Fukunaga Shuhei 福永崇平

Researcher Number	20914138
Other IDs	https://orcid.org/0000-0001-6058-2047
Affiliation (Current)	2026: 大阪大学, 大学院工学研究科, 助教
Affiliation (based on the past Project Information) *help	2022 – 2025: 大阪大学, 大学院工学研究科, 助教
Review Section/Research Field	Principal Investigator Basic Section 21010:Power engineering-related Except Principal Investigator Basic Section 21010:Power engineering-related
Keywords	Principal Investigator パワーモジュール / 最適設計 / 信頼性 / 逆畳み込み積分 / TIM / 熱設計 / 過渡熱抵抗 / SiCパワーデバイス Except Principal Investigator オートチューニング / 学習最適化 / デジタルツイン / デジタルアクティブゲートドライバ / SiCパワーMOSFET

30年後も安心して使える高信頼SiCパワーモジュールの最適構造設計法の創出Principal Investigator
- Principal Investigator
  
  福永崇平
- Project Period (FY)
  2025 – 2027
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 21010:Power engineering-related
- Research Institution
  The University of Osaka
Development of fast self regulating digital active gate driver for SiC MOSFET
- Principal Investigator
  
  引原隆士
- Project Period (FY)
  2024 – 2025
- Research Category
  
  Grant-in-Aid for Scientific Research (B)
- Review Section
  
  Basic Section 21010:Power engineering-related
- Research Institution
  Research Institute for Applied Sciences
  Kyoto University
Thermal Design Evaluation Technology for Next-Generation SiC Power Modules for Power Electronics InnovationPrincipal Investigator
- Principal Investigator
  
  Fukunaga Shuhei
- Project Period (FY)
  2022 – 2024
- Research Category
  
  Grant-in-Aid for Early-Career Scientists
- Review Section
  
  Basic Section 21010:Power engineering-related
- Research Institution
  Osaka University

All 2025 2024 2023 2022

All Journal Article Presentation

[Journal Article] Analysis of errors in junction temperature estimated by temperature-sensitive electrical parameter for parallel-connected SBDs2025
- Author(s)
  Fukunaga Shuhei、Funaki Tsuyoshi
- Journal Title
  
  Japanese Journal of Applied Physics
  
  Volume: 64 Issue: 2 Pages: 02SP24-02SP24
- DOI
  10.35848/1347-4065/adacf5
- Data Source
  KAKENHI-PROJECT-22K14239
[Journal Article] Evaluation of Electrical Model Parameter Changes in SiC Power MOSFETs During Power Cycling Test2024
- Author(s)
  Fukunaga Shuhei、Nakamura Yuki、Funaki Tsuyoshi
- Journal Title
  
  IEEJ Journal of Industry Applications
  
  Volume: 13 Issue: 6 Pages: 731-740
- DOI
  10.1541/ieejjia.24004453
- ISSN
  2187-1094, 2187-1108
- Year and Date
  2024-11-01
- Language
  English
- Data Source
  KAKENHI-PROJECT-22K14239
[Journal Article] Digital-Twin-Compatible Optimization of Switching Characteristics for SiC MOSFETs Using Genetic Algorithm2023
- Author(s)
  Takayama Hajime、Fukunaga Shuhei、Hikihara Takashi
- Journal Title
  
  IEEE Journal of Emerging and Selected Topics in Industrial Electronics
  
  Volume: 4 Issue: 4 Pages: 1024-1033
- DOI
  10.1109/jestie.2023.3291636
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-22KJ1702, KAKENHI-PROJECT-23K26094
[Presentation] Power variation analysis during transient thermal measurement of semiconductor packages2025
- Author(s)
  Shuhei Fukunaga, Tomoaki Hara, Tsuyoshi Funaki
- Organizer
  ICEP-IAAE2025
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Comparative study on transient thermal resistance for β-Ga2O3 SBDs with junction-side cooling implementation2025
- Author(s)
  Shuhei Fukunaga, Tsuyoshi Funaki, Jun Arima, Minoru Fujita, Jun Hirabayashi
- Organizer
  ISPSD2025
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] 昇圧回路の動特性を改善するアクティブゲート駆動回路の実装方法の検討2024
- Author(s)
  福永崇平, 高山創, 引原隆士
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-23K26094
[Presentation] 金属放熱基板を用いたSiCパワーモジュールの過渡熱抵抗の実験的評価2024
- Author(s)
  大賀悠功, 福永崇平, 舟木剛
- Organizer
  電気学会産業応用部門大会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] ベイズ情報量規準に基づくパワーモジュールの熱応答モデル化に関する一検討2024
- Author(s)
  福永崇平, 舟木剛
- Organizer
  電気学会電力技術/電力系統技術/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Development of high-speed current switch box for transient thermal characterization of SiC power modules2024
- Author(s)
  Shuhei Fukunaga, and Tsuyoshi Funaki
- Organizer
  13th International Conference on Integrated Power Electronics Systems 2024 (CIPS 2024)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Analysis of errors in junction temperature estimated by temperature-sensitive electrical parameter for parallel-connected power devices2024
- Author(s)
  Shuhei Fukunaga, Tsuyoshi Funaki
- Organizer
  SSDM2024
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] パワーデバイスの温度係数を利用したマルチチップパワーモジュールの過渡熱回路モデル誤差に関する一検討2024
- Author(s)
  福永崇平, 舟木剛
- Organizer
  電気学会電子デバイス/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Evaluation of phase measurement error in digital oscilloscopes2024
- Author(s)
  Shuhei Fukunaga, Tsuyoshi Funaki
- Organizer
  I2MTC2024
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] SiCパワーデバイスのための過渡熱抵抗測定システムの開発2024
- Author(s)
  福永崇平, 舟木剛
- Organizer
  エレクトロニクス実装学会第34回マイクロエレクトロニクスシンポジウム (MES2024)
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] マルチチップパワーモジュール内部の熱干渉がジャンクション温度に与える影響に関する一検討2024
- Author(s)
  大賀悠功, 福永崇平, 舟木剛
- Organizer
  電気学会電子デバイス/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Parametric analysis for filter design in extracting transient thermal model parameters of SiC power modules2023
- Author(s)
  Shuhei Fukunaga, and Tsuyoshi Funaki
- Organizer
  The Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA-Asia 2023)
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] パワーデバイスの温度係数を利用したマルチチップモジュールのジャンクション温度推定誤差に関する一検討2023
- Author(s)
  福永崇平, 舟木剛
- Organizer
  電気学会電子デバイス/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] 複数TIMの組み合わせによるパワーモジュールの熱抵抗低減に関する実験的検討2023
- Author(s)
  清水優人, 福永崇平, 舟木剛
- Organizer
  電気学会全国大会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] SiCパワーデバイスの熱特性評価に適用する過渡熱抵抗測定システムの基礎検討2023
- Author(s)
  福永崇平, 舟木剛
- Organizer
  電気学会電力技術/電力系統技術/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239
[Presentation] Binary-weighted Modular Multi-level Digital Active Gate Driver2023
- Author(s)
  Takayama Hajime、Fukunaga Shuhei、Hikihara Takashi
- Organizer
  2023 25th European Conference on Power Electronics and Applications
- Int'l Joint Research
- Data Source
  KAKENHI-PROJECT-23K26094
[Presentation] パワーモジュールに適用する絶縁用セラミックスの過渡熱抵抗に関する実験的検討2022
- Author(s)
  清水優人, 福永崇平, 舟木剛
- Organizer
  電気学会電子デバイス/半導体電力変換合同研究会
- Data Source
  KAKENHI-PROJECT-22K14239

1. 引原隆士 (70198985)

# of Collaborated Projects: 1 results

# of Collaborated Products: 2 results
2. 持山志宇 (20867866)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results
3. 高山創 (30981063)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
4. 新谷道広 (80748913)

# of Collaborated Projects: 1 results

# of Collaborated Products: 0 results

Fukunaga Shuhei 福永 崇平

Research Projects

Research Products

Co-Researchers

30年後も安心して使える高信頼SiCパワーモジュールの最適構造設計法の創出Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of fast self regulating digital active gate driver for SiC MOSFET

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Thermal Design Evaluation Technology for Next-Generation SiC Power Modules for Power Electronics InnovationPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

[Journal Article] Analysis of errors in junction temperature estimated by temperature-sensitive electrical parameter for parallel-connected SBDs2025

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Evaluation of Electrical Model Parameter Changes in SiC Power MOSFETs During Power Cycling Test2024

Author(s)

Journal Title

DOI

ISSN

Year and Date

Language

Data Source

[Journal Article] Digital-Twin-Compatible Optimization of Switching Characteristics for SiC MOSFETs Using Genetic Algorithm2023

Author(s)

Journal Title

DOI

Data Source

[Presentation] Power variation analysis during transient thermal measurement of semiconductor packages2025

Author(s)

Organizer

Data Source

[Presentation] Comparative study on transient thermal resistance for β-Ga2O3 SBDs with junction-side cooling implementation2025

Author(s)

Organizer

Data Source

[Presentation] 昇圧回路の動特性を改善するアクティブゲート駆動回路の実装方法の検討2024

Author(s)

Organizer

Data Source

[Presentation] 金属放熱基板を用いたSiCパワーモジュールの過渡熱抵抗の実験的評価2024

Author(s)

Organizer

Data Source

[Presentation] ベイズ情報量規準に基づくパワーモジュールの熱応答モデル化に関する一検討2024

Author(s)

Organizer

Data Source

[Presentation] Development of high-speed current switch box for transient thermal characterization of SiC power modules2024

Author(s)

Organizer

Data Source

[Presentation] Analysis of errors in junction temperature estimated by temperature-sensitive electrical parameter for parallel-connected power devices2024

Author(s)

Organizer

Data Source

[Presentation] パワーデバイスの温度係数を利用したマルチチップパワーモジュールの過渡熱回路モデル誤差に関する一検討2024

Author(s)

Organizer

Data Source

[Presentation] Evaluation of phase measurement error in digital oscilloscopes2024

Author(s)

Organizer

Data Source

[Presentation] SiCパワーデバイスのための過渡熱抵抗測定システムの開発2024

Author(s)

Organizer

Data Source

Fukunaga Shuhei 福永崇平