Takashi Matsumae 松前貴司

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Matsumae Takashi 松前貴司

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Researcher Number	10807431
Other IDs
Affiliation (Current)	2023: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
Affiliation (based on the past Project Information) *help	2020 – 2022: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 研究員 2021: 国立研究開発法人産業技術総合研究所, エレクトロニクス・製造領域, 主任研究員
Review Section/Research Field	Principal Investigator Basic Section 18020:Manufacturing and production engineering-related / Basic Section 26030:Composite materials and interfaces-related Except Principal Investigator Medium-sized Section 16:Astronomy and related fields / Basic Section 18020:Manufacturing and production engineering-related
Keywords	Principal Investigator ダイヤモンド / インプリント / 微細加工 / ニッケル / 低温接合 / 放熱基板 / ウルトラワイドギャップ / パワー半導体 / Ga2O3 / pnジャンクション / 放熱構造 / 直接接合 / 酸化ガリウム … More Except Principal Investigator … More 赤外線撮像素子 / X線撮像素子 / 異種半導体常温接合 / ゲルマニウム撮像素子 / ゲッター / 量子干渉効果 / マイクロデバイス / 脱ガス / 量子干渉 / 接合 / 気密封止 / MEMS Less

オールダイヤモンド冷却構造のための微細加工法および最適構造の探索Principal Investigator
- Principal Investigator
  
  松前貴司
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 18020:Manufacturing and production engineering-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Development of Wide-band X-ray gamma-ray and optical-infrared integrated imaging devices by Japan's Original Surface-Activated Wafer Bonding Technology
- Principal Investigator
  
  鶴剛
- Project Period (FY)
  2022 – 2023
- Research Category
  
  Grant-in-Aid for Challenging Research (Exploratory)
- Review Section
  
  Medium-sized Section 16:Astronomy and related fields
- Research Institution
  Kyoto University
Low-temperature direct bonding of beta-Ga2O3/diamond for advanced power electronicsPrincipal Investigator
- Principal Investigator
  
  Matsumae Takashi
- Project Period (FY)
  2020 – 2021
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 26030:Composite materials and interfaces-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology
Research about ultra-high hermetic seal bonding for microcavity by quantum sensing
- Principal Investigator
  
  Yuichi Kurashima
- Project Period (FY)
  2019 – 2021
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 18020:Manufacturing and production engineering-related
- Research Institution
  National Institute of Advanced Industrial Science and Technology

All 2022 2021 2020 2019

All Journal Article Presentation

[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022
- Author(s)
  Kariya Shingo、Matsumae Takashi、KURASHIMA Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: - Issue: 5 Pages: 051004-051004
- DOI
  10.35848/1347-4065/ac52b8
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021
- Author(s)
  Kurashima Yuichi、Matsumae Takashi、Higurashi Eiji、Yanagimachi Sinya、Kusui Takaaki、Watanabe Mitsuhiro、Takagi Hideki
- Journal Title
  
  Microelectronic Engineering
  
  Volume: 238 Pages: 111513-111513
- DOI
  10.1016/j.mee.2021.111513
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning2021
- Author(s)
  Fukumoto Shoya、Matsumae Takashi、Kurashima Yuichi、Takagi Hideki、Umezawa Hitoshi、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  Applied Physics Letters
  
  Volume: 117 Issue: 20 Pages: 201601-201601
- DOI
  10.1063/5.0026348
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20K15044
[Journal Article] Diamond/β-Ga2O3 pn heterojunction diodes fabricated by low-temperature direct-bonding2021
- Author(s)
  Sittimart Phongsaphak、Ohmagari Shinya、Matsumae Takashi、Umezawa Hitoshi、Yoshitake Tsuyoshi
- Journal Title
  
  AIP Advances
  
  Volume: 11 Issue: 10 Pages: 105114-105114
- DOI
  10.1063/5.0062531
- Peer Reviewed / Open Access / Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044, KAKENHI-PROJECT-19H02436
[Journal Article] Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions2021
- Author(s)
  Matsumae Takashi、Kurashima Yuichi、Takagi Hideki、Umezawa Hitoshi、Higurashi Eiji
- Journal Title
  
  Scripta Materialia
  
  Volume: 191 Pages: 52-55
- DOI
  10.1016/j.scriptamat.2020.09.006
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-20K15044
[Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020
- Author(s)
  Matsumae Takashi、Kariya Shingo、Kurashima Yuichi、Takagi Hideki、Hayase Masanori、Higurashi Eiji
- Journal Title
  
  ECS Transactions
  
  Volume: 98 Issue: 4 Pages: 211-215
- DOI
  10.1149/09804.0211ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19H02045
[Journal Article] Hetero-integration of β-Ga2O3 and Diamond substrates by hydrophilic bonding technique2020
- Author(s)
  Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Hitoshi Umezawa, Koji Tanaka, Toshimitsu Ito, Hideyuki Watanabe and Eiji Higurashi
- Journal Title
  
  ECS Trans.
  
  Volume: 98 Issue: 4 Pages: 17-20
- DOI
  10.1149/09804.0017ecst
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19K04503, KAKENHI-PROJECT-20K15044
[Presentation] Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate2022
- Author(s)
  T. Matsumae, Y. Kurashima, H. Takagi, H. Umezawa, H. Watanabe, T. Ito, E. Higurashi
- Organizer
  2022 International Conference on Electronics Packaging (ICEP 2022)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  2021 7th International Workshop on Low Temperature Bonding for 3D Integration
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021
- Author(s)
  狩谷真悟、松前貴司、倉島優一、高木秀樹、早瀬仁則、日暮栄治
- Organizer
  International Conference on Electronics Packaging 2021
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則
- Organizer
  第38回「センサ・マイクロマシンと応用システム」シンポジウム
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] キャビティ内部にて残留ガスを吸収させたTi/Pt/Au封止接合膜の構造観察2020
- Author(s)
  狩谷真悟, 松前貴司, 倉島優一, 髙木秀樹, 早瀬仁則, 日暮栄治
- Organizer
  2020年度精密工学会秋季大会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020
- Author(s)
  狩谷真悟、松前貴司、倉島優一、日暮栄治、早瀬仁則、高木秀樹
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] β-Ga2O3薄膜とダイヤモンド基板の低温直接接合2020
- Author(s)
  松前貴司, 倉島優一, 高木秀樹, 梅沢仁, 田中孝治, 伊藤利充, 渡邊幸志, 日暮栄治
- Organizer
  ２０２０年度精密工学会秋季大会学術講演会
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] Au/Ti薄膜の低温接合及びゲッター材への適応性評価2020
- Author(s)
  倉島優一、楠井貴晶、松前貴司、日暮栄治、髙木秀樹、渡邉満洋
- Organizer
  精密工学会春季大会講演会
- Data Source
  KAKENHI-PROJECT-19H02045
[Presentation] Hetero-Integration of β-Ga2O3 and Diamond Substrates by Hydrophilic Bonding Technique2020
- Author(s)
  Takashi Matsumae, Yuichi Kurashima, HIdeki Takagi, Hitoshi Umezawa, Koji Tanaka, Toshimitsu Ito, Hidekyuki Watanabe, Eiji Higurashi
- Organizer
  Pacific Rim Meeting on Electrochemical and Solid State Science 2020 (PRiME 2020)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-20K15044
[Presentation] Au/Ti double-layered films for bonding and residual gas gettering in MEMS encapsulation2019
- Author(s)
  Y. Kurashima, T. Matsumae, E. Higurashi, S. Yanagimachi, H. Takagi, Sudiyarmanto, E. Kondoh
- Organizer
  45th International Conference Micro and Nano Engineering
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-19H02045

1. Yuichi Kurashima (70408730)

# of Collaborated Projects: 1 results

# of Collaborated Products: 10 results
2. 柳町真也 (70358216)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
3. 鶴剛 (10243007)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
4. 和田武彦 (50312202)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
5. ITO Toshimitsu

# of Collaborated Projects: 0 results

# of Collaborated Products: 1 results

Takashi Matsumae 松前 貴司

Matsumae Takashi 松前 貴司

Research Projects

Research Products

Co-Researchers

オールダイヤモンド冷却構造のための微細加工法および最適構造の探索Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of Wide-band X-ray gamma-ray and optical-infrared integrated imaging devices by Japan's Original Surface-Activated Wafer Bonding Technology

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Low-temperature direct bonding of beta-Ga2O3/diamond for advanced power electronicsPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Research about ultra-high hermetic seal bonding for microcavity by quantum sensing

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Simple and low-temperature vacuum packaging process by using Au/Ta/Ti metal multilayer2022

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Application of thin Au/Ti double-layered films as both low-temperature bonding layer and residual gas gettering material for MEMS encapsulation2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Heterogeneous direct bonding of diamond and semiconductor substrates using NH3/H2O2 cleaning2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Diamond/β-Ga2O3 pn heterojunction diodes fabricated by low-temperature direct-bonding2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Low-temperature direct bonding of diamond (100) substrate on Si wafer under atmospheric conditions2021

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Gas Absorption in Package Using Au/Pt/Ti Bonding Layer2020

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Hetero-integration of β-Ga2O3 and Diamond substrates by hydrophilic bonding technique2020

Author(s)

Journal Title

DOI

Data Source

[Presentation] Efficient heat dissipation from β-Ga2O3 film directly bonded on diamond substrate2022

Author(s)

Organizer

Data Source

[Presentation] Simplified vacuum packaging process by gas gettering using the Au/Ta/Ti metal bonding layer2021

Author(s)

Organizer

Data Source

[Presentation] Development of Au/Pt/Ti multilayers for wafer-level packaging and residual gas gettering2021

Author(s)

Organizer

Data Source

[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開 発とその低温化2021

Author(s)

Organizer

Data Source

Takashi Matsumae 松前貴司

Matsumae Takashi 松前貴司

[Presentation] 真空封止用 Au/Ta/Ti 接合層を用いたガス吸収プロセスの開発とその低温化2021

[Presentation] 脱ガス処理後の真空封止と内部残留ガスゲッタリングが可能な MEMS 封止用金属接合膜の開発2020