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ZHANG HAO  張 昊

ORCIDConnect your ORCID iD *help
Researcher Number 10773658
Affiliation (based on the past Project Information) *help 2017 – 2018: 大阪大学, 産業科学研究所, 特任助教(常勤)
Review Section/Research Field
Principal Investigator
Composite materials/Surface and interface engineering
Keywords
Principal Investigator
ナノ材料 / 電子デバイス / 電子・電気材料 / 接合 / 銀直接接合 / SMB / 銀ナノ火山 / 銀ヒロック / 銀膜直接接合
  • Research Projects

    (1 results)
  • Research Products

    (8 results)
  •  Controlled abnormal growth of silver hillocks: mechanism and applicationPrincipal Investigator

    • Principal Investigator
      ZHANG HAO
    • Project Period (FY)
      2017 – 2018
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Composite materials/Surface and interface engineering
    • Research Institution
      Osaka University

All 2019 2018

All Journal Article Presentation

  • [Journal Article] Large-area die-attachment by silver stress migration bonding for power device applications2018

    • Author(s)
      Seungjun Noh, Hao Zhang, Jeyun Yeom, Chuantong Chen, Caifu Li and Katsuaki Suganuma
    • Journal Title

      Microelectronics Reliability

      Volume: 88-90 Pages: 701-706

    • DOI

      10.1016/j.microrel.2018.07.131

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Journal Article] Heat-Resistant Microporous Ag Die-Attach Structure for Wide Band-Gap Power Semiconductors2018

    • Author(s)
      Seungjun Noh, Hao Zhang and Katsuaki Suganuma
    • Journal Title

      Materials

      Volume: 11 Issue: 12 Pages: 2531-2540

    • DOI

      10.3390/ma11122531

    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] A Novel Joining Process for the Die-attachment of Next-generation Power Devices2019

    • Author(s)
      Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara and Katsuaki Suganuma
    • Organizer
      TMS 2019
    • Invited / Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] Microstructural Investigation on the Mechanism of Ag Thin Film Bonding2018

    • Author(s)
      Zhi-Quan Liu, Hao Zhang, Cai-Fu Li, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma
    • Organizer
      TMS 2018 147th Annual Meeting & Exhibition, Phoenix, US, March. 12-15, 2018
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] Ag joining techniques for wide-band gap power devices2018

    • Author(s)
      Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara and Katsuaki Suganuma
    • Organizer
      ICEP-IAAC 2018
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] TMS2018-Thermal stable Ag-Ag joints bonded by ultrasound-assisted stress migration bonding2018

    • Author(s)
      Hao Zhang, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara and Katsuaki Suganuma
    • Organizer
      TMS 2018 147th Annual Meeting & Exhibition, Phoenix, US, March. 12-15, 2018
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] Nearly perfect Ag joints prepared by Ag SMB bonding process2018

    • Author(s)
      Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Aishi Suetake, Toru Sugahara, Shijo Nagao, and Katsuaki Suganuma
    • Organizer
      3D-PEIM 2018
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824
  • [Presentation] A nearly-perfect pure Ag joints prepared by novel Ag to Ag direct bonding2018

    • Author(s)
      Hao Zhang, Seungjun Noh, Norio Asatani, Yukiharu Kimoto, Aiji Suetake, Shijo Nagao, Tohru Sugahara, and Katsuaki Suganuma
    • Organizer
      ICEP-IAAC 2018, Mie, Japan, April. 17-21, 2018
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-17K14824

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