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Takeuchi Kai  竹内 魁

ORCIDConnect your ORCID iD *help
Researcher Number 20896716
Other IDs
Affiliation (Current) 2025: 東北大学, 工学研究科, 助教
Affiliation (based on the past Project Information) *help 2023 – 2024: 東北大学, 工学研究科, 助教
Review Section/Research Field
Principal Investigator
Basic Section 26030:Composite materials and interfaces-related
Except Principal Investigator
Basic Section 21060:Electron device and electronic equipment-related
Keywords
Principal Investigator
微小流路 / 低温接合 / ウェハ接合
Except Principal Investigator
表面粗さ / 銀薄膜 / キャップ層 / 表面活性化接合 / 接合界面制御 / 常温接合
  • Research Projects

    (2 results)
  • Research Products

    (3 results)
  • Co-Researchers

    (1 People)
  •  Creation of fundamental technology on room-temperature bonding through nano-interface control

    • Principal Investigator
      日暮 栄治
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 21060:Electron device and electronic equipment-related
    • Research Institution
      Tohoku University
  •  Room temperature bonding for corrosion-resistant interfacePrincipal Investigator

    • Principal Investigator
      竹内 魁
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Tohoku University

All 2024 2023

All Journal Article Presentation

  • [Journal Article] Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$2024

    • Author(s)
      Takeuchi Kai、Suga Tadatomo、Higurashi Eiji
    • Journal Title

      Scientific Reports

      Volume: 14 Issue: 1 Pages: 1267-1267

    • DOI

      10.1038/s41598-024-51800-6

    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] 銀薄膜表面活性化接合のためのTiキャップ層による表面荒れの抑制2024

    • Author(s)
      蔡元昊,竹内魁,魚本幸,島津武仁,日暮栄治
    • Organizer
      第38回エレクトロニクス実装学会春季講演大会
    • Data Source
      KAKENHI-PROJECT-23K26154
  • [Presentation] Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding2023

    • Author(s)
      Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, and Eiji Higurashi
    • Organizer
      12th IEEE CPMT symposium Japan (ICSJ 2023)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K26154
  • 1.  日暮 栄治 (60372405)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 2 results

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