Description
  「研究成果報告書概要(欧文)」より
- Data Source
  KAKENHI-PROJECT-15560281

1. YAMAMOTO Yasuhiro (50139383)

# of Collaborated Projects: 5 results

# of Collaborated Products: 0 results
2. HAMANAKA Hiromi (10061235)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. SATO Masataka (40215843)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 長野昌三

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

HARA Tohru 原 徹

原 徹 ハラ トオル

Research Projects

Research Products

Co-Researchers

An Electroplating of Low Resistivity Copper Interconnection LinesPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Thermally stable low dielectric constant interlayers for high speed MOS LSI'sPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Fundamental Research of the Delamination by H^+ ImplantationPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Fundamental Study on The Collimation SputteringPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

シリコン結晶書面に形成される薄い自然酸化膜に関する研究Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Ion Implantation in Sillicides and MetalsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Resistivity in Thin Copper Interconnection Layers2005

Author(s)

Journal Title

NAID

Data Source

[Journal Article] Resistivity in Thin Copper Interconnection Layers2005

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] Resistivity of Thin Copper Interconnection Layers2005

Author(s)

Journal Title

NAID

Description

Data Source

[Journal Article] Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] Effect of TaSiN Barrier Layer Composition on Resistivity of Electroplated Copper Interconnection Layers2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] Peeling and Delamination in Cu/Silk process during Cu-CMP2004

Author(s)

Journal Title

Description

Data Source

[Journal Article] Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers2004

Author(s)

Journal Title

Data Source

[Journal Article] Peeling and Delamination in Cu/Silk process during Cu-CMP2004

Author(s)

Journal Title

HARA Tohru 原徹

原徹ハラトオル