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Takeuchi Kai  竹内 魁

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竹内 魁  タケウチ カイ

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Researcher Number 20896716
Other IDs
Affiliation (Current) 2026: 東北大学, 工学研究科, 准教授
Affiliation (based on the past Project Information) *help 2026: 東北大学, 工学研究科, 助教
2023 – 2024: 東北大学, 工学研究科, 助教
Review Section/Research Field
Principal Investigator
Basic Section 26030:Composite materials and interfaces-related
Except Principal Investigator
Basic Section 21060:Electron device and electronic equipment-related
Keywords
Principal Investigator
低温接合 / 微小流路 / 実装 / ウェハ接合
Except Principal Investigator
銀薄膜 / 接合界面制御 / 真空紫外光 / 表面粗さ / キャップ層 / 平滑化 / 常温接合 / 表面活性化接合
  • Research Projects

    (3 results)
  • Research Products

    (11 results)
  • Co-Researchers

    (1 People)
  •  無機高分子膜を用いる水中接合工学の開拓Principal Investigator

    • Principal Investigator
      竹内 魁
    • Project Period (FY)
      2026 – 2028
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Tohoku University
  •  Creation of fundamental technology on room-temperature bonding through nano-interface control

    • Principal Investigator
      日暮 栄治
    • Project Period (FY)
      2024 – 2025
    • Research Category
      Grant-in-Aid for Scientific Research (B)
    • Review Section
      Basic Section 21060:Electron device and electronic equipment-related
    • Research Institution
      Tohoku University
  •  Room temperature bonding for corrosion-resistant interfacePrincipal Investigator

    • Principal Investigator
      竹内 魁
    • Project Period (FY)
      2023 – 2025
    • Research Category
      Grant-in-Aid for Early-Career Scientists
    • Review Section
      Basic Section 26030:Composite materials and interfaces-related
    • Research Institution
      Tohoku University

All 2025 2024 2023

All Journal Article Presentation

  • [Journal Article] Room temperature wafer bonding via polysilazane for vacuum sealing bonding2025

    • Author(s)
      Takeuchi Kai、Higurashi Eiji
    • Journal Title

      Japanese Journal of Applied Physics

      Volume: 64 Issue: 3 Pages: 03SP36-03SP36

    • DOI

      10.35848/1347-4065/adb4fb

    • Peer Reviewed
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Journal Article] Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$2024

    • Author(s)
      Takeuchi Kai、Suga Tadatomo、Higurashi Eiji
    • Journal Title

      Scientific Reports

      Volume: 14 Issue: 1 Pages: 1267-1267

    • DOI

      10.1038/s41598-024-51800-6

    • Peer Reviewed / Open Access
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] Au薄膜転写により平滑化した AlNセラミック基板の表面活性化常温接合2025

    • Author(s)
      後藤慎太郎,小関奨吾,竹内魁,日暮栄治
    • Organizer
      第39回エレクトロニクス実装学会春季講演大会
    • Data Source
      KAKENHI-PROJECT-23K26154
  • [Presentation] Investigation of Plasma Gases for Polysilazane Conversion into SiO<inf>2</inf> for Wafer Bonding2024

    • Author(s)
      Daiki Nemoto , Kai Takeuchi , Eiji Higurashi
    • Organizer
      2024 International Conference on Electronics Packaging
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] Sequential surface treatment process with VUV light and Ar plasma for room temperature Au-Au bonding2024

    • Author(s)
      Mika Ogino, Kai Takeuchi, and Eiji Higurashi
    • Organizer
      13th IEEE CPMT symposium Japan (ICSJ 2024)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K26154
  • [Presentation] 銀薄膜表面活性化接合のためのTiキャップ層による表面荒れの抑制2024

    • Author(s)
      蔡元昊,竹内魁,魚本幸,島津武仁,日暮栄治
    • Organizer
      第38回エレクトロニクス実装学会春季講演大会
    • Data Source
      KAKENHI-PROJECT-23K26154
  • [Presentation] Optimization of Ag thin film thickness with a capping layer for Ag-Ag surface activated bonding2024

    • Author(s)
      Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, and Eiji Higurashi
    • Organizer
      2024 International Conference on Electronics Packaging (ICEP)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K26154
  • [Presentation] Plasma Hydrophilic Treatment for Improved Wafer Bonding Strength via Polysilazane2024

    • Author(s)
      Nemoto Daiki , Kai Takeuchi , Eiji Higurashi
    • Organizer
      2024 International 3D Systems Integration Conference
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] Adhesion between Si Substrates in Liquid Water Using Inorganic Polymer2024

    • Author(s)
      Daiki Nemoto , Kai Takeuchi , Eiji Higurashi
    • Organizer
      13th IEEE CPMT Symposium Japan
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] Perhydropolysilazane as an Adhesion Layer for Vacuum Sealing Wafer Bonding2024

    • Author(s)
      Kai Takeuchi , Daiki Nemoto , Eiji Higurashi
    • Organizer
      2024 8th International Workshop on Low Temperature Bonding for 3D Integration
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K13554
  • [Presentation] Suppression of surface roughening of Ag films by capping layer for Ag/Ag surface activated bonding2023

    • Author(s)
      Yuanhao Cai, Kai Takeuchi, Miyuki Uomoto, Takehito Shimatsu, and Eiji Higurashi
    • Organizer
      12th IEEE CPMT symposium Japan (ICSJ 2023)
    • Int'l Joint Research
    • Data Source
      KAKENHI-PROJECT-23K26154
  • 1.  日暮 栄治 (60372405)
    # of Collaborated Projects: 1 results
    # of Collaborated Products: 5 results

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