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Kosaka Akio  小坂 暁夫

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小坂 暁夫  コサカ アキオ

KOSAKA Akio  小坂 暁夫

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Researcher Number 20242480
External Links
Affiliation (Current) 2025: 富山大学, 学術研究部工学系, 助教
Affiliation (based on the past Project Information) *help 2001 – 2002: 富山大学, 工学部, 助手
1997 – 1998: 富山大学, 工学部, 助手
Review Section/Research Field
Principal Investigator
Thermal engineering
Except Principal Investigator
Thermal engineering
Keywords
Principal Investigator
過熱 / 噴霧液滴 / 液滴分散流 / スプレーフラッシュ / ノズル / 噴霧特性 / 液滴 / 減圧沸騰 / 微粒化 / スプレーフラッシュ蒸発 … More
Except Principal Investigator
… More Mechanical property / Thermal diffusivity / Specific heat / Thermal conductivity / Heat sink material / Cu-Mo composite / thermal expansion / Thermal expansioncoefficient / Heat conduction material / Termal diffusivity / Thermal expansion material / Heat conductive material / Laminated Cu-Mo composite / Termal expansion Less
  • Research Projects

    (2 results)
  • Co-Researchers

    (2 People)
  •  ミスト冷却熱伝達の促進を目的としたスプレーフラッシュ液体微粒化法の追究Principal Investigator

    • Principal Investigator
      小坂 暁夫
    • Project Period (FY)
      2001 – 2002
    • Research Category
      Grant-in-Aid for Young Scientists (B)
    • Research Field
      Thermal engineering
    • Research Institution
      University of Toyama
  •  The Trial Manufacture of Heat Sink Material Made with Cu-Mo Composite for Semiconductor Chip and A Study on Their Thermophysical Properties

    • Principal Investigator
      TAKEGOSHI Eisyun
    • Project Period (FY)
      1997 – 1998
    • Research Category
      Grant-in-Aid for Scientific Research (C)
    • Research Field
      Thermal engineering
    • Research Institution
      Toyama University
  • 1.  TAKEGOSHI Eisyun (00019184)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results
  • 2.  HIRASAWA Yoshio (80115146)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 0 results

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