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Takakuwa Masahito  高桑 聖仁

Researcher Number 00981838
Other IDs
  • ORCIDhttps://orcid.org/0000-0003-2444-6237
Affiliation (Current) 2025: 東京大学, 大学院工学系研究科(工学部), 助教
Affiliation (based on the past Project Information) *help 2023 – 2024: 東京大学, 大学院工学系研究科(工学部), 助教
Review Section/Research Field
Principal Investigator
0302:Electrical and electronic engineering and related fields / Basic Section 21060:Electron device and electronic equipment-related
Except Principal Investigator
Medium-sized Section 21:Electrical and electronic engineering and related fields
Keywords
Principal Investigator
スチーム処理 / プラズマ処理 / 柔軟集積化 / フレキシブルエレクトロニクス / 直接接合技術 / フレキシブル実装技術 / ハイブリット直接接合 / データグローブ / 薄膜エレクトロニクス実装 / 表面活性化接合 … More
Except Principal Investigator
… More 電源管理回路 / 電極パタニング / 伸縮性 / スキンエレクトロニクス / エレクトレット Less
  • Research Projects

    (3 results)
  • Research Products

    (3 results)
  • Co-Researchers

    (3 People)
  •  無接着剤実装技術による粘弾性特性を回避した皮膚貼付け型データグローブの開発Principal Investigator

    • Principal Investigator
      高桑 聖仁
    • Project Period (FY)
      2024 – 2025
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 21060:Electron device and electronic equipment-related
    • Research Institution
      The University of Tokyo
  •  Development of Skin-attached Energy Harvesting System Using Strechable Electret

    • Principal Investigator
      鈴木 雄二
    • Project Period (FY)
      2024 – 2026
    • Research Category
      Grant-in-Aid for Scientific Research (A)
    • Review Section
      Medium-sized Section 21:Electrical and electronic engineering and related fields
    • Research Institution
      The University of Tokyo
  •  プラズマスチーム加熱によるポリマーと金属のハイブリット直接接合技術の開発Principal Investigator

    • Principal Investigator
      高桑 聖仁
    • Project Period (FY)
      2023 – 2024
    • Research Category
      Grant-in-Aid for Research Activity Start-up
    • Review Section
      0302:Electrical and electronic engineering and related fields
    • Research Institution
      The University of Tokyo

All 2023

All Presentation

  • [Presentation] Direct parylene bonding with low temperature using plasma treatment and water droplet2023

    • Author(s)
      高桑聖仁
    • Organizer
      The 6th Event of the Young Researchers Society for Flexible and Stretchable Electronics
    • Data Source
      KAKENHI-PROJECT-23K19111
  • [Presentation] パリレンの低温直接接合を用いた柔軟なマイクロ流路デバイスの作製2023

    • Author(s)
      高桑聖仁
    • Organizer
      2023年応用物理学会秋季学術講演会
    • Data Source
      KAKENHI-PROJECT-23K19111
  • [Presentation] Direct parylene bonding for the flexible microfluidic device resistive against the absorption of small molecules2023

    • Author(s)
      Masahito Takakuwa
    • Organizer
      MRS2023Fall
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K19111
  • 1.  鈴木 雄二 (80222066)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 2.  三好 智也 (90809641)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 3.  横田 知之 (30723481)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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