Shohji Ikuo 荘司郁夫

… Alternative Names

SHOUJI Ikuo 荘司郁夫

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Researcher Number	00323329
Other IDs
Affiliation (Current)	2025: 群馬大学, 大学院理工学府, 教授
Affiliation (based on the past Project Information) *help	2025: 群馬大学, 大学院理工学府, 教授 2017 – 2023: 群馬大学, 大学院理工学府, 教授 2014 – 2015: 群馬大学, 大学院理工学府, 教授 2013: 群馬大学, 理工学研究院, 教授 2012: 群馬大学, 工学(系)研究科(研究院), 教授 … More 2009 – 2011: Gunma University, 大学院・工学研究科, 教授 2007 – 2008: 群馬大学, 工学部, 准教授 2005 – 2006: 群馬大学, 工学部, 助教授 Less
Review Section/Research Field	Principal Investigator Electron device/Electronic equipment / Basic Section 26030:Composite materials and interfaces-related / Material processing/treatments Except Principal Investigator Basic Section 21060:Electron device and electronic equipment-related / Material processing/treatments / Electron device/Electronic equipment / Art at large
Keywords	Principal Investigator パワー半導体 / 微細接続 / 電子デバイス・機器 / 接合 / セルロースナノファイバ / 熱応力 / 複合めっき / パワーデバイス / 亀裂進展 / 金属間化合物 … More / き裂進展 / パワーサイクル / 鉛フリーはんだ / 異相界面 / 界面 / 密着強度 / 機械的特性 / マイクロ接合 / 樹脂実装 / パワーモジュール / 電子実装 / 表面・界面物性 / 微細接合 … More Except Principal Investigator 低温接合 / 金属塩生成接合法 / 液相拡散接合 / 固相接合 / 電子・電気材料 / 電子デバイス・機器 / 金属塩生成接合 / 銅 / アルミニウム / インサート金属 / 低温実装 / 信頼性評価 / 界面反応 / マイクロ接合 / 鉛フリーはんだ / 省エネルギー / 鋼美緒都度実装 / 精密部品加工 / 電子風 / ガラス繊維強化PA66 / アルミニウム合金 / 環境調和 / はんだ / ステンレス鋼 / ナノ材料 / 耐熱鋼 / 高張力鋼 / ナノ粒子 / 精密接合 / 電子デバイス / 可視化 / 美学 / 芸術諸学 / 銅酸化物 / 分析 / ろう付け / クリソコラ / 色彩 / 粒金 / 文化財 / 復元 / ろう材 / ジュエリー / 接合 / 金合金 / 金 / 粒金細工 / Tin Bismuth Alloy / Microstructure / Evaluation of Reliabilty / Electronics Packaging / Interfacial Reaction / Lead Free Solder / Low Temperature Packaging / Micro Joining / 錫・ビスマス合金 / 微細組織 / エレクトロニクス実装 / 添加元素 / 金属間化合物 / 状態図計算 / 延性改善 / 微細化 / 共晶組織 Less

Direct Bonding of Dissimilar Materials for Next-Generation 3D Semiconductor Packages Using Metal Salt Decomposition Reactions
- Principal Investigator
  
  小山真司
- Project Period (FY)
  2025 – 2028
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Gunma University
セルロースナノファイバを用いたパワー半導体用熱応力緩和電極の創製Principal Investigator
- Principal Investigator
  
  荘司郁夫
- Project Period (FY)
  2022 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Gunma University
Visualization of formation and decomposition behavior of metal salts and its application to multi-material modeling technology
- Principal Investigator
  
  Koyama Shinji
- Project Period (FY)
  2020 – 2023
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  Gunma University
Creating reproduction technique of ancient micro-interconnection: Interdisciplinary research of art and technology
- Principal Investigator
  
  NARUI Miho
- Project Period (FY)
  2017 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Art at large
- Research Institution
  Bunka Gakuen University
Large area bonding for power device by effective dispersion of pillar-shaped IMCPrincipal Investigator
- Principal Investigator
  
  Shohji Ikuo
- Project Period (FY)
  2017 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Gunma University
Creation of low temperature sinterable metal nanoparticles and application to precision assembly and joining
- Principal Investigator
  
  KOYAMA Shinji
- Project Period (FY)
  2017 – 2019
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Gunma University
Producing high functional resin/metal heterogeneous interface for SiC power devicesPrincipal Investigator
- Principal Investigator
  
  Shohji Ikuo
- Project Period (FY)
  2012 – 2015
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Electron device/Electronic equipment
- Research Institution
  Gunma University
Study on hybridization of thermal exchanging system for power semiconductor devicePrincipal Investigator
- Principal Investigator
  
  SHOHJI Ikuo
- Project Period (FY)
  2009 – 2011
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Gunma University
Effect of Third Element Addition on Eutectic Microstructure of Lead Free Low Temperature Sn-Bi Based Solders
- Principal Investigator
  
  UENISHI Keisuke
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University
Dvelopment of Sn-Bi Based Low Temperature Solders which Enables Step Soldering
- Principal Investigator
  
  UENISHI Keisuke
- Project Period (FY)
  2005 – 2006
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Material processing/treatments
- Research Institution
  Osaka University

[Journal Article] An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-Tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers2024
- Author(s)
  Iioka Makoto、Kawanabe Wataru、Tsujimura Subaru、Kobayashi Tatsuya、Shohji Ikuo
- Journal Title
  
  Polymers
  
  Volume: 16 Issue: 2 Pages: 224-224
- DOI
  10.3390/polym16020224
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating2023
- Author(s)
  IIOKA Makoto、KAWANABE Wataru、KOBAYASHI Tatsuya、SHOHJI Ikuo
- Journal Title
  
  QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
  
  Volume: 41 Issue: 4 Pages: 337-347
- DOI
  10.2207/qjjws.41.337
- ISSN
  0288-4771, 2434-8252
- Language
  Japanese
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method2023
- Author(s)
  Kawanabe Wataru、Iioka Makoto、Kobayashi Tatsuya、Shohji Ikuo
- Journal Title
  
  Materials Science Forum
  
  Volume: 1106 Pages: 69-74
- DOI
  10.4028/p-p8lgxg
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles2023
- Author(s)
  Kobayashi Tatsuya、Abiko Yuki、Shohji Ikuo
- Journal Title
  
  Key Engineering Materials
  
  Volume: 967 Pages: 37-42
- DOI
  10.4028/p-czy5ta
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Investigation of Effects of Electroplating Conditions on TEMPO-Oxidized Cellulose Nanofiber Composited Nickel Electroplated Films2023
- Author(s)
  Iioka Makoto、Kawanabe Wataru、Kobayashi Tatsuya、Shohji Ikuo
- Journal Title
  
  Materials Science Forum
  
  Volume: 1106 Pages: 55-62
- DOI
  10.4028/p-nlb9zf
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Fabrication of Electroplated Nickel Composite Films Using Cellulose Nanofibers Introduced with Carboxy Groups as Co-Deposited Materials2023
- Author(s)
  Iioka Makoto、Kawanabe Wataru、Kobayashi Tatsuya、Shohji Ikuo、Sakamoto Kota
- Journal Title
  
  Surfaces
  
  Volume: 6 Issue: 2 Pages: 164-178
- DOI
  10.3390/surfaces6020012
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] An Experimental Study of Fabrication of Cellulose Nano-Fiber Composited Ni Film by Electroplating2022
- Author(s)
  Iioka Makoto、Kawanabe Wataru、Shohji Ikuo、Kobayashi Tatsuya
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 63 Issue: 6 Pages: 821-828
- DOI
  10.2320/matertrans.MT-MC2022012
- ISSN
  1345-9678, 1347-5320
- Year and Date
  2022-06-01
- Language
  English
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22K04721
[Journal Article] Solid State Bonding of Tin and Copper by Metal Salt Generation Bonding Technique Using Citric Acid2022
- Author(s)
  Koyama Shinji、Shohji Ikuo、Muraoka Takako
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 63 Issue: 7 Pages: 987-992
- DOI
  10.2320/matertrans.MT-MC2022014
- ISSN
  1345-9678, 1347-5320
- Year and Date
  2022-07-01
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20K04592, KAKENHI-PROJECT-21K05034
[Journal Article] Low Temperature Solid-State Bonding of Nickel and Tin with Formic Acid Surface Modifications2022
- Author(s)
  Koyama Shinji、Shohji Ikuo、Muraoka Takako
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 63 Issue: 6 Pages: 813-820
- DOI
  10.2320/matertrans.MT-MC2022007
- ISSN
  1345-9678, 1347-5320
- Year and Date
  2022-06-01
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-20K04592, KAKENHI-PROJECT-21K05034
[Journal Article] Sn-Sb-Ag系高温鉛フリーはんだ合金の機械的性質に及ぼす微量Ni及びGe添加の影響2020
- Author(s)
  三ツ井恒平, 荘司郁夫, 小林竜也, 渡邉裕彦
- Journal Title
  
  スマートプロセス学会誌
  
  Volume: 9 Pages: 133-139
- NAID
  40022251276
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-17K06371
[Journal Article] Large area bonding for power devices by pillar-like IMC effective dispersion control2020
- Author(s)
  Ikuo Shohji, Tatsuya Kobayashi, Yusuke Nakata
- Journal Title
  
  Impact
  
  Volume: Vol. 2020 No. 1 Pages: 76-78
- Open Access
- Data Source
  KAKENHI-PROJECT-17K06371
[Journal Article] Evaluation of Microstructures and Mechanical Properties of Sn-10Sb-Ni Lead-Free Solder Alloys with Small Amount of Ni Using Miniature Size Specimens2019
- Author(s)
  Kobayashi Tatsuya、Shohji Ikuo
- Journal Title
  
  Metals
  
  Volume: 9 Issue: 12 Pages: 1348-1348
- DOI
  10.3390/met9121348
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K06371
[Journal Article] Effects of Ni Addition to Sn–5Sb High-Temperature Lead-Free Solder on Its Microstructure and Mechanical Properties2019
- Author(s)
  Kobayashi Tatsuya、Mitsui Kohei、Shohji Ikuo
- Journal Title
  
  MATERIALS TRANSACTIONS
  
  Volume: 60 Issue: 6 Pages: 888-894
- DOI
  10.2320/matertrans.MH201809
- NAID
  130007653171
- ISSN
  1345-9678, 1347-5320
- Year and Date
  2019-06-01
- Language
  English
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K06371
[Journal Article] Effect of Cooling Rate on Intermetallic Compounds Formation in Sn-Ag-Cu-In Solder2018
- Author(s)
  Miki Kenji、Kobayashi Tatsuya、Shohji Ikuo、Nakata Yusuke
- Journal Title
  
  Materials Science Forum
  
  Volume: 941 Pages: 2075-2080
- DOI
  10.4028/www.scientific.net/msf.941.2075
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K06371
[Journal Article] Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet2017
- Author(s)
  Ozawa K、Koyama S、shohji I
- Journal Title
  
  Journal of Physics: Conference Series
  
  Volume: 843 Pages: 012005-012005
- DOI
  10.1088/1742-6596/843/1/012005
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-17K06372
[Journal Article] Effect of Filler Content and Coupling Agent on Mechanical Properties of Underfill Material2014
- Author(s)
  Hironao Mitsugi, Shinya Kitagoh, Ikuo Shohji and Shinji Koyama
- Journal Title
  
  Transactions of the Japan Institute of Electronics Packaging
  
  Volume: 7 Pages: 25-31
- NAID
  130005130535
- Peer Reviewed / Acknowledgement Compliant
- Data Source
  KAKENHI-PROJECT-24560396
[Journal Article] Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-free Sn-Cu Foil2010
- Author(s)
  I. Shohji, S. Koyama, I. Oshiro, H. Nara, Y. Iwata
- Journal Title
  
  Materials Transactions
  
  Volume: Vol.51,No.10 Pages: 1753-1758
- NAID
  10026695138
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560741
[Journal Article] Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper2010
- Author(s)
  S.Koyama, Y.Aoki, I.Shohji
- Journal Title
  
  Materials Transactions
  
  Volume: 51 Pages: 1759-1763
- NAID
  10026695148
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560741
[Journal Article] Fluxless Bonding of Ni-P/Cu Plated Al Alloy and Cu Alloy with Lead-free Sn-Cu Foil2010
- Author(s)
  I.Shohji, S.Koyama, I.Oshiro, H.Nara, Y.Iwata
- Journal Title
  
  Materials Transactions
  
  Volume: 51 Pages: 1753-1758
- NAID
  10026695138
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560741
[Journal Article] Effect of Formic Acid Surface Modification on Bond Strength of Solid-State Bonded Interface of Tin and Copper2010
- Author(s)
  S. Koyama, Y. Aoki, I. Shohji
- Journal Title
  
  Materials Transactions
  
  Volume: Vol.51,No.10 Pages: 1759-1763
- NAID
  10026695148
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-21560741
[Patent] めっき成形体及びめっき成形体の製造方法2023
- Inventor(s)
  荘司郁夫、飯岡諒、川鍋渉、中谷丈史、伊達達規
- Industrial Property Rights Holder
  荘司郁夫、飯岡諒、川鍋渉、中谷丈史、伊達達規
- Industrial Property Rights Type
  特許
- Industrial Property Number
  2023-176463
- Filing Date
  2023
- Data Source
  KAKENHI-PROJECT-22K04721
[Patent] 金属部材の接合方法2010
- Inventor(s)
  小山真司, 荘司郁夫
- Industrial Property Rights Holder
  国立大学法人群馬大学
- Industrial Property Number
  2010-073005
- Filing Date
  2010-03-26
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] TEMPO酸化CNFを複合材とした無電解Ni複合めっき膜の成膜および特性調査2024
- Author(s)
  川鍋渉, 飯岡諒, 小林竜也, 荘司郁夫
- Organizer
  Mate2024
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 複合めっき法によるAl粒子含有Znめっきの創製と評価2024
- Author(s)
  安彦祐輝, 荘司郁夫, 小林竜也
- Organizer
  Mate2024
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 無電解法によるニッケルめっき膜へのセルロースナノファイバー複合化手法の検討2023
- Author(s)
  川鍋渉、飯岡諒、荘司郁夫、小林竜也
- Organizer
  Mate2023 (Microjoining and Assembly Technology in Electronics) Symposium
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles2023
- Author(s)
  Yuki Abiko, Ikuo Shohji, Tatsuya Kobayashi
- Organizer
  THERMEC'2023
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 複合めっき法による Zn-Al 系はんだめっきの作製と特性評価2023
- Author(s)
  安彦祐輝、荘司郁夫、小林竜也
- Organizer
  Mate2023 (Microjoining and Assembly Technology in Electronics) Symposium
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Al粒子含有Znめっきを用いた高温はんだの接合特性2023
- Author(s)
  安彦祐輝, 荘司郁夫, 小林竜也
- Organizer
  日本金属学会2023年秋期（第173回）講演大会
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Investigation of Effects of Electroplating Conditions on Morphology of TEMPO Oxidized Cellulose Nanofiber Composited Nickel Films2023
- Author(s)
  Makoto Iioka, Wataru Kawanabe, Tatsuya Kobayashi, Ikuo Shohji
- Organizer
  THERMEC'2023
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Investigation of deposition conditions and basic properties of CNF composite Ni plated film by electroless plating method2023
- Author(s)
  Wataru Kawanabe, Makoto Iioka, Tatsuya Kobayashi, Ikuo Shohji
- Organizer
  THERMEC'2023
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 無電解法によるTEMPO酸化CNF複合Niめっき膜の特性評価2023
- Author(s)
  川鍋渉, 飯岡諒, 小林竜也, 荘司郁夫
- Organizer
  日本金属学会2023年秋期（第173回）講演大会
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Experimental Study on a Use of Metal Sputtered Cellulose Powder as the Codeposited Particle into Nickel Electroplating Film2022
- Author(s)
  M. Iioka, W. Kawanabe, I. Shohji, T. Kobayashi
- Organizer
  3rd International Conference on Materials Science and Engineering
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 金属スパッタリング処理を施したセルロース粉末の電解ニッケル複合めっきの共析粒子としての適用検討2022
- Author(s)
  飯岡諒、川鍋渉、荘司郁夫、小林竜也
- Organizer
  日本金属学会2022年秋期（第171回）講演大会
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] 無電解法を用いたNi-CNF複合めっき膜の創製2022
- Author(s)
  川鍋渉、飯岡諒、荘司郁夫、小林竜也
- Organizer
  日本金属学会2022年秋期（第171回）講演大会
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Zn-Al粒子分散めっきによる高温はんだの創製2022
- Author(s)
  安彦祐輝、荘司郁夫、小林竜也
- Organizer
  日本金属学会2022年秋期（第171回）講演大会
- Data Source
  KAKENHI-PROJECT-22K04721
[Presentation] Sn-Sb-Ag系高温鉛フリーはんだのミクロ組織および疲労特性に及ぼす添加元素の影響2021
- Author(s)
  山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
- Organizer
  Mate 2021(Microjoining and Assembly Technology in Electronics) symposium
- Data Source
  KAKENHI-PROJECT-17K06371
[Presentation] パワー半導体用Sn-Sb-Ag系はんだ接合部のパワーサイクル損傷挙動2021
- Author(s)
  山中佑太, 荘司郁夫, 小林竜也, 渡邉裕彦
- Organizer
  Mate 2021(Microjoining and Assembly Technology in Electronics) symposium
- Data Source
  KAKENHI-PROJECT-17K06371
[Presentation] Sn-Sb-Ag 系高温鉛フリーはんだの疲労特性に及ぼすNi 添加の影響2020
- Author(s)
  山本瑞貴, 荘司郁夫, 小林竜也, 三ツ井恒平, 渡邉裕彦
- Organizer
  日本金属学会2020年秋期（第167回）講演大会
- Data Source
  KAKENHI-PROJECT-17K06371
[Presentation] ソルダリングの基礎と応用2 －ソルダリング部の信頼性－2020
- Author(s)
  荘司郁夫
- Organizer
  溶接学会 2020年度溶接工学専門講座
- Invited
- Data Source
  KAKENHI-PROJECT-17K06371
[Presentation] パワー半導体用鉛フリーはんだ接合部のパワーサイクル損傷挙動2020
- Author(s)
  山中佑太, 荘司郁夫, 小林竜也, 小幡佳弘, 倉澤元樹
- Organizer
  日本金属学会2020年秋期（第167回）講演大会
- Data Source
  KAKENHI-PROJECT-17K06371
[Presentation] 酢酸塩被膜付与Znシートを用いたA1070の液相拡散接合2017
- Author(s)
  小澤昂平, 小山真司, 荘司郁夫
- Organizer
  軽金属学会　第132回春期大会
- Data Source
  KAKENHI-PROJECT-17K06372
[Presentation] Liquid phase diffusion bonding of A1070 by using metal formate coated Zn sheet2017
- Author(s)
  K. Ozawa, S. Koyama and I. Shohji
- Organizer
  International Conference on Fracture Fatigue and Wear (FFW2017)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-17K06372
[Presentation] アンダーフィル用樹脂材料の機械的特性に及ぼす添加剤の影響2015
- Author(s)
  荘司郁夫
- Organizer
  スマートプロセス学会エレクトロニクス生産科学部会樹脂実装研究会講演会
- Place of Presentation
  エレクトロニクス実装学会会議室(東京都杉並区)
- Year and Date
  2015-10-15
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] 電子実装接合部の信頼性と熱疲労寿命評価・長寿命化2015
- Author(s)
  荘司郁夫
- Organizer
  日本テクノセンターセミナー
- Place of Presentation
  日本テクノセンター研修室（東京都新宿区）
- Year and Date
  2015-12-11
- Invited
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] フリップチップ接合用アンダーフィル材の機械的物性に及ぼすカップリング剤の影響2014
- Author(s)
  三ツ木寛尚，荘司郁夫, 小山真司, 北郷慎也
- Organizer
  Mate 2014(Microjoining and Assembly Technology in Electronics) Proc. pp. 279-282
- Place of Presentation
  パシフィコ横浜
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] 車載電子デバイス実装における実装材料の信頼性評価2014
- Author(s)
  荘司郁夫
- Organizer
  マイクロソルダリング技術教育・認証フェスタ
- Place of Presentation
  東京
- Year and Date
  2014-10-28
- Invited
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] アンダーフィル材の引張特性に及ぼすフィラー添加量および熱劣化の影響2013
- Author(s)
  三ツ木寛尚，北郷慎也，荘司郁夫，小山真司
- Organizer
  スマートプロセス学会エレクトロニクス生産科学部会電子デバイス実装研究委員会
- Place of Presentation
  大阪大学
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] フリップチップ接合用アンダーフィル材の材料物性に及ぼす温度およびフィラー添加量の影響2013
- Author(s)
  北郷慎也、三ツ木寛尚、荘司郁夫、小山真司
- Organizer
  Mate 2013, 19th Symposium on "Microjoining and Assembly Technology in Electronics"
- Place of Presentation
  パシフィコ横浜
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] フリップチップ接合用アンダーフィル材の機械的特性に及ぼすフィラー添加量と時効処理の影響2013
- Author(s)
  三ツ木寛尚，北郷慎也, 荘司郁夫，小山真司
- Organizer
  日本金属学会講演概要DVD（第153回）540
- Place of Presentation
  金沢大学
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] Effect of Filler Content on Tensile Properties of Underfill Material for Flip Chip2012
- Author(s)
  Shinya Kitagoh, Hironao Mitsugi, Shinji Koyama and Ikuo Shohji
- Organizer
  IEMT(International Electronics Manufacturing Technology Conference)2012
- Place of Presentation
  Kinta Riverfront Hotel, Ipoh, Malaysia
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] Microstructures and Joint Strength of Vacuum Jointed Cu with Sn-Cu Alloys2012
- Author(s)
  M. Hayakawa, I. Shohji, S. Koyama, H. Nara, N. Otomo, M. Uenishi
- Organizer
  ICEP-IAAC 2012
- Place of Presentation
  東京ビッグサイト(東京都)
- Year and Date
  2012-04-19
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Sn-Cu系鉛フリーはんだによるCuの真空接合部の接合部組織と接合強度2012
- Author(s)
  早川真生, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久
- Organizer
  Mate 2012
- Place of Presentation
  パシフィコ横浜(神奈川県)
- Year and Date
  2012-01-31
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] フリップチップ接合用アンダーフィル材の引張特性に及ぼすフィラー含有量の影響2012
- Author(s)
  北郷慎也、三ツ木寛尚、荘司郁夫、小山真司
- Organizer
  日本金属学会2012年秋期（第151回）大会
- Place of Presentation
  愛媛大学
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] Sn-Cu系鉛フリーはんだによるCuの真空接合に及ぼすNiおよびGeの影響2011
- Author(s)
  早川真生, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久
- Organizer
  第149回日本金属学会
- Place of Presentation
  沖縄コンベンションセンター(沖縄県)
- Year and Date
  2011-11-07
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Effect of the Organic Acid Surface Modification on Bond Strength of Tin and Copper2011
- Author(s)
  S. Koyama, Y. Aoki, I. Shohji
- Organizer
  InterPACK2011
- Place of Presentation
  Marriott Portland Waterfront Hotel (Portland, USA)
- Year and Date
  2011-07-06
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] 金属塩生成法を用いたSn/Cu固相接合の低温化2011
- Author(s)
  青木由希也, 小山真司, 荘司郁夫
- Organizer
  第52回溶接学会マイクロ接合研究委員会ソルダリング分科会
- Place of Presentation
  自動車会館(東京都)
- Year and Date
  2011-10-28
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Examination of Improvement Effect of Surface Modification of Cu with Organic Acid on Solder Paste Wettability using a Laser Displacement Meter2010
- Author(s)
  S. Koyama, Y. Aoki, I. Shohji
- Organizer
  Visual-JW 2010
- Place of Presentation
  ホテル阪急エキスポパーク(大阪府)
- Year and Date
  2010-11-11
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Sn-Cu系鉛フリーはんだによるめっき処理Al合金とCu合金フラックスレス接合2009
- Author(s)
  大城格, 荘司郁夫, 小山真司, 奈良英明, 大友昇, 上西正久
- Organizer
  第145回日本金属学会
- Place of Presentation
  京都大学(京都府)
- Year and Date
  2009-09-17
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Sn-Cu系鉛フリーはんだによるめっき処理Al合金とCu合金のフラックスレス接合2009
- Author(s)
  荘司郁夫
- Organizer
  日本金属学会
- Place of Presentation
  京都大学(京都)
- Year and Date
  2009-09-17
- Data Source
  KAKENHI-PROJECT-21560741
[Presentation] Effect of Coupling Agent on Adhesion of Underfill on Copper
- Author(s)
  H. Mitsugi, I. Shohji, S. Koyama and S. Kitagoh
- Organizer
  ICEP（International Conference on Electronics Packaging）2014
- Place of Presentation
  富山
- Year and Date
  2014-04-23 – 2014-04-25
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] フリップチップ接合用アンダーフィル材/銅の密着強度に及ぼすカップリング剤の影響
- Author(s)
  三ツ木寛尚，荘司郁夫，小山真司
- Organizer
  日本金属学会（第155回）
- Place of Presentation
  名古屋
- Year and Date
  2014-09-24 – 2014-09-26
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] Effect of Coupling Treatment of Filler and Copper Substrate on Adhesion of
- Author(s)
  Hironao Mitsugi, Ikuo Shohji and Shinji Koyama
- Organizer
  MS&T14(Materials Science & Technology 2014)
- Place of Presentation
  Pittsburgh, USA
- Year and Date
  2014-10-12 – 2014-10-16
- Data Source
  KAKENHI-PROJECT-24560396
[Presentation] フリップチップ接合用アンダーフィル材の密着強度と疲労特性に及ぼすカップリング剤の影響
- Author(s)
  三ツ木寛尚，荘司郁夫，小山真司
- Organizer
  Mate(Microjoining and Assembly Technology in Electronics)2015
- Place of Presentation
  横浜
- Year and Date
  2015-02-03 – 2015-02-04
- Data Source
  KAKENHI-PROJECT-24560396

1. KOYAMA Shinji (70414109)

# of Collaborated Projects: 5 results

# of Collaborated Products: 25 results
2. UENISHI Keisuke (80223478)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
3. SATO Takehiko (60379112)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
4. NARUI Miho (70459957)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. 小林竜也 (00847486)

# of Collaborated Projects: 1 results

# of Collaborated Products: 18 results
6. 西田進一 (80434299)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Shohji Ikuo 荘司 郁夫

SHOUJI Ikuo 荘司 郁夫

Research Projects

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Co-Researchers

Direct Bonding of Dissimilar Materials for Next-Generation 3D Semiconductor Packages Using Metal Salt Decomposition Reactions

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セルロースナノファイバを用いたパワー半導体用熱応力緩和電極の創製Principal Investigator

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Visualization of formation and decomposition behavior of metal salts and its application to multi-material modeling technology

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Creating reproduction technique of ancient micro-interconnection: Interdisciplinary research of art and technology

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Large area bonding for power device by effective dispersion of pillar-shaped IMCPrincipal Investigator

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Creation of low temperature sinterable metal nanoparticles and application to precision assembly and joining

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Producing high functional resin/metal heterogeneous interface for SiC power devicesPrincipal Investigator

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Study on hybridization of thermal exchanging system for power semiconductor devicePrincipal Investigator

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Effect of Third Element Addition on Eutectic Microstructure of Lead Free Low Temperature Sn-Bi Based Solders

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Dvelopment of Sn-Bi Based Low Temperature Solders which Enables Step Soldering

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[Journal Article] An Evaluation of the Wear Resistance of Electroplated Nickel Coatings Composited with 2,2,6,6-Tetramethylpiperidine 1-oxyl-Oxidized Cellulose Nanofibers2024

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[Journal Article] Application of Metal Sputtering Treatment to Cellulose Materials Used as Co-Deposited Material for Electrolytic Nickel Composite Plating2023

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[Journal Article] Investigation of Deposition Conditions and Basic Properties of CNF Composite Ni Plated Film by Electroless Plating Method2023

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Shohji Ikuo 荘司郁夫

SHOUJI Ikuo 荘司郁夫