INOUE Fumihiro 井上史大

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Inoue Fumihiro 井上史大

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Researcher Number	00908303
Other IDs
Affiliation (Current)	2026: 横浜国立大学, 総合学術高等研究院, 教授
Affiliation (based on the past Project Information) *help	2026: 横浜国立大学, 大学院工学研究院, 准教授 2021 – 2024: 横浜国立大学, 大学院工学研究院, 准教授
Review Section/Research Field	Principal Investigator Basic Section 26030:Composite materials and interfaces-related / 0302:Electrical and electronic engineering and related fields
Keywords	Principal Investigator 原子層堆積 / ハイブリッド接合 / チップレット / 無電解めっき / 化学機械研磨

多材料・低温プロセスに対応した接合界面工学の再構築と3D集積信頼性の革新Principal Investigator
- Principal Investigator
  
  井上史大
- Project Period (FY)
  2026 – 2028
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Yokohama National University
原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用Principal Investigator
- Principal Investigator
  
  井上史大
- Project Period (FY)
  2024 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  Yokohama National University
Application of Bottom-Up Selective Growth Technology to Hybrid BondingPrincipal Investigator
- Principal Investigator
  
  Inoue Fumihiro
- Project Period (FY)
  2021 – 2022
- Research Category
  
  Grant-in-Aid for Research Activity Start-up
- Review Section
  
  0302:Electrical and electronic engineering and related fields
- Research Institution
  Yokohama National University

All 2025 2024 2023 2022 2021

All Journal Article Presentation

[Journal Article] Direct Physical Vapor Deposition of Liquid Metal on Treated Metal Surface2025
- Author(s)
  Matsuda Ryosuke、Isano Yuji、Onishi Koki、Ota Hiroki、Inoue Fumihiro
- Journal Title
  
  ACS Applied Electronic Materials
  
  Volume: TBA Issue: 9 Pages: 3656-3666
- DOI
  10.1021/acsaelm.4c02096
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23K26388, KAKENHI-PROJECT-24KJ1931
[Journal Article] Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via Non-selective Chemical Mechanical Polishing and Post-cleaning Steps2024
- Author(s)
  Nakayama Kohei、Hayama Kenta、Tanaka Fabiana Lie、La Mai Thi Ngoc、Inoue Fumihiro
- Journal Title
  
  ECS Journal of Solid State Science and Technology
  
  Volume: 13 Issue: 7 Pages: 074009-074009
- DOI
  10.1149/2162-8777/ad5fb7
- Data Source
  KAKENHI-PROJECT-23K26388
[Journal Article] Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding2022
- Author(s)
  Park Kimoon、Inoue Fumihiro、Derakhshandeh Jaber、Yoo Bongyoung
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 61 Issue: 4 Pages: 041003-041003
- DOI
  10.35848/1347-4065/ac52ba
- Data Source
  KAKENHI-PROJECT-21K20426
[Journal Article] Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging2022
- Author(s)
  Inoue Fumihiro、Phommahaxay Alain、Gokita Yohei、M?ller Berthold、Beyne Eric
- Journal Title
  
  The International Journal of Advanced Manufacturing Technology
  
  Volume: 119 Issue: 5-6 Pages: 3427-3435
- DOI
  10.1007/s00170-021-08622-x
- Data Source
  KAKENHI-PROJECT-21K20426
[Journal Article] Area-Selective Electroless Deposition of Cu for Hybrid Bonding2021
- Author(s)
  Inoue Fumihiro、Iacovo Serena、El-Mekki Zaid、Kim Soon-Wook、Struyf Herbert、Beyne Eric
- Journal Title
  
  IEEE Electron Device Letters
  
  Volume: 42 Issue: 12 Pages: 1826-1829
- DOI
  10.1109/led.2021.3124960
- NAID
  120007173200
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] Exploring Bonding Mechanism of SiCN for Hybrid Bonding2024
- Author(s)
  Sodai Ebiko, Serena Iacovo, Soon-Aik Chew, Boyao Zhang, Akira Uedono, Fumihiro Inoue
- Organizer
  2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K26388
[Presentation] Surface Characterization and Modification for Cu/SiCN Hybrid Bonding2024
- Author(s)
  Kenta Hayama, Kohei Nakayama, Ryosuke Sato, Yutetsu Kamiya, Ken Harada, Masahiro Yokoyama, Yasuhiro Kawase, Fumihiro Inoue
- Organizer
  2024 IEEE International Interconnect Technology Conference (IITC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K26388
[Presentation] Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding2023
- Author(s)
  Kohei Nakayama, Kenta Hayama, La Thi Ngoc Mai, and Fumihiro Inoue
- Organizer
  ICPT2023
- Data Source
  KAKENHI-PROJECT-23K26388
[Presentation] ハイブリッド接合表面形成過程におけるCu表面の評価2023
- Author(s)
  中山航平，岩田知也，蛯子颯大，井上史大
- Organizer
  2023　電気化学会春季講演会
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] Surface Topography Control on Cu Pad for Hybrid Bonding2023
- Author(s)
  Nakayama Kohei、Iwata Tomoya、Ebiko Sodai、Mai La Thi Ngoc、Harada Ken、Yokoyama Masahiro、Kawase Yasuhiro、Inoue Fumihiro
- Organizer
  IITC2024
- Data Source
  KAKENHI-PROJECT-23K26388
[Presentation] ハイブリッド接合に向けた化学機械研磨中の金属腐食挙動の解析2022
- Author(s)
  岩田知也、中山航平、布施淳也、蛯子颯大、大西洸輝、北川颯人、井上史大
- Organizer
  MES2022
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] The unique properties of SiCN as bonding material for hybrid bonding2021
- Author(s)
  Serena Iacovo, Soon-Wook Kim, Fuya Nagano, Lan Peng, Fumihiro Inoue, Alain Phommahaxay, Eric Beyne
- Organizer
  2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
- Invited / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding2021
- Author(s)
  S. Iacovo, L. Peng, F. Nagano, T. Uhrmann, Jürgen Burggraf, A. Fehkhrer, T. Conard, F. Inoue, S-W. Kim, J. De Vos, A. Phommahaxay, E. Beyne
- Organizer
  2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] A study on IMC morphology and integration flow for low temperature and high throughput TCB down to pitch microbumps2021
- Author(s)
  J. Derakhshandeh, C. Gerets, F. Inoue, G. Capuz, V. Cherman, M. Lofrano, L. Hou, T. Cochet, I. De Preter, T. Webers, P. Bex, G. Jamieson, M. Maehara, E. Shafahian, J. Bertheau, E. Beyne, D. Charles La Tulipe, G. Beyer, G. Van der Plas, A. Miller
- Organizer
  2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K20426
[Presentation] Electrodeposition of Indium for Low Temperature 3D Stacking2021
- Author(s)
  Fumihiro Inoue, Kimoon Park, Jaber Derakhshandeh, Bongyoung Yoo
- Organizer
  2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K20426

1. 多喜川良 (80706846)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
2. 藤野真久 (70532274)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

INOUE Fumihiro 井上 史大

Inoue Fumihiro 井上 史大

Research Projects

Research Products

Co-Researchers

多材料・低温プロセスに対応した接合界面工学の再構築と3D集積信頼性の革新Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

原子層堆積ハイブリッド表面の局所ダイナミクスの解明と3Dヘテロデバイスへの応用Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Application of Bottom-Up Selective Growth Technology to Hybrid BondingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Direct Physical Vapor Deposition of Liquid Metal on Treated Metal Surface2025

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Minimizing Recess of Cu Pad on Hybrid Bonding with SiCN via Non-selective Chemical Mechanical Polishing and Post-cleaning Steps2024

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Application of the surface planer process to Cu pillars and wafer support tape for high-coplanarity wafer-level packaging2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Area-Selective Electroless Deposition of Cu for Hybrid Bonding2021

Author(s)

Journal Title

DOI

NAID

Data Source

[Presentation] Exploring Bonding Mechanism of SiCN for Hybrid Bonding2024

Author(s)

Organizer

Data Source

[Presentation] Surface Characterization and Modification for Cu/SiCN Hybrid Bonding2024

Author(s)

Organizer

Data Source

[Presentation] Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding2023

Author(s)

Organizer

Data Source

[Presentation] ハイブリッド接合表面形成過程におけるCu表面の評価2023

Author(s)

Organizer

Data Source

[Presentation] Surface Topography Control on Cu Pad for Hybrid Bonding2023

Author(s)

Organizer

Data Source

[Presentation] ハイブリッド接合に向けた化学機械研磨中の金属腐食挙動の解析2022

Author(s)

Organizer

Data Source

[Presentation] The unique properties of SiCN as bonding material for hybrid bonding2021

Author(s)

Organizer

Data Source

[Presentation] Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding2021

Author(s)

Organizer

INOUE Fumihiro 井上史大

Inoue Fumihiro 井上史大