Ohguchi Ken-ichi 大口健一

… Alternative Names

大口健一オオグチケンイチ

OHGUCHI Ken-ichi 大口健一

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Researcher Number	30292361
Other IDs
External Links
Affiliation (Current)	2025: 秋田大学, 理工学研究科, 教授
Affiliation (based on the past Project Information) *help	2024: 秋田大学, 理工学研究科, 教授 2018 – 2020: 秋田大学, 理工学研究科, 教授 2016: 秋田大学, 理工学研究科, 教授 2015: 秋田大学, 工学(系)研究科(研究院), 教授 2014: 秋田大学, 工学(系)研究科(研究院), 准教授 … More 2012: 秋田大学, 工学(系)研究科(研究院), 准教授 2012: 秋田大学, 工学資源学研究科, 准教授 2011: 秋田大学, 大学院・工学資源学研究科, 准教授 2010: 秋田大学, 工学資源学研究科, 准教授 2007 – 2008: Akita University, 工学資源学部, 准教授 1999 – 2004: 秋田大学, 工学資源学部, 助手 Less
Review Section/Research Field	Principal Investigator Materials/Mechanics of materials / Basic Section 18010:Mechanics of materials and materials-related / Materials/Mechanics of materials
Keywords	Principal Investigator クリープ / 応力緩和 / 鉛フリーはんだ / FEA / Cu/Sn系金属間化合物 / インデンテーション / 疲労 / 引張・圧縮繰返し負荷 / 非弾性構成モデル / 塑性・クリープ分離法 … More / 構成モデル / 粘塑性変形 / 疲労寿命評価 / 非弾性構成則 / 変形・疲労特性 / 銅－スズTLP接合 / 金属間化合物 / 微細はんだ接合法 / せん断試験 / 銅－はんだ接合体 / 疲労寿命 / 非弾性変形 / 初晶Sn / 有限要素解析 / 引張特性 / 初晶スズ / 微小はんだ試験片 / 高加速寿命試験(HALT) / 高加速寿命試験（HALT） / 微細はんだ接続部 / ラチェット / 超加速限界試験(HALT) / はんだ接続部 / 電子実装基板 / 粘塑性 / 荷重緩和曲線 / ラチェット変形 / 弾・塑性・クリープ構成モデル / 電解めっき銅箔 / 連続体力学 / 破面観察 / 応力-弾塑性ひずみ曲線 / 粒界すべり / すべり変形 / 圧子押込試験 / 微視的変形 / クリープ構成則 / 塑性・クリープ / Zn系鉛フリーはんだ / Bi系鉛フリーはんだ / Ag系鉛フリーはんだ / Sn / 環境調和型電子パッケージ / ひずみ範囲分割 / 低サイクル疲労 / 有限要素法 / 弾塑性クリープ解析 / 粘塑性構成モデル / Sn-3.5Ag-0.75Cuはんだ / 電子パッケージ Less

Reliability improvement of bonded joint using energy-saving copper-tin TLP technique by constitutive modeling for its time-dependent change in strengthPrincipal Investigator
- Principal Investigator
  
  大口健一
- Project Period (FY)
  2024 – 2026
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Akita University
Development of Microsoldering Method Based on High Accuracy FEA Regarding Primary Tin Crystal and Intermetallic Compounds as Structural MembersPrincipal Investigator
- Principal Investigator
  
  Ohguchi Ken-ichi
- Project Period (FY)
  2018 – 2020
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Review Section
  
  Basic Section 18010:Mechanics of materials and materials-related
- Research Institution
  Akita University
Development of HALT Method for Assuring Strength Reliability of Micro Solder Joint Based on Analysis of Creep and Ratchetting BehaviorPrincipal Investigator
- Principal Investigator
  
  Ohguchi Ken-ichi
- Project Period (FY)
  2014 – 2016
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University
Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation BehaviorPrincipal Investigator
- Principal Investigator
  
  OHGUCHI Ken-ichi
- Project Period (FY)
  2010 – 2012
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University
ELASTO-PLASTIC-CREEP CHARACTERISTICS OF ELECTROPLATED COPPER FOIL AND ITS ESTIMATION BY STEPPED MICRO INDENTATIONPrincipal Investigator
- Principal Investigator
  
  OHGUCHI Ken-ichi
- Project Period (FY)
  2007 – 2008
- Research Category
  
  Grant-in-Aid for Scientific Research (C)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University
塑性・クリープ分離法による環境調和型電子実装基板の最適構造設計シミュレーションPrincipal Investigator
- Principal Investigator
  
  大口健一
- Project Period (FY)
  2003 – 2004
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University
環境調和型電子デバイス実装基板のサブマイクロメカニクスに関する研究Principal Investigator
- Principal Investigator
  
  大口健一
- Project Period (FY)
  2001 – 2002
- Research Category
  
  Grant-in-Aid for Young Scientists (B)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University
鉛フリーはんだによる環境調和型電子パッケージの最適構造設計に関する研究Principal Investigator
- Principal Investigator
  
  大口健一
- Project Period (FY)
  1999 – 2000
- Research Category
  
  Grant-in-Aid for Encouragement of Young Scientists (A)
- Research Field
  
  Materials/Mechanics of materials
- Research Institution
  Akita University

All 2020 2019 2018 2016 2015 2013 2012 2009 2008 2007 2004 Other

All Journal Article Presentation

[Journal Article] Evaluation of material nonlinearity of Cu/Sn IMCs based on FEA of shear test using copper-solder joints2020
- Author(s)
  黒沢憲吾, 大口健一, 福地孝平, 瀧田敦子
- Journal Title
  
  QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
  
  Volume: 38 Issue: 4 Pages: 429-437
- DOI
  10.2207/qjjws.38.429
- NAID
  130007966329
- ISSN
  0288-4771, 2434-8252
- Language
  Japanese
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-18K03831
[Journal Article] Biaxial Ratchetting Deformation of Solders Considering Halt Conditions2016
- Author(s)
  Y. Tomizawa, T. Suzuki, K. Sasaki, K. Ohguchi and D. Echizenya
- Journal Title
  
  Key Engineering Materials
  
  Volume: 725 Pages: 299-304
- DOI
  10.4028/www.scientific.net/kem.725.299
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-26420005
[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009
- Author(s)
  K. OHGUCHI, K. SASAKI and Setsuo Aso
- Journal Title
  
  Transactions of ASME, Journal of Electronic Packaging Vol.131
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560071
[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009
- Author(s)
  K. OHGUCHI, K. SASAKI and S. Aso
- Journal Title
  
  Transactions of ASME, Journal of Electronic Packaging 131(印刷中)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560071
[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007
- Author(s)
  K. OHGUCHI, K. SASAKI and Setsuo Aso
- Journal Title
  
  Proceedings of InterPACK'07 IPACK2007
  
  Pages: 33663-33663
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560071
[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007
- Author(s)
  K. OHGUCHI, K. SASAKI and S. Aso
- Journal Title
  
  Proceedings of InterPACK'07 (CD-ROM)
- Peer Reviewed
- Data Source
  KAKENHI-PROJECT-19560071
[Journal Article] 鉛フリーはんだの弾塑性クリープ構成式におけるクリープ成分記述の検討2004
- Author(s)
  大口健一, 佐々木克彦, 石橋正博
- Journal Title
  
  日本機械学会第17回計算力学講演会講演論文集 No.04-40
  
  Pages: 785-786
- Data Source
  KAKENHI-PROJECT-15760051
[Journal Article] Plasticity-Creep Separation Method for Viscoplastic Deformation of Lead-free Solders2004
- Author(s)
  OHGUCHI, K., SASAKI, K., ISHIBASHI, M., HOSHINO, H.
- Journal Title
  
  JSME International Journal Ser.A. Vol.47 No.3
  
  Pages: 371-379
- NAID
  110004820499
- Data Source
  KAKENHI-PROJECT-15760051
[Journal Article] 粘塑性構成モデルによる鉛フリーはんだの変形シミュレーション2004
- Author(s)
  大口健一
- Journal Title
  
  電子情報通信学会技術研究報告 Vol.104 No.74
  
  Pages: 1-8
- NAID
  110003293065
- Data Source
  KAKENHI-PROJECT-15760051
[Presentation] 微小 SAC はんだ試験片の疲労寿命に対する初晶 Sn の分布形態の影響2020
- Author(s)
  菅絢一郎，大口健一，福地孝平，黒沢憲吾
- Organizer
  日本機械学会2020年度年次大会
- Data Source
  KAKENHI-PROJECT-18K03831
[Presentation] 引張強さにばらつきを示す微小SAC はんだ試験片内部における初晶Sn の形状と分布形態2019
- Author(s)
  菅絢一郎，大口健一，福地孝平，黒沢憲吾
- Organizer
  日本機械学会 2019年度年次大会
- Data Source
  KAKENHI-PROJECT-18K03831
[Presentation] 微小SACはんだの引張強さに対する初晶Snの形状と分布形態の影響2019
- Author(s)
  大口健一，菅絢一郎，福地孝平，黒沢憲吾，瀧田敦子
- Organizer
  日本機械学会M&M2019材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-18K03831
[Presentation] 銅－はんだ接合体のせん断試験FEAによるCu/Sn系IMCsの材料非線形性の検証2018
- Author(s)
  黒沢憲吾，大口健一，福地孝平，瀧田敦子
- Organizer
  日本機械学会　M&M2018　材料力学カンファレンス
- Data Source
  KAKENHI-PROJECT-18K03831
[Presentation] 引張強さにばらつきを示す微小SACはんだ試験片の初晶Snの形状と分布形態2016
- Author(s)
  大口健一，石澤裕也，黒沢憲吾，荒川明
- Organizer
  M&M2016材料力学カンファレンス
- Place of Presentation
  神戸大学
- Year and Date
  2016-10-08
- Data Source
  KAKENHI-PROJECT-26420005
[Presentation] ラップジョイント試験片を用いたSAC はんだ接合部IMCs 層の塑性変形能の評価2016
- Author(s)
  黒沢憲吾，大口健一
- Organizer
  2016 年度日本機械学会年次大会
- Place of Presentation
  九州大学
- Year and Date
  2016-09-12
- Data Source
  KAKENHI-PROJECT-26420005
[Presentation] 微小複合材料型はんだ試験片を用いたCu/Sn 系IMCs の引張特性評価2015
- Author(s)
  大口健一，黒沢憲吾
- Organizer
  M&M2015 材料力学カンファレンス
- Place of Presentation
  慶應義塾大学
- Year and Date
  2015-11-21
- Data Source
  KAKENHI-PROJECT-26420005
[Presentation] 銅－はんだ接合体のせん断試験FEAによるCu/Sn系IMCsの材料非線形の評価2015
- Author(s)
  大口健一，黒沢憲吾，石澤裕也
- Organizer
  日本機械学会2015年度年次大会
- Place of Presentation
  北海道大学
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-26420005
[Presentation] 応力変動によるSACはんだのクリープひずみ硬化回復挙動2015
- Author(s)
  名取拓也，大口健一
- Organizer
  日本機械学会2015年度年次大会
- Place of Presentation
  北海道大学
- Year and Date
  2015-09-13
- Data Source
  KAKENHI-PROJECT-26420005
[Presentation] A New Reference Area for Indentation Creep Tests to Obtain Real Steady Creep Strain of Solder Alloy2013
- Author(s)
  Atsuko Takita, Katsuhiko Sasaki, and Ken-ichi Ohguchi
- Organizer
  International Conference on Electronics Packaging 2013
- Place of Presentation
  Osaka International Convention Center
- Year and Date
  2013-04-12
- Data Source
  KAKENHI-PROJECT-22560070
[Presentation] 圧子押込み・深さ保持によるはんだのクリープ特性評価法の提案2012
- Author(s)
  瀧田敦子、大口健一、佐々木克彦
- Organizer
  日本機械学会2012 年度年次大会
- Place of Presentation
  金沢大学
- Year and Date
  2012-09-10
- Data Source
  KAKENHI-PROJECT-22560070
[Presentation] 圧子押込み・深さ保持によるはんだのクリープ特性評価法の提案2012
- Author(s)
  瀧田敦子・大口健一・佐々木克彦
- Organizer
  日本機械学会2012年度年次大会
- Place of Presentation
  金沢大学
- Data Source
  KAKENHI-PROJECT-22560070
[Presentation] ラチェット変形による電解めっき銅箔の疲労2008
- Author(s)
  三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
- Organizer
  日本機会学会M & M2008材料力学カンファレンス
- Place of Presentation
  立命館大学
- Year and Date
  2008-09-16
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] ラチェット変形による電解めっき銅箔の疲労2008
- Author(s)
  三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
- Organizer
  日本機会学会M&M2008材料力学カンファレンス
- Place of Presentation
  立命館大学
- Year and Date
  2008-09-16
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] 繰返し階段負荷によるSn-3.0Ag-0.5Cu材の塑性・クリープひずみ解析2008
- Author(s)
  大口健一, 麻生節夫, 佐々木克彦
- Organizer
  日本金属学会2008年秋季(第143回)大会
- Place of Presentation
  熊本大学
- Year and Date
  2008-09-25
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] Sn-3.0Ag-0.5Cu材の低サイクル疲労過程におけるクリープひずみ成分の定量化2008
- Author(s)
  大口健一, 佐々木克彦, 麻生節夫
- Organizer
  日本機械学会2008年度年次大会
- Place of Presentation
  横浜国立大学
- Year and Date
  2008-08-06
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] 電解めっき銅箔の非弾性変形におけるクリープ変形の効果2008
- Author(s)
  三浦裕太, 大口健一, 多田英司, 井口裕, 八木輝明
- Organizer
  日本機械学会2008年度年次大会
- Place of Presentation
  横浜国立大学
- Year and Date
  2008-08-04
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007
- Author(s)
  K. OHGUCHI, K. SASAKI and S. Aso
- Organizer
  InterPACK'07
- Place of Presentation
  Vancouver, Canada
- Year and Date
  2007-07-11
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] Evaluation of Time-Independent and Time -Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007
- Author(s)
  K. OHGUCHI, K. SASAKI and Setsuo Aso
- Organizer
  InterPACK'07
- Place of Presentation
  Vancouver, Canada
- Year and Date
  2007-07-11
- Data Source
  KAKENHI-PROJECT-19560071
[Presentation] Tensile Characteristics of Cu/Sn IMCs Estimated by Using Miniature Composite Solder Specimen
- Author(s)
  K. Ohguchi and K. Kurosawa
- Organizer
  Asian-Pacific Conference on Fracture and Strength 2014, APCFS 2014
- Place of Presentation
  Ｓｙｄｎｅｙ
- Year and Date
  2014-12-09 – 2014-12-12
- Data Source
  KAKENHI-PROJECT-26420005

1. EIJI Eiji (40302260)

# of Collaborated Projects: 1 results

# of Collaborated Products: 3 results
2. 福地孝平 (40707121)

# of Collaborated Projects: 1 results

# of Collaborated Products: 4 results

Ohguchi Ken-ichi 大口 健一

大口 健一 オオグチ ケンイチ

OHGUCHI Ken-ichi 大口 健一

Research Projects

Research Products

Co-Researchers

Reliability improvement of bonded joint using energy-saving copper-tin TLP technique by constitutive modeling for its time-dependent change in strengthPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of Microsoldering Method Based on High Accuracy FEA Regarding Primary Tin Crystal and Intermetallic Compounds as Structural MembersPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Review Section

Research Institution

Development of HALT Method for Assuring Strength Reliability of Micro Solder Joint Based on Analysis of Creep and Ratchetting BehaviorPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

Improvement of Indentation Creep Method for Electronic Packages by Monitoring Stress Relaxation BehaviorPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

ELASTO-PLASTIC-CREEP CHARACTERISTICS OF ELECTROPLATED COPPER FOIL AND ITS ESTIMATION BY STEPPED MICRO INDENTATIONPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

塑性・クリープ分離法による環境調和型電子実装基板の最適構造設計シミュレーションPrincipal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

環境調和型電子デバイス実装基板のサブマイクロメカニクスに関する研究Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

鉛フリーはんだによる環境調和型電子パッケージの最適構造設計に関する研究Principal Investigator

Principal Investigator

Project Period (FY)

Research Category

Research Field

Research Institution

[Journal Article] Evaluation of material nonlinearity of Cu/Sn IMCs based on FEA of shear test using copper-solder joints2020

Author(s)

Journal Title

DOI

NAID

ISSN

Language

Data Source

[Journal Article] Biaxial Ratchetting Deformation of Solders Considering Halt Conditions2016

Author(s)

Journal Title

DOI

Data Source

[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009

Author(s)

Journal Title

Data Source

[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2009

Author(s)

Journal Title

Data Source

[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

Author(s)

Journal Title

Data Source

[Journal Article] Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test2007

Ohguchi Ken-ichi 大口健一

大口健一オオグチケンイチ

OHGUCHI Ken-ichi 大口健一