Takakuwa Masahito 高桑聖仁

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TAKAKUWA Masahito 高桑聖仁

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Researcher Number	00981838
Other IDs	https://orcid.org/0000-0003-2444-6237
Affiliation (Current)	2026: 東京大学, 大学院工学系研究科(工学部), 助教
Affiliation (based on the past Project Information) *help	2023 – 2026: 東京大学, 大学院工学系研究科(工学部), 助教
Review Section/Research Field	Principal Investigator Basic Section 21060:Electron device and electronic equipment-related / 0302:Electrical and electronic engineering and related fields Except Principal Investigator Medium-sized Section 21:Electrical and electronic engineering and related fields
Keywords	Principal Investigator 薄膜エレクトロニクス実装 / 表面活性化接合 / 粘弾性特性フリー / プラズマ直接接合 / データグローブ / スチーム処理 / プラズマ処理 / 柔軟集積化 / 直接接合技術 / フレキシブル実装技術 … More / ハイブリット直接接合 / ハイブリッド直接接合 / 柔軟集積化技術 / プラズマ活性化接合 / ハイブリット直接接合法 / フレキシブルエレクトロニクス … More Except Principal Investigator 電源管理回路 / 電極パタニング / 伸縮性 / スキンエレクトロニクス / エレクトレット Less

完全弾性曲げセンサを用いた皮膚感覚を阻害しない指貼付け型関節角測定デバイスの創出Principal Investigator
- Principal Investigator
  
  高桑聖仁
- Project Period (FY)
  2026 – 2028
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  The University of Tokyo
Development of Skin-attached Energy Harvesting System Using Strechable Electret
- Principal Investigator
  
  鈴木雄二
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (A)
- Review Section
  
  Medium-sized Section 21:Electrical and electronic engineering and related fields
- Research Institution
  The University of Tokyo
無接着剤実装技術による粘弾性特性を回避した皮膚貼付け型データグローブの開発Principal Investigator
- Principal Investigator
  
  高桑聖仁
- Project Period (FY)
  2024 – 2025
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 21060:Electron device and electronic equipment-related
- Research Institution
  The University of Tokyo
Hybrid direct bonding of polymer films and metal electrodes via a plasma steam heatingPrincipal Investigator
- Principal Investigator
  
  TAKAKUWA Masahito
- Project Period (FY)
  2023 – 2024
- Research Category
  
  Grant-in-Aid for Research Activity Start-up
- Review Section
  
  0302:Electrical and electronic engineering and related fields
- Research Institution
  The University of Tokyo

All 2025 2024 2023

All Journal Article Presentation

[Journal Article] Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration2025
- Author(s)
  Takakuwa Masahito、Inoue Daishi、Sun Lulu、Yamamoto Michitaka、Umezu Shinjiro、Hashizume Daisuke、Itoh Toshihiro、Fukuda Kenjiro、Someya Takao、Yokota Tomoyuki
- Journal Title
  
  Advanced Materials
  
  Volume: - Issue: 49
- DOI
  10.1002/adma.202417590
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2025
- Author(s)
  高桑聖仁
- Organizer
  一般社団法人電子実装工学研究所IMSI会員会
- Invited
- Data Source
  KAKENHI-PROJECT-24K17317
[Presentation] Mechanically durable direct bonding method for the flexible integrated system2024
- Author(s)
  高桑聖仁
- Organizer
  UTokyo-Cambridge symposium "Materials, devices, and systems for seamless human-computer interactions"
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] パリレンポリマー接合及び金接合用途に使用可能なハイブリット接合法2024
- Author(s)
  高桑聖仁
- Organizer
  日本機械学会
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024
- Author(s)
  高桑聖仁
- Organizer
  2024 応用物理学会秋季学術講演会
- Invited
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] Hybrid direct bonding method for integrating flexible electronics2024
- Author(s)
  Masahito Takakuwa
- Organizer
  FSE 7th event
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024
- Author(s)
  高桑聖仁
- Organizer
  一般社団法人電子実装工学研究所IMSI会員会
- Invited
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024
- Author(s)
  高桑聖仁
- Organizer
  2024 応用物理学会秋季学術講演会
- Invited
- Data Source
  KAKENHI-PROJECT-24K17317
[Presentation] Flexible bonding method for creating flexible electronics system with a plasma activation2024
- Author(s)
  高桑聖仁
- Organizer
  2024MRS Fall
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] Direct parylene bonding for the flexible microfluidic device resistive against the absorption of small molecules2023
- Author(s)
  Masahito Takakuwa
- Organizer
  MRS2023Fall
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] パリレンの低温直接接合を用いた柔軟なマイクロ流路デバイスの作製2023
- Author(s)
  高桑聖仁
- Organizer
  2023年応用物理学会秋季学術講演会
- Data Source
  KAKENHI-PROJECT-23K19111
[Presentation] Direct parylene bonding with low temperature using plasma treatment and water droplet2023
- Author(s)
  高桑聖仁
- Organizer
  The 6th Event of the Young Researchers Society for Flexible and Stretchable Electronics
- Data Source
  KAKENHI-PROJECT-23K19111

1. 鈴木雄二 (80222066)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
2. 横田知之 (30723481)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 三好智也 (90809641)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Takakuwa Masahito 高桑 聖仁

TAKAKUWA Masahito 高桑 聖仁

Research Projects

Research Products

Co-Researchers

完全弾性曲げセンサを用いた皮膚感覚を阻害しない指貼付け型関節角測定デバイスの創出Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of Skin-attached Energy Harvesting System Using Strechable Electret

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

無接着剤実装技術による粘弾性特性を回避した皮膚貼付け型データグローブの開発Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Hybrid direct bonding of polymer films and metal electrodes via a plasma steam heatingPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration2025

Author(s)

Journal Title

DOI

Data Source

[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2025

Author(s)

Organizer

Data Source

[Presentation] Mechanically durable direct bonding method for the flexible integrated system2024

Author(s)

Organizer

Data Source

[Presentation] パリレンポリマー接合及び金接合用途に使用可能なハイブリット接合法2024

Author(s)

Organizer

Data Source

[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024

Author(s)

Organizer

Data Source

[Presentation] Hybrid direct bonding method for integrating flexible electronics2024

Author(s)

Organizer

Data Source

[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024

Author(s)

Organizer

Data Source

[Presentation] フレキシブルエレクトロニクスのための柔軟実装技術2024

Author(s)

Organizer

Data Source

[Presentation] Flexible bonding method for creating flexible electronics system with a plasma activation2024

Author(s)

Organizer

Data Source

[Presentation] Direct parylene bonding for the flexible microfluidic device resistive against the absorption of small molecules2023

Author(s)

Organizer

Data Source

[Presentation] パリレンの低温直接接合を用いた柔軟なマイクロ流路デバイスの作製2023

Author(s)

Organizer

Data Source

[Presentation] Direct parylene bonding with low temperature using plasma treatment and water droplet2023

Author(s)

Organizer

Data Source

Takakuwa Masahito 高桑聖仁

TAKAKUWA Masahito 高桑聖仁