Takashi Matsumae 松前貴司

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Matsumae Takashi 松前貴司

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Researcher Number	10807431
Other IDs
Affiliation (Current)	2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
Affiliation (based on the past Project Information) *help	2023 – 2025: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員 2020 – 2022: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究員 2021: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
Review Section/Research Field	Principal Investigator Basic Section 26030:Composite materials and interfaces-related / Basic Section 18020:Manufacturing and production engineering-related Except Principal Investigator Medium-sized Section 16:Astronomy and related fields / Basic Section 18020:Manufacturing and production engineering-related
Keywords	Principal Investigator ダイヤモンド / Ga2O3 / 接合界面 / GaN / 界面熱抵抗 / 微細構造 / インプリント / エッチング / 微細金型 / ナノインプリント … More / ニッケル / 微細加工 / 低温接合 / 放熱基板 / ウルトラワイドギャップ / パワー半導体 / pnジャンクション / 放熱構造 / 直接接合 / 酸化ガリウム … More Except Principal Investigator 赤外線撮像素子 / X線撮像素子 / 異種半導体常温接合 / ゲルマニウム撮像素子 / ゲッター / 量子干渉効果 / マイクロデバイス / 脱ガス / 量子干渉 / 接合 / 気密封止 / MEMS Less

異種材料間でのフォノン輸送効率化に支配的な要因の明確化Principal Investigator
- Principal Investigator
  
  松前貴司
- Project Period (FY)
  2025 – 2027
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Realization of Si-Ge integrated broadband X-ray gamma-ray and optical-infrared imaging devices using Japan's original Surface-Activated wafer Bonding technology
- Principal Investigator
  
  鶴剛
- Project Period (FY)
  2024 – 2025
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 16:Astronomy and related fields
- Research Institution
  Kyoto University
Development of Wide-band X-ray gamma-ray and optical-infrared integrated imaging devices by Japan's Original Surface-Activated Wafer Bonding Technology
- Principal Investigator
  
  Tsuru Takeshi
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 16:Astronomy and related fields
- Research Institution
  Kyoto University
Developing microfabrication methods and optimal structures for diamond-based cooling structuresPrincipal Investigator
- Principal Investigator
  
  Matsumae Takashi
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 18020:Manufacturing and production engineering-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Low-temperature direct bonding of beta-Ga2O3/diamond for advanced power electronicsPrincipal Investigator
- Principal Investigator
  
  Matsumae Takashi
- Project Period (FY)
  2020 – 2021
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Research about ultra-high hermetic seal bonding for microcavity by quantum sensing
- Principal Investigator
  
  Yuichi Kurashima
- Project Period (FY)
  2019 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 18020:Manufacturing and production engineering-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology

All 2023 2022 2021 2020 2019

All Journal Article Presentation

[Journal Article] Progenitor Constraint with Circumstellar Material for the Magnetar-hosting Supernova Remnant RCW 1032023
- Author(s)
  Narita Takuto、Uchida Hiroyuki、Yoshida Takashi、Tanaka Takaaki、Tsuru Takeshi Go
- Journal Title
  
  The Astrophysical Journal
  
  Volume: 950 Issue: 2 Pages: 137-137
- DOI
  10.3847/1538-4357/acccf6
- Peer Reviewed / Open Access
- Data Source
  KAKENHI-PROJECT-23KJ1350, KAKENHI-PROJECT-22K18721, KAKENHI-PUBLICLY-22H04572, KAKENHI-PUBLICLY-23H04006
[Journal Article] Xtend, the soft x-ray imaging telescope for the x-ray imaging and spectroscopy mission (XRISM)2022
- Author(s)
  Mori Koji、Tomida Hiroshi、Nakajima Hiroshi、（他52名）
- Journal Title
  
  Proceedings of the SPIE
  
  Volume: 12181 Pages: 11-11
- DOI
  10.1117/12.2626894
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-21K03615, KAKENHI-PROJECT-19K21884, KAKENHI-PROJECT-22K18721, KAKENHI-PROJECT-21K13963, KAKENHI-PROJECT-20KK0071, KAKENHI-PUBLICLY-21H05461, KAKENHI-PROJECT-21H04493, KAKENHI-PROJECT-22KJ3059, KAKENHI-PROJECT-21J10842, KAKENHI-PROJECT-18K03678, KAKENHI-PROJECT-20K14491, KAKENHI-PROJECT-18H03700, KAKENHI-PUBLICLY-22H04572, KAKENHI-PROJECT-23K20239, KAKENHI-PROJECT-23K20850, KAKENHI-PROJECT-23K22540, KAKENHI-PROJECT-20H00175, KAKENHI-PROJECT-20H01941
[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022
- Author(s)
  Kariya Shingo、Matsumae Takashi、KURASHIMA Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: - Issue: 5 Pages: 051004-051004
- DOI
  10.35848/1347-4065/ac52b8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Diamond/β-Ga2O3 pn heterojunction diodes fabricated by low-temperature direct-bonding2021
- Author(s)
  Sittimart Phongsaphak、Ohmagari Shinya、Matsumae Takashi、Umezawa Hitoshi、Yoshitake Tsuyoshi
- Journal Title
  
  AIP Advances
  
  Volume: 11 Issue: 10 Pages: 105114-105114
- DOI
  10.1063/5.0062531
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044, KAKENHI-PROJECT-19H02436
[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021
- Author(s)
  Kurashima Yuichi、Matsumae Takashi、Higurashi Eiji、Yanagimachi Sinya、Kusui Takaaki、Watanabe Mitsuhiro、Takagi Hideki
- Journal Title
  
  Microelectronic Engineering
  
  Volume: 238 Pages: 111513-111513
- DOI
  10.1016/j.mee.2021.111513
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning2021
- Author(s)
  Fukumoto Shoya、Matsumae Takashi、Kurashima Yuichi、Takagi Hideki、Umezawa Hitoshi、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  Applied Physics Letters
  
  Volume: 117 Issue: 20 Pages: 201601-201601
- DOI
  10.1063/5.0026348
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20K15044
[Journal Article] Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions2021
- Author(s)
  Matsumae Takashi、Kurashima Yuichi、Takagi Hideki、Umezawa Hitoshi、Higurashi Eiji
- Journal Title
  
  Scripta Materialia
  
  Volume: 191 Pages: 52-55
- DOI
  10.1016/j.scriptamat.2020.09.006
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20K15044
[Journal Article] Hetero-integration of β-Ga2O3 and Diamond substrates by hydrophilic bonding technique2020
- Author(s)
  Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Hitoshi Umezawa, Koji Tanaka, Toshimitsu Ito, Hideyuki Watanabe and Eiji Higurashi
- Journal Title
  
  ECS Trans.
  
  Volume: 98 Issue: 4 Pages: 17-20
- DOI
  10.1149/09804.0017ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19K04503, KAKENHI-PROJECT-20K15044
[Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020
- Author(s)
  Matsumae Takashi、Kariya Shingo、Kurashima Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  ECS Transactions
  
  Volume: 98 Issue: 4 Pages: 211-215
- DOI
  10.1149/09804.0211ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Ni金型への固溶を用いたダイヤモンド基材の加工2023
- Author(s)
  松前貴司、西森弘明、倉島優一、高木秀樹
- Organizer
  2023年度精密工学会春季大会学術講演会
- Data Source
  KAKENHI-PROJECT-22K14163
[Presentation] Ni金型への固溶を用いたダイヤモンド基材の加工2023
- Author(s)
  松前貴司, 西森弘明, 倉島優一, 高木秀樹著者情報
- Organizer
  2023年度精密工学会春季大会
- Data Source
  KAKENHI-PROJECT-22K14163
[Presentation] A hard X-ray complement to Athena: The prospect of hard X-ray astronomy in the 2030s and the FORCE mission2022
- Author(s)
  Hornschemeier, Ann ; Mori, Koji ; Tsuru, Takeshi ; Nakazawa, Kazuhiro ; Ueda, Yoshihiro ; Tanaka, Takaaki ; Watanabe, Shin ; Ishida, Manabu ; Matsumoto, Hironori ; Awaki, Hisamitsu ; Okajima, Takashi ; Zhang, William ; Yukita, Mihoko ; Williams, Brian
- Organizer
  AAS High Energy Astrophysics Division meeting #19
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K18721
[Presentation] Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate2022
- Author(s)
  T. Matsumae, Y. Kurashima, H. Takagi, H. Umezawa, H. Watanabe, T. Ito, E. Higurashi
- Organizer
  2022 International Conference on Electronics Packaging (ICEP 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則
- Organizer
  第38回「センサ・マイクロマシンと応用システム」シンポジウム
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  2021 7th International Workshop on Low Temperature Bonding for 3D Integration
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  International Conference on Electronics Packaging 2021
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] β-Ga2O3薄膜とダイヤモンド基板の低温直接接合2020
- Author(s)
  松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 田中孝治, 伊藤利充, 渡邊幸志, 日暮栄治
- Organizer
  ２０２０年度精密工学会秋季大会学術講演会
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] キャビティ内部にて残留ガスを吸収させたTi/Pt/Au封止接合膜の構造観察2020
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則, 日暮栄治
- Organizer
  2020年度精密工学会秋季大会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020
- Author(s)
  狩谷真悟、松前貴司、倉島優一、日暮栄治、早瀬仁則、高木秀樹
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Au/Ti薄膜の低温接合及びゲッター材への適応性評価2020
- Author(s)
  倉島優一、楠井貴晶、松前貴司、日暮栄治、髙木秀樹、渡邉満洋
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Hetero-Integration of β-Ga2O3 and Diamond Substrates by Hydrophilic Bonding Technique2020
- Author(s)
  Takashi Matsumae, Yuichi Kurashima, HIdeki Takagi, Hitoshi Umezawa, Koji Tanaka, Toshimitsu Ito, Hidekyuki Watanabe, Eiji Higurashi
- Organizer
  Pacific Rim Meeting on Electrochemical and Solid State Science 2020 (PRiME 2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] Au/Ti double-layered films for bonding and residual gas gettering in MEMS encapsulation2019
- Author(s)
  Y. Kurashima, T. Matsumae, E. Higurashi, S. Yanagimachi, H. Takagi, Sudiyarmanto, E. Kondoh
- Organizer
  45th International Conference Micro and Nano Engineering
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02045

1. Yuichi Kurashima (70408730)

# of Collaborated Projects: 2 results

# of Collaborated Products: 10 results
2. Tsuru Takeshi (10243007)

# of Collaborated Projects: 2 results

# of Collaborated Products: 1 results
3. 和田武彦 (50312202)

# of Collaborated Projects: 2 results

# of Collaborated Products: 0 results
4. 柳町真也 (70358216)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
5. 鈴木仁研 (30534599)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
6. 高木秀樹 (00357344)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
7. 八木貴志 (10415755)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
8. 山下雄一郎 (60462834)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
9. ITO Toshimitsu

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

Takashi Matsumae 松前 貴司

Matsumae Takashi 松前 貴司

Research Projects

Research Products

Co-Researchers

異種材料間でのフォノン輸送効率化に支配的な要因の明確化Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Realization of Si-Ge integrated broadband X-ray gamma-ray and optical-infrared imaging devices using Japan's original Surface-Activated wafer Bonding technology

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of Wide-band X-ray gamma-ray and optical-infrared integrated imaging devices by Japan's Original Surface-Activated Wafer Bonding Technology

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Developing microfabrication methods and optimal structures for diamond-based cooling structuresPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Low-temperature direct bonding of beta-Ga2O3/diamond for advanced power electronicsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Research about ultra-high hermetic seal bonding for microcavity by quantum sensing

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Progenitor Constraint with Circumstellar Material for the Magnetar-hosting Supernova Remnant RCW 1032023

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Xtend, the soft x-ray imaging telescope for the x-ray imaging and spectroscopy mission (XRISM)2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Diamond/β-Ga2O3 pn heterojunction diodes fabricated by low-temperature direct-bonding2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Hetero-integration of β-Ga2O3 and Diamond substrates by hydrophilic bonding technique2020

Author(s)

Journal Title

DOI

Takashi Matsumae 松前貴司

Matsumae Takashi 松前貴司

[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021

[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020